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Properties of electrodeposited Co-Cu multilayer structures.

Authors :
Dariel, M.
Bennett, L. H.
Lashmore, D. S.
Lubitz, P.
Rubinstein, M.
Lechter, W. L.
Harford, M. Z.
Source :
Journal of Applied Physics; 4/15/1987, Vol. 61 Issue 8, p4067, 3p
Publication Year :
1987

Abstract

Reports on the electroplating of alternate layers of cobalt (Co) and copper (Cu) of individual thicknesses from an electrolyte having a low concentration of Cu and a high concentration of Co atoms. Electrodeposition technique used to prepare the Co-Cu composition modulated alloys; Investigation of the effects of surface roughness and layer interactions.

Details

Language :
English
ISSN :
00218979
Volume :
61
Issue :
8
Database :
Complementary Index
Journal :
Journal of Applied Physics
Publication Type :
Academic Journal
Accession number :
7623047
Full Text :
https://doi.org/10.1063/1.338529