1. Critical Role of Interlayer in Hf0.5Zr0.5O2 Ferroelectric FET Nonvolatile Memory Performance
- Author
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Matthew Jerry, Pankaj Sharma, Kai Ni, Suman Datta, Kandabara Tapily, Souvik Mahapatra, Robert D. Clark, Jeffery A. Smith, and Jianchi Zhang
- Subjects
010302 applied physics ,Materials science ,Condensed matter physics ,02 engineering and technology ,Trapping ,Electron ,021001 nanoscience & nanotechnology ,01 natural sciences ,Ferroelectricity ,Electronic, Optical and Magnetic Materials ,law.invention ,Non-volatile memory ,Capacitor ,law ,Electric field ,0103 physical sciences ,Field-effect transistor ,Electrical and Electronic Engineering ,0210 nano-technology ,Polarization (electrochemistry) - Abstract
We fabricate, characterize, and establish the critical design criteria of Hf0.5Zr0.5O2 (HZO)-based ferroelectric field effect transistor (FeFET) for nonvolatile memory application. We quantify ${V}_{\textsf {TH}}$ shift from electron (hole) trapping in the vicinity of ferroelectric (FE)/interlayer (IL) interface, induced by erase (program) pulse, and ${V}_{\textsf {TH}}$ shift from polarization switching to determine true memory window (MW). The devices exhibit extrapolated retention up to 10 years at 85 °C and endurance up to $5\times 10^{6}$ cycles initiated by the IL breakdown. Endurance up to 1012 cycles of partial polarization switching is shown in metal–FE–metal capacitor, in the absence of IL. A comprehensive metal–FE–insulator–semiconductor FeFET model is developed to quantify the electric field distribution in the gate-stack, and an IL design guideline is established to markedly enhance MW, retention characteristics, and cycling endurance.
- Published
- 2018
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