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The network-on-chip (NoC) plays a crucial role in memory performance due to the fact that it can handle the majority of traffics from/to the DRAM memory controllers. However, there has been little work on the interplay between the NoC and memory controllers. In this article, we address a problem called network congestion-induced memory blocking and propose a novel memory controller, which performs memory access scheduling and network entry control in a network congestion-aware manner. In case of network congestion, in order to avoid performance degradation due to the blocking caused by data bound for congested regions in the NoC, the proposed memory controller favors requests and data associated with uncongested regions. In addition, in order to avoid the fairness problem of such a policy, we also propose a gradual method, which enables a trade-off between performance (in memory utilization) and fairness (in memory access latency). Experimental results show that the proposed method can offer up to 1.76 ∼ 2.99 times improvement in memory utilization in the latency-tolerant designs.

This paper describes the micromachined piezoelectric microspeakers that can produce the audible signal with 20 V peak-to-peak input voltages. The diaphragm size is 4 × 4 mm2 and the thickness of diaphragm is around 1 micron meter except partially etched piezoelectric area. The maximum sound output pressure of the microspeaker is even higher than ever before with a small diaphragm in high frequency range around 10 kHz. This successful result bases upon using high quality AlN thin film. The deposited AlN thin film shows c-axis oriented columnar structure and very fine grains. The highest SPL (Sound Pressure Level) measured from 300 Hz to 12 kHz shows about 100 dB around 10 kHz in case of circular type microspeaker and about 76 dB in case of cross type, respectively.

As DRAM faces scaling limit, several new memory technologies are considered as candidates for replacing or complementing DRAM main memory. Compared to DRAM, the new memories have two major differences, non-volatility and write overhead in terms of endurance, latency and power. We built two different FPGA-based evaluation boards to evaluate hardware and software designs for new-memory based main memory; one with a DRAM subsystem having parameterizable latency and non-volatility emulation, and the other with the real chips of new memory namely phase-change RAM (PRAM). We experimented primitive functions and SQLite-based benchmarks on Linux, verifying the workings of new functionalities, e.g., nonvolatility and evaluating the impacts of new memory on software performance. In our experiments, we also demonstrated the impact of new memory-aware software/hardware designs on program performance on a DRAM/PRAM hybrid memory.

Single-chip CPU/GPU architecture is being adopted in high-end (embedded) systems, e.g., smartphones and tablet PCs. Main memory subsystem is expected to consist of hybrid DRAM and phase-change RAM (PRAM) due to the difficulties in DRAM scaling. In this work, we address the performance optimization of the hybrid DRAM/PRAM main memory for single chip CPU/GPU. Based on the tight requirements of low latency from CPU and the relative tolerance to long latency from GPU, DRAM is first allocated to CPU while PRAM with longer write latency is allocated to GPU. Then, in order to improve the write performance of GPU traffic, we propose (1) an in-DRAM write buffer to accommodate GPU write traffics, (2) dynamic hot data management to improve the efficiency of write buffer, (3) runtime-adaptive adjustment of write buffer size to meet the given CPU performance bound, and (4) CPU-aware DRAM access scheduling to give low latency to CPU traffics. The experiments show that the proposed method gives 1.02~44.2 times performance improvement in GPU performance with modest (negligible) CPU performance overhead (when compute-intensive CPU programs run).

3D stacked DRAM improves peak memory performance. However, its effective performance is often limited by the constraints of row-to-row activation delay (tRRD), four active bank window (tFAW), etc. In this paper, we present a quantitative analysis of the performance impact of such constraints. In order to resolve the problem, we propose balancing the budget of DRAM row activation across DRAM channels. In the proposed method, an inter-memory controller coordinator receives the current demand of row activation from memory controllers and re-distributes the budget to the memory controllers in order to improve DRAM performance. Experimental results show that sharing the budget of row activation between memory channels can give average 4.72% improvement in the utilization of 3D stacked DRAM.

Network-on-chip and memory controller become correlated with each other in case of high network congestion since the network port of memory controller can be blocked due to the (back-propagated) network congestion. We call such a problem network congestion-induced memory blocking. In order to resolve the problem, we present a novel idea of network congestion-aware memory controller. Based on the global information of network congestion, the memory controller performs (1) congestion-aware memory access scheduling and (2) congestion-aware network entry control of read data. The experimental results obtained from a 5x5 tile architecture show that the proposed memory controller presents up to 18.9% improvement in memory utilization.