Search

The ultra-wide bandgap semiconductor gallium oxide (Ga2O3) offers substantial promise to significantly advance power electronic devices as a result of its high breakdown electric field and maturing substrate technology. A key remaining challenge is the ability to grow electronic-grade epitaxial layers at rates consistent with 20–40 μm thick drift regions needed for 20 kV and above technologies. This work reports on extensive characterization of epitaxial layers grown in a novel metalorganic chemical vapor deposition tool that permits growth rates of 1.0–4.0 μm h−1. Specifically, optical, structural and electrical properties of epilayers grown at ∼1 μm h−1 are reported, including employment in an operating MOSFET. The films demonstrate relatively smooth surfaces with a high degree of structural order, limited point defectivity (Nd − Na ≈ 5 × 1015 cm−3) and an optical bandgap of 4.50 eV. Further, when employed in a MOSFET test structure with an n+ doped channel, a record high mobility for a transistor structure with a doped channel of 170 cm2 V−1 s−1 was measured via the Hall technique at room temperature. This work reports for the first time a β-Ga2O3 MOSFET grown using Agnitron Technology's high growth rate MOCVD homoepitaxial process. These results clearly establish a significant improvement in epilayer quality at growth rates that can support future high voltage power device technologies. [ABSTRACT FROM AUTHOR]

The temperature dependent photoresponse of planar photodetectors fabricated on β-Ga2O3 films grown on Al2O3 by metalorganic chemical vapor deposition to 254 nm wavelength, and blindnessto 365 nm light, are reported over the range of 25-350 °C. Ohmic contacts were formed by Siimplantationand annealing at 900 °C, followed by deposition of Ti/Au metallization. The photocurrentinduced by 254 nm illumination increased monotonically with temperature, from 2.5 ~10-7A at 25°C to ~2.2 ~10-6 A at 350 °C at a fixed 254 nm light intensity of 760 μW/cm². The photosensitivitydecreases at high temperatures in many photoconductors (thermal quenching), in sharpcontrast to the photosensitivity increase with high temperatures in this study. This is ascribed to thepresence of states in the gap of Ga²O³, whose presence was proven by exposure to below band-gapenergy. In this case, the current still increased due to the presence of defect levels in the band gapand the generation of photocurrent is due to a transition between the valence or conduction bandand impurity or defect levels within the band gap. The temperature dependent photo-to-dark currentratio for this wavelength was 328 at room temperature and decreased to ~9 at 350 °C. The responsivityincreased from 5 to 36 A/W over this temperature range, with corresponding external quantumefficiencies of 2.5 ~ 10³% at 25°C and 1.75 ~ 104% at 350 °C. Similarly large numbersreported for Ga2O3 photodetectors have previously been ascribed to carrier multiplication effects. [ABSTRACT FROM AUTHOR]

A novel device structure incorporating an ultrathin AIGaN barrier layer capped by an AIN layer in the source-drain access regions has been implemented to reliably control threshold voltage in AIGaN/GaN high-electron-mobility transistors. A recessed-gate structure has been used to decrease 2-D electron gas (2DEG) density under the gate, thus controlling threshold voltage while maintaining low on-resistance and high current density. The structure presented in this letter implements an ultrathin AIGaN structure grown by metal-organic chemical vapor deposition capped with AIN to maintain a high 2DEG density in the access regions. A selective wet etch using heated photoresist developer is used to selectively etch the AIN layer in the gate region to the AIGaN barrier. We have demonstrated a repeatable threshold voltage of +0.21 V with 4-nim AIGaN barrier layer thickness. [ABSTRACT FROM AUTHOR]