1. X-Ray Photoelectron Spectroscopy Estimation of Cobalt Seed Layer Reactivity Toward Air Exposure: A Challenge?
- Author
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Amine Lakhdari, Vincent Mevellec, Arnaud Etcheberry, Mikailou Thiam, Dominique Suhr, Nathalie Simon, Anne-Marie Goncalves, Frédéric Raynal, Louis Caillard, Mathieu Frégnaux, Institut Lavoisier de Versailles (ILV), Université de Versailles Saint-Quentin-en-Yvelines (UVSQ)-Institut de Chimie du CNRS (INC)-Centre National de la Recherche Scientifique (CNRS), This work is supported by a CIFRE thesis grant., and Misra D.Chen Z.Ko D.-K.Obeng Y.Bauza D.Chikyow T.
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Materials science ,05 social sciences ,Inorganic chemistry ,Oxide ,chemistry.chemical_element ,[SPI.MAT]Engineering Sciences [physics]/Materials ,Metal ,chemistry.chemical_compound ,chemistry ,X-ray photoelectron spectroscopy ,Plating ,visual_art ,0502 economics and business ,visual_art.visual_art_medium ,050207 economics ,Electroplating ,Cobalt ,Layer (electronics) ,Dissolution - Abstract
For the last several generations of CMOS technology, copper has been used widely as an interconnect material in the back end of the line (BEOL). [1] [2] [3] As the current nodes technology are decreasing continuously, several copper scaling challenges appeared such as the Cu barrier thinning, the copper electromigration... [4] [5] Hence, cobalt and ruthenium are proposed as replacement materials. Recently, Co has made inroads in microelectronics, specifically on-chip metallization, serving as a capping layer for Cu to diminish electromigration but also provide a better conductivity for line width inferior to 10 nm [6] [7] [8]. In this very challenging context, the control of Co surface oxidation process is strategic. Conformal Co seed characteristics (i.e electronic conductivity), preceding the following filling chemistry, are partially related to its surface oxide. Its understanding, then its control, will be determinant to access to a perfect and reliable filling of the nodes. To collect quantitative information, we carefully investigate the behavior of a pure Co metallic surface which is exposed to air oxidation. For this purpose, we have used a 400nm thick Co layer electrochemically plated using Kari© aveni acidic chemistry. The Co layer is electrochemically deposited on Co seed (3nm) /Ta/TaN barrier/Tetraethyl orthosilicate (TEOS). The latter, with its native oxide, is introduced in ultra-high vacuum (UHV) of a XPS Nexsa ThermoFisher spectrometer. Then, a totally deoxidized Co surface is obtained with a argon beam sputtering. The initial free oxide bulk metallic Co is then checked by XPS. Starting from this surface, we explore again by XPS, consequences of different air exposure times using the entrance prepation chamber of the spectrometer. According to the time air-exposure, the kinetic of the oxide growth mechanism can be evaluated. Our work shows clearly that the metallic Co surface evolves very quickly to an ultra-thin ( Moreover, a simulation of behaviors of this oxide surface coverage immersed in acidic solution will be proposed to understand how an ultra-thin Co seed layer interacts in Co filling solution. For both cases (air-exposure and cobalt filling solution) the results comparison and a discussion will be proposed . References [1] D. Edelstein et all"IEEE IEDM Tech. Digest," p. 773, 1997. [2] S. Venkatesan et all "In Electron Devices Meeting," p. 769, 1997. [3] S. Tyagi, et all, "In Electron Devices Meeting,," p. 567, 2000. [4] H.-J. Cho, et all "VLSI Technology, IEEE Symposium," p. 1, 2016. [5] S. Y. Wu et all "Electron Devices Meeting (IEDM)," p. 2, 2016. [6] V. P. Graciano et all Journal of The Electrochemical Society, vol. 166, p. 3246, 2019. [7] J. H.-C. Chen et all 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC);," p. 12, 2016. [8] C. Adelmann et all "Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC);," p. 173, 2014. Figure 1
- Published
- 2020
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