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This communication reports on the fabrication of low operating voltage pentacene thin-film transistors with high-k gate dielectrics by ion beam assisted deposition (IBAD). These densely packed dielectric layers by IBAD show a much lower level of leakage current than those created by e-beam evaporation. These results, from the fact that those thin films deposited with low adatom mobility, have an open structure, consisting of spherical grains with pores in between, that acts as a significant path for leakage current. By contrast, our results demonstrate the potential to limit this leakage. The field effect mobility, on/off current ratio, and subthreshold slope obtained from pentacene thin-film transistors (TFTs) were 1.14 cm2/V s, 105, and 0.41 V/dec, respectively. Thus, the high-k gate dielectrics obtained by IBAD show promise in realizing low leakage current, low voltage, and high mobility pentacene TFTs. [ABSTRACT FROM AUTHOR]

Pentacene organic thin film transistors (OTFTs) with low-k and high-k hybrid gate dielectrics by CF4 plasma treatment exhibited excellent device performance with field effect mobilities (maximum 1.41 cm2/V s), a low threshold voltage of +1 V, and on/off current ratios of 105 at -5 V gate bias. After CF4 plasma treatment, fluorine atoms diffuse into the interior low-k polymer and eliminate ionic impurities which reduce the leakage current density and overall pentacene initial growth on the superhydrophobic surface is significantly improved. It seems apparent that proper surface treatment is desirable for higher quality pentacene film and improving the performance of OTFTs. [ABSTRACT FROM AUTHOR]