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Beam self-imaging in nonlinear graded-index multimode optical fibers is of interest for many applications, such as implementing a fast saturable absorber mechanism in fiber lasers via multimode interference. We obtain a new exact solution for the nonlinear evolution of first and second order moments of a laser beam of arbitrary transverse shape carried by a graded-index multimode fiber. We have experimentally directly visualized the longitudinal evolution of beam self-imaging by means of femtosecond laser pulse propagation in both the anomalous and the normal dispersion regime of a standard telecom graded-index multimode optical fiber. Light scattering out of the fiber core via visible photo-luminescence emission permits us to directly measure the self-imaging period and the beam dynamics. Spatial shift and splitting of the self-imaging process under the action of self-focusing are also revealed. Funding Agencies|European Research Council (740355); Agence Nationale de la Recherche (ANR-18-CE080016-01); CILAS Company (ArianeGroup); Vetenskapsrådet (2017-05309); Russian Ministry of Science and Education (14.Y26.31.0017)

We study nonlinear self-imaging dynamics in graded-index multimode optical fibers. Side-scattering of light that accompanies the propagation of intense femtosecond pulses permits us to directly measure the self-imaging period.

Micro Electro Mechanical Systems (MEMS)-Technology based micro mechanisms usually operate within a protected or encapsulated space and, before that, they are fabricated and analyzed within one Scanning Electron Microscope (SEM) vacuum specimen chamber. However, a surgical scenario is much more aggressive and requires several higher abilities in the microsystem, such as the capability of operating within a liquid or wet environment, accuracy, reliability and sophisticated packaging. Unfortunately, testing and characterizing MEMS experimentally without fundamental support of a SEM is rather challenging. This paper shows that in spite of large difficulties due to well-known physical limits, the optical microscope is still able to play an important role in MEMS characterization at room conditions. This outcome is supported by the statistical analysis of two series of measurements, obtained by a light trinocular microscope and a profilometer, respectively.

Although tissue and cell manipulation nowadays is a common task in biomedical analysis, there are still many different ways to accomplish it, most of which are still not sufficiently general, inexpensive, accurate, efficient or effective. Several problems arise both for in vivo or in vitro analysis, such as the maximum overall size of the device and the gripper jaws (like in minimally-invasive open biopsy) or very limited manipulating capability, degrees of freedom or dexterity (like in tissues or cell-handling operations). This paper presents a new approach to tissue and cell manipulation, which employs a conceptually new conjugate surfaces flexure hinge (CSFH) silicon MEMS-based technology micro-gripper that solves most of the above-mentioned problems. The article describes all of the phases of the development, including topology conception, structural design, simulation, construction, actuation testing and in vitro observation. The latter phase deals with the assessment of the function capability, which consists of taking a series of in vitro images by optical microscopy. They offer a direct morphological comparison between the gripper and a variety of tissues.

This paper presents a new concept flexure hinge for MEMS applications and reveals how to design, construct, and experimentally test. This hinge combines a curved beam, as a flexible element, and a pair of conjugate surfaces, whose contact depends on load conditions. The geometry is conceived in such a way that minimum stress conditions are maintained within the flexible beam. A comparison of the new design with the other kind of revolute and flexible joints is presented. Then, the static behavior of the hinge is analyzed by means of a theoretical approach, based on continuum mechanics, and the results are compared to those obtained by means of finite element analysis (FEA) simulation. A silicon hinge prototype is also presented and the construction process, based on single step lithography and reactive ion etching (RIE) technology, is discussed. Finally, a crucial in–SEM experiment is performed and the experimental results are interpreted through the theoretical models.

This paper describes the design, simulation, construction process and experimental analysis of a microgripper, which makes use of a new concept hinge, called CSFH (Conjugate Surfaces Flexure Hinge). The new hinge combines a curved cantilever beam, as flexible element, and a pair of conjugate surfaces, whose contacts depend on load conditions. CSFH hinges improve accuracy and guarantee that minimum stress conditions hold within the flexible beam. This microgripper is designed for Deep Reactive-Ion Etching (D-RIE) construction process and comb-drive actuation. Theoretical basis and Finite Element Analysis (FEA) simulations have been employed in order to predict the feasibility of the device under construction. Finally, some experimental evidence of the construction process has been provided.

A new selective processing technique based on a confined dynamic liquid drop\meniscus is presented. This approach is represented by the localized wet treatment of silicon wafers using dynamic liquid drop that while is in contact with the wafer forms a dynamic liquid meniscus. The main scientific innovation and relevance introduced by this work have been applied to industrial solar cell production and on silicon wafer metal bumps formation for the IC interconnection (i.e. copper pillars). Such new technique allows to touch in specific defined positions the silicon wafer in order to perform any kind of wet processing (e.g. etching, cleaning and/or plating) without the need of any protective resist. To investigate on pendant dynamic liquid drops and dynamic liquid meniscus use of computational fluid dynamic technique (i.e. numerical techniques to accurately predict fluid flows) was followed and is presented. An experimental setup has been built to validate the calculations. Numerical results showed a good agreement with experimental ones. Prototypes heads, using stereo-lithography systems, were developed and localized selective plating without the need of lithography step was performed on silicon.

The need of micromanipulation devices has been growing rapidly during the last decades, specially in the fields of Biology and Micro-Assembly, and many solutions have been proposed to cope with the increasing demand. The present paper suggests a possible way to micromanipulating objects in various conditions, adopting MEMS technologies to develop a microgripper based on a new flexural hinge, recently patented by the Authors. The micromechanism has been modified considering results obtained through FEA. Finally, a brief description of the construction process is provided, together with some experimental activities.

A new selective processing technique based on a confined dynamic liquid drop\meniscus is presented. This approach is based on localized wet treatment of silicon wafers using confined and dynamic liquid drop that while in contact with the wafer forms a dynamic liquid meniscus. Such new technique allows to touch in specific defined positions the silicon wafer (front and/or back) in order to perform any kind of wet processing without the need of protective photo-resist. The new selective processing technique allows the metallizations (front and back) of mono and multi crystalline silicon solar cells. The front grid contacts are obtained by locally etching the silicon nitride, forming in a thin layer of meso-porous silicon and totally filling the meso-porous layer by pulse reverse plating a Nickel film. Copper and Tin are then electroplated using the same selective processing. This technology provides an effective solution to avoid silver pastes for front contact grid, as it guarantees low specific contact resistivity (550 μΩcm2 on a 75 Ω/□ n-type doped emitter) and good adhesion to the silicon substrate (i.e. greater than 550 g/mm). The Al back side of the solar cell are also treated by the new selective process. Tin is directly deposited on Aluminum back contact showing adhesion higher than silver on silicon (i.e. > 1N/mm). © 2013 The Authors.

In this work it is described an high-density contacting technology that can replace wire bonding in power electronic applications, to overcome known limitation of bond wires liftoff occurring after several power cycles due to the difference in the coefficient of thermal expansion of silicon and aluminum. In the presented technology, MEMS (micro-electro-mechanics systems) micro-fabrication processes are used to realize contact structures that, pressed against the silicon dice, provide a reliable compliant contact. One advantage of this technology is that the contacts can be hosted on a printed circuit board that integrates the control circuitry for the power devices. This will reduce the footprint of power systems, like Integrated High Power Modules (IHPM). Reduced footprints are beneficial in applications where space is a concern, like the automotive industry. The description of the technological steps for building the contacting assembly is reported together with process conditions and electrical performances of two test structures.

In this paper, the performance of compliant parallel manipulators, in a given working position, is evaluated in terms of the MA (mechanical advantage) and k(J) (kinematic condition number). Such evaluation is done by means of a new and fast method for direct kinematic analysis of parallel manipulators. The method, which is useful to enhance both the design synthesis and the control strategy, is applied on the so called pseudo-rigid body mechanism, which represents a simplification of its corresponding compliant mechanism. Computer codes have been developed in MatLab programming language. The case under study consists of a MEMS (Micro Electro Mechanical System) compliant robot that has been built by the research group in silicon for micromanipulation. Such MEMS robot could be designed thanks to a new flexural hinge concept. Some experimental tests have been carried out on sample prototypes in order to inquire about the real feasibility of the micro-robot.Copyright © 2012 by ASME

Most power electronic modules are specifically designed for the customer and this entails intense labour during the production phase. The monolithic integration for power electronic devices in the form of power IC has not proven to be efficient, neither from a technical, nor from an economic point of view. In a typical high power module the power devices are assembled on a heatsink and, driver, sensor and protection circuits are mounted on separate PCBs assembled to the power devices. This results in low performance and high cost. Higher integrated power modules are produced assembling power devices in die format onto a DCB (Direct Copper Bonding) substrate and interconnect them by wire bonding technique [1]. The relative driver, sensor and protection circuits are surface mounted on a separate PCB assembled with the former.

Microrobots are used nowadays in several fields of application, specially in mini invasive surgery. However, they are rather difficult to be constructed, and the traditional micro machining tools are not adequate yet to built the smaller parts. The construction of the microrobots is even harder if more than one D.O.F. are required for the mechanism, because these systems are more complicated. This paper deals with the development of a 3 D.O.F. planar micro platform with remote system of actuation. The new approach of design and manufacturing is based on two innovative solutions: a) the adoption of the technologies used to built MEMS, Micro Electro Mechanical Systems; b) the introduction of new flexural hinge to develop compliant micro mechanisms. The new concept of flexural hinge is described in the paper, also from a theoretical point of view. Several example of possible structures are proposed and analyzed, together with their remote wire actuation systems. Finite Element Analysis (FEA) has been also adopted to analyze the system performance under small deformations. The principle of fabrication is, then, described. The process consists of a sequence of single steps which have allowed to achieved an overall maximum size down to 3–4 mm and the minimum thickness of the smaller components down to 50µm.