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1. Polymers in electronics packaging

Author

Manzione, Louis T. and Lando, David J.

Subjects
Integrated Circuit Fabrication, Technology, Microelectronics, Chip Packaging, Packaging Density, New Technique, Research and Development, Manufacturers, User Need, Miniaturization, Performance Improvement, AT&T Corp. AT&T Microelectronics Div. -- Research
Published
1990

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