1. Light sources for high-volume manufacturing EUV lithography: technology, performance, and power scaling
- Author
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Mathew Abraham, Rob Rafac, Georgiy O. Vaschenko, Andrew LaForge, Bruno La Fontaine, Daniel J. Riggs, Yezheng Tao, Matthew J. Graham, Ted Taylor, M. Vargas, Michael Kats, Slava Rokitski, Alexander Schafgans, Igor V. Fomenkov, Daniel J. W. Brown, Silvia De Dea, David C. Brandt, Michael Purvis, Alex I. Ershov, Steven Chang, and Jayson Stewart
- Subjects
010302 applied physics ,Materials science ,business.industry ,Extreme ultraviolet lithography ,02 engineering and technology ,021001 nanoscience & nanotechnology ,01 natural sciences ,Atomic and Molecular Physics, and Optics ,High volume manufacturing ,Electronic, Optical and Magnetic Materials ,0103 physical sciences ,Multiple patterning ,Optoelectronics ,X-ray lithography ,Laser power scaling ,0210 nano-technology ,business ,Instrumentation ,Lithography ,Next-generation lithography ,Immersion lithography - Abstract
Extreme ultraviolet (EUV) lithography is expected to succeed in 193-nm immersion multi-patterning technology for sub-10-nm critical layer patterning. In order to be successful, EUV lithography has to demonstrate that it can satisfy the industry requirements in the following critical areas: power, dose stability, etendue, spectral content, and lifetime. Currently, development of second-generation laser-produced plasma (LPP) light sources for the ASML’s NXE:3300B EUV scanner is complete, and first units are installed and operational at chipmaker customers. We describe different aspects and performance characteristics of the sources, dose stability results, power scaling, and availability data for EUV sources and also report new development results.
- Published
- 2017
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