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Hybrid polymers constitute a class of optical materials combining properties of inorganic glass and organic polymers. The flexible synthesis and processing allows for specific tailoring of their properties as required for the fabrication of high-performance and reliable microoptical elements. While wafer-scale fabrication of microoptics using hybrid polymers is widely used in an industrial environment, they gain ever-increasing attention in additive manufacturing and 3D printing technologies. This chapter introduces the chemical concepts behind hybrid polymers, discusses their synthesis and processing, and gives a record on their application for the fabrication of microoptical and photonic elements using established wafer-scale as well as emerging additive manufacturing processes, in particular inkjet printing and two-photon polymerization direct laser writing.

Herein, we present the results of a systematic material development study we carried out in order to obtain a new positive tone resist for high resolution electron-beam lithography. Several acrylic copolymer materials with different mass fractions of the comonomers, different molecular weights and similar molecular weight distributions were synthesized and - as resist solutions - evaluated in terms of electron-beam lithography performance. On the one hand, within the ranges investigated, it was shown that the lithographic sensitivity is significantly influenced by the composition rather than by the molecular weight or molecular weight distribution. On the other hand, the etch resistance of the materials remains unaffected by changes of these parameters. The resist material exhibiting the best combination of the desired properties, mr-PosEBR, is 2 times more sensitive than PMMA (495kDa) and performs comparably to the known high resolution resist ZEP520A. For example, a grating pattern with 29nm wide lines with a period of 100nm could be generated in films of mr-PosEBR with an area dose of 100µC/cm2. In terms of resolution, single lines of only 35nm width could be fabricated via metal lift-off using 100kV EBL. Furthermore, the dry etch stability of mr-PosEBR in a reactive-ion etching (RIE) process (etch gases: CF4/SF6) is similar to the one of ZEP520A (etch rates, mr-PosEBR: 190nm/min, ZEP520A: 150nm/min, silicon: 440nm/min). Moreover, high resolution nanopatterns in mr-PosEBR could be smoothly transferred into the underlying Si substrate by a RIE process. Display Omitted A new resist material for high resolution electron-beam lithography is presented.The resist was developed by the systematic variation of its copolymeric composition.The new material provides high sensitivity, high resolution and high etch stability.

In this contribution, we present the results of a systematic material variation for the development of a resist material for high resolution positive tone electron beam lithography (EBL). Several acrylic copolymer materials with different compositions, that is varying mass fractions of the comonomers and different molecular weights, were synthesized and – as resist solutions – evaluated in terms of EBL performance at acceleration voltages of 30 kV and 100 kV. The resist material exhibiting the best combination of the desired properties, named mr-PosEBR, is two times more sensitive than PMMA 495k and performs comparably to the known high resolution resist ZEP520A at 30 kV. For example, a grating pattern with 29 nm wide lines with a period of 100 nm could be lithographically generated in films of mr-PosEBR with an area dose of 100 μC/cm2. In terms of resolution, single lines of only 35 nm width could be fabricated via metal liftoff. Furthermore, the dry etch stability of mr-PosEBR in a CF4/SF6 process is similar to the one of ZEP520A. Consequently, via dry etching nano patterns in mr-PosEBR could be smoothly transferred into the underlying Si substrate with high fidelity. Moreover, mr-PosEBR was evaluated as electron beam grayscale patterning and reflow resist. It was shown that the resist exhibits a good grayscale and reflow performance very similar to PMMA 120k and ZEP520A. Via these well controllable processes the generation of a wide variety of features and applications is possible.

We demonstrate that polarization-sensitive optical coherence tomography (PS-OCT) is suitable to map the stress distribution within materials in a contactless and non-destructive way. In contrast to transmission photoelasticity measurements the samples do not have to be transparent but can be of scattering nature. Denoising and analysis of fringe patterns in single PS-OCT retardation images are demonstrated to deliver the basis for a quantitative whole-field evaluation of the internal stress state of samples under investigation., 10 pages, 6 figures; Copyright: Blackwell Publishing Ltd 2008; The definitive version is available at: www.blackwell-synergy.com

Optical coherence tomography (OCT) is a technique for contactless and non-destructive imaging of internal structures within semi-transparent materials. When OCT is performed polarisation-sensitively (PS-OCT), additional information about internal anisotropies and strains is obtained. Originally developed for the biomedical sector, OCT increasingly attracts interest for material characterisation. In this work, we apply PS-OCT imaging for non-biological samples using a novel transversal ultra-high resolution PS-OCT set-up. We demonstrate the advantages of this technique for structural analysis and strain mapping for different types of samples: we evaluate photoresist moulds for the fabrication of micro-electromechanical parts (MEMS), and we investigate the glass-fibre composite outer shell of helicopter rotor blades where defects have formed.

Mittels optischer Kohärenztomografie (OCT) können in kontaktfreier Weise Querschnittsbilder von semitransparenten Proben aufgenommen werden. In diesem Artikel werden instrumentelle Erweiterungen der OCT vorgestellt, welche in der zerstörungsfreien Materialcharakterisierung zur Anwendung kommen können. Messungen an diversen Materialproben, wie z. B. an Fotolackschichten für die Fabrikation von mikromechanischen Teilen, wurden mit verschiedenen OCT-Aufbauten durchgeführt, um die individuellen Vorteile der ultrahochauflösenden OCT, der schnellen Fourier-Domain-OCT und der polarisationssensitiven OCT aufzuzeigen.

Plano-convex microlens arrays of organic-inorganic polymers with tailored optical properties are presented. The fine-tuning of each microlens within an array is achieved by confining inkjet printed drops of the polymeric ink onto pre-patterned substrates. The lens optical properties are thus freely specified, and high numerical apertures from 0.45 to 0.9 and focal lengths between 10 μm and 100 μm are demonstrated, confirming theoretical predictions. Combining nanoimprint lithography approaches and inkjet printing enables using the same material for the microlenses and their substrates, improving the optical performances. Microlens arrays with desired specifications are printed reaching yields up to 100% and high lens reproducibility with standard deviations of the apparent contact angle under 1° and of the numerical apertures and focal lengths under 6%. Microlens arrays involving lenses with different characteristics, e.g. multi focal length, and thus focal planes separated by only few microns are printed with the same reproducibility.

An all-polymer photonic crystal slab sensor is presented, and shown to exhibit narrow resonant reflection with a FWHM of less than 1 nm and a sensitivity of 31 nm/RIU when sensing media with refractive indices around that of water. This results in a detection limit of 4.5x10-6 RIU when measured in conjunction with a spectrometer of 12 pm/pixel resolution. The device is a two-layer structure, composed of a low refractive index polymer with a periodically modulated surface height, covered with a smooth upper-surface high refractive index inorganic-organic hybrid polymer modified with ZrO2-based nanoparticles. Furthermore, it is fabricated using inexpensive vacuum-less techniques involving only UV nanoreplication and polymer spin-casting, and is thus well suited for single-use biological and refractive index sensing applications.

LIGA is the basic idea of promising developments for the manufacturing of microelectromechanical system parts containing high aspect ratio microstructures. Aim of the work is a brief discussion of the starting-points for inline process inspection within a direct LIGA technology using deep X-ray lithography for the production of micromechanical gear wheels with critical dimensions of ∼35 μm width at ∼1 mm height as well as to show methodic and technical measuring possibilities. Firstly, results of the determination of residual solvent content distribution within ultra-thick SU-8 films are shown obtained from refracted near field optical measurements. Furthermore, the capability of X-ray computer tomographic imaging is discussed and measurements for the determination of the three-dimensional shape of high aspect ratio microstructures are practically demonstrated with microscopic and interferometric optical methods. Finally, first results demonstrate the potential of the optical coherence tomography for several further important measurement tasks, among others, e.g. for the imaging of the distribution of mechanical stress at the resist–substrate interface. The results show that much information which is essential in the LIGA process can be achieved with recently available measurement methods. However, further development of non-destructive measurement techniques would be desirable for an effective inline process control of mass production of micromechanical parts.

Advanced mask aligner lithography (AMALITH) is a holistic approach to improve shadow printing (contact and proximity lithography) in mask aligners. AMALITH is based on two tools, the MO Exposure Optics®, a new illumination system allow shaping the angular spectrum of the illumination light, and LAB, a software tool for full 3D simulation of the shadow printing process. MO Exposure Optics® is provided by SUSS MicroTec AG ( http://www.suss.com ), as an upgrade for all current and older mask aligner models. MO Exposure Optics® decouples the illumination from lamp misplacement (self-calibrated light source), improves the light uniformity, provides telecentric illumination and enables customized illumination in mask aligners. LAB is a software tool provided by GenISys GmbH ( http://www.genisys-gmbh.com ), and allows simulating the complete chain from illumination, mask pattern, photoresist and resist processing. The combination of both tools allows optimizing mask aligner lithography beyond today's limits.

Optical coherence tomography (OCT), originally developed and so far nearly exclusively used for biomedical applications (e.g., [1,2]), is a contact-free, non-destructive technique based on low-coherence interferometry to image structures within translucent and turbid materials. Commonly, cross-sectional reflectivity images with a depth-resolution determined by the coherence length of the near-infrared light source are obtained. When OCT is performed in a polarization sensitive way (PS-OCT), additional information about birefringence within a material is obtained by mapping the retardation between ordinary and extraordinary rays [3]. Because birefringence is induced when strain occurs, PS-OCT provides depth resolved information about the internal stress within a sample.

We report on the fabrication by nanoimprint lithography (NIL) and performance of metal stripe waveguides embedded in a polymer, capable of supporting long-range surface plasmon polariton (LRSPP) propagation.

We present a new organic photosensitive material for volume holographic recording. Advanced material composition and sample preparation eliminates the need for a protective layer and allows layer fabrication with variable thickness and a free surface. Optimized chemical formulation results in a high energetic sensitivity, high angular selectivity and high inducible refractive index contrast. We investigate the photoresponse and nonsinusoidal refractive index profiles. We demonstrate highly resolved optical structuring with up to 8000 lines per mm. Imaging of the holographic phase gratings is accomplished by optical microscopy.

Microlens arrays fabricated by a direct ink-jet printing of UV-curable hybrid polymer are reported. A periodic pattern of polymer drops was ink-jet printed on the surface-treated glass substrate and cured in the UV-light. Using this simple technique, we demonstrated periodic arrays of almost semi-spherical microlenses of 50 μm diameter size and a focal distance of 48μm. The optical characteristics of solitary μ-lenses and arrays comprising up to 64x64 microlenses are measured both in the near- and far-field zones. Large numerical aperture and short focal distance make the ink-jet printing of microlenses very attractive for applications in optical interconnects, large 2D VCSEL arrays and pixelated imagine sensors utilizing CCD or SPAD arrays, offering thus an efficient, simple and a cheap alternative to the conventionally used photolithography technique.