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Properties of electrodeposited Co-Cu multilayer structures.
- Source :
- Journal of Applied Physics; 4/15/1987, Vol. 61 Issue 8, p4067, 3p
- Publication Year :
- 1987
-
Abstract
- Reports on the electroplating of alternate layers of cobalt (Co) and copper (Cu) of individual thicknesses from an electrolyte having a low concentration of Cu and a high concentration of Co atoms. Electrodeposition technique used to prepare the Co-Cu composition modulated alloys; Investigation of the effects of surface roughness and layer interactions.
- Subjects :
- ALLOY plating
COBALT plating
COPPER plating
ELECTROLYTES
SURFACE roughness
Subjects
Details
- Language :
- English
- ISSN :
- 00218979
- Volume :
- 61
- Issue :
- 8
- Database :
- Complementary Index
- Journal :
- Journal of Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- 7623047
- Full Text :
- https://doi.org/10.1063/1.338529