Critical Role of Interlayer in Hf0.5Zr0.5O2 Ferroelectric FET Nonvolatile Memory Performance

We fabricate, characterize, and establish the critical design criteria of Hf0.5Zr0.5O2 (HZO)-based ferroelectric field effect transistor (FeFET) for nonvolatile memory application. We quantify ${V}_{\textsf {TH}}$ shift from electron (hole) trapping in the vicinity of ferroelectric (FE)/interlayer (IL) interface, induced by erase (program) pulse, and ${V}_{\textsf {TH}}$ shift from polarization switching to determine true memory window (MW). The devices exhibit extrapolated retention up to 10 years at 85 °C and endurance up to $5\times 10^{6}$ cycles initiated by the IL breakdown. Endurance up to 1012 cycles of partial polarization switching is shown in metal–FE–metal capacitor, in the absence of IL. A comprehensive metal–FE–insulator–semiconductor FeFET model is developed to quantify the electric field distribution in the gate-stack, and an IL design guideline is established to markedly enhance MW, retention characteristics, and cycling endurance.