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Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications.

Authors :
Charbonnier, J.
Hida, R.
Henry, D.
Cheramy, S.
Chausse, P.
Neyret, M.
Hajji, O.
Garnier, G.
Brunet-Manquat, C.
Haumesser, P. H.
Vandroux, L.
Anciant, R.
Sillon, N.
Farcy, A.
Rousseau, M.
Cuzzocrea, J.
Druais, G.
Saugier, E.
Source :
2010 Proceedings 60th Electronic Components & Technology Conference (ECTC); 2010, p1077-1082, 6p
Publication Year :
2010

Details

Language :
English
ISBNs :
9781424464104
Database :
Complementary Index
Journal :
2010 Proceedings 60th Electronic Components & Technology Conference (ECTC)
Publication Type :
Conference
Accession number :
81602793
Full Text :
https://doi.org/10.1109/ECTC.2010.5490835
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