1. Experimental study on the thermal response of PCM-based heat sink using structured porous material fabricated by 3D printing
- Author
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Xusheng Hu, Xiaolu Gong, Laboratoire des Systèmes Mécaniques et d'Ingénierie Simultanée (LASMIS), and Université de Technologie de Troyes (UTT)
- Subjects
Materials science ,020209 energy ,Overheating (economics) ,[SPI.MECA.MSMECA]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Materials and structures in mechanics [physics.class-ph] ,02 engineering and technology ,Heat sink ,[SPI.MECA.SOLID]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Solid mechanics [physics.class-ph] ,01 natural sciences ,[SPI.MAT]Engineering Sciences [physics]/Materials ,[SPI]Engineering Sciences [physics] ,Thermal conductivity ,[SPI.MECA.MEMA]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Mechanics of materials [physics.class-ph] ,Thermal ,0202 electrical engineering, electronic engineering, information engineering ,Water cooling ,[SPI.GPROC]Engineering Sciences [physics]/Chemical and Process Engineering ,Electronics ,Composite material ,Porosity ,Engineering (miscellaneous) ,ComputingMilieux_MISCELLANEOUS ,Fluid Flow and Transfer Processes ,Structured porous material ,Thermal response ,3D printing ,Phase-change material ,[SPI.MECA.GEME]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Mechanical engineering [physics.class-ph] ,010406 physical chemistry ,0104 chemical sciences ,[SPI.MECA.STRU]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Structural mechanics [physics.class-ph] ,lcsh:TA1-2040 ,[SPI.MECA.THER]Engineering Sciences [physics]/Mechanics [physics.med-ph]/Thermics [physics.class-ph] ,lcsh:Engineering (General). Civil engineering (General) ,Phase change material - Abstract
Phase change material (PCM) based heat sink has the potential to be applied for the thermal management of electronic devices. Whereas, PCM suffers from a low thermal conductivity, which results in local overheating at the base of heat sink. To enhance thermal performance of heat sink, a structured porous material (SPM) used as thermal conductivity enhancer (TCE) is designed and fabricated, where 3D printing technique is adopted to achieve the fast and precise manufacture of SPM. The thermal response of heat sink using SPM with different porosities (80%, 85%, 90%, and 95%) is experimentally investigated at various heating power levels (8 W, 10 W, and 12 W). Results show that the use of SPM has a significant effect on thermal response of heat sink for electronic cooling system. Furthermore, the thermal behavior of heat sink can be further heightened by reducing the porosity of SPM, e.g., the heat sink using SPM with 80% porosity shows the highest enhancement ratio in all cases of present study. The increase of power level can result in the reduction of operation time of PCM-based heat sink. This study is of great significance for the design and application of SPM used in thermal management unit.
- Published
- 2021