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Start Over Author "Lechter, W. L." Topic alloy plating
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1. Properties of electrodeposited Co-Cu multilayer structures.

Author

Dariel, M., Bennett, L. H., Lashmore, D. S., Lubitz, P., Rubinstein, M., Lechter, W. L., and Harford, M. Z.

Subjects
ALLOY plating, COBALT plating, COPPER plating, ELECTROLYTES, SURFACE roughness
Abstract

Reports on the electroplating of alternate layers of cobalt (Co) and copper (Cu) of individual thicknesses from an electrolyte having a low concentration of Cu and a high concentration of Co atoms. Electrodeposition technique used to prepare the Co-Cu composition modulated alloys; Investigation of the effects of surface roughness and layer interactions.

Published
1987
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