Author: "Haumesser, P.-H." / Search Limiters: Peer Reviewed - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Haumesser, P.-H."' showing total 10 results

Start Over Author "Haumesser, P.-H." Search Limiters Peer Reviewed

10 results on '"Haumesser, P.-H."'

1. Synthesis of bimetallic nanoparticles in ionic liquids: Chemical routes vs physical vapor deposition

Author: Helgadottir, I.S., Arquillière, P.P., Bréa, P., Santini, C.C., Haumesser, P.-H., Richter, K., Mudring, A.-V., and Aouine, M.
Published: 2013
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2. Direct Extraction of Platinum Nanoparticles from Fuel Cells with Ionic Liquids: Part 2. Impact of the Nafion Ionomer Swelling.

Author: Coudray, M., Billy, E., Pouget, S., Haumesser, P.-H., Santini, C. C., Dufaud, V., and Mendil-Jakani, H.
Published: 2023
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3. Alkoxysilane layers deposited by SC CO 2 process on silicon oxide for microelectronics applications

Author: Rébiscoul, D., Perrut, V., Renault, O., Rieutord, F., Olivier, S., and Haumesser, P.-H.
Published: 2009
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4. Novel Chemical Route to Size-Controlled Ta(0) and Ru-Ta Nanoparticles in Ionic Liquids

Author: Helgadottir, Inga S., Arquillière, Philippe P., Campbell, Paul S., Santini, Catherine C., and Haumesser, P.-H.
Published: 2012
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5. High Temperature Viscosity Measurements by the Gas Film Levitation Technique: Application to Various Types of Materials

Author: Haumesser, P. H., Garandet, J. P., Bancillon, J., Daniel, M., Campbell, I., and Jackson, P.
Published: 2002
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6. Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications.

Author: Charbonnier, J., Hida, R., Henry, D., Cheramy, S., Chausse, P., Neyret, M., Hajji, O., Garnier, G., Brunet-Manquat, C., Haumesser, P. H., Vandroux, L., Anciant, R., Sillon, N., Farcy, A., Rousseau, M., Cuzzocrea, J., Druais, G., and Saugier, E.
Published: 2010
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7. Ru-core/Cu-shell bimetallic nanoparticles with controlled size formed in one-pot synthesis.

Author: Helgadottir, I., Freychet, G., Arquillière, P., Maret, M., Gergaud, P., Haumesser, P. H., and Santini, C. C.
Published: 2014
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8. Enabling technologies for 3D chip stacking.

Author: Leduc, P., Di Cioccio, L., Charlet, B., Rousseau, M., Assous, M., Bouchu, D., Roule, A., Zussy, M., Gueguen, P., Roman, A., Rozeau, O., Heitzmann, M., Nieto, J.-P., Vandroux, L., Haumesser, P.-H., Quenouillere, R., Toffoli, A., Sixt, P., Maitrejean, S., and Clavelier, L.
Published: 2008
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9. 300 mm Multi Level Air Gap Integration for Edge Interconnect Technologies and Specific High Performance Applications.

Author: Gras, R., Gaillard, F., Bouchu, D., Farcy, A., Petitprez, E., Icard, B., Le-Denmat, J. C., Pain, L., Bustos, J., Haumesser, P. H., Brun, P., Imbert, G., Clement, L., Borowiak, C., Rivoire, M., Euvrard, C., Arnal, V., Olivier, S., Moreau, S., and Mellier, M.
Published: 2008
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10. Self Aligned Barrier Approach: Overview on Process, Module Integration and Interconnect Performance Improvement Challenges.

Author: Gosset, L.G., Chhun, S., Guillan, J., Gras, R., Flake, J., Daamen, R., Michelon, J., Haumesser, P.-H., Olivier, S., Decorps, T., and Torres, J.
Published: 2006
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