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Abstract We present results derived from continuous and localized 35 keV55Mn+ion implantations into ZnO. Localized implantations were carried out by using self-ordered alumina membranes as masks leading to ordered arrays of implanted volumes on the substrate surfaces. Defects and vacancies in the small implantation volumes of ZnO were generated due to the implantation processes besides the creation of new phases. Rapid thermal annealing was applied in the case of continuous implantation. The samples were characterized by HRSEM, GIXRD, Raman spectroscopy and RBS/C. Magnetic characterization of the samples pointed out appreciable differences among the samples obtained by the different implantation methods. This fact was mainly attributed to the different volume/surface ratios present in the implanted zones as well as to the increase of Mn atom concentrations along the grain frontiers in the nanostructured surfaces. The samples also showed a ferromagnetic transition phase at temperature value higher than room temperature.

Electrical characterization of Al/SiNx:H/InP structures shows that ECR nitrogen plasma cleaning of InP surfaces gives rise to a noticeable improvement in the interface quality, whereas insulator and semiconductor bulk properties are maintained at a level sufficient to be used as the gate dielectric in MIS devices. Nitrogen plasma exposure was carried out just before the SiNx plasma deposition without vacuum breaking. To obtain interface state density and to detect deep levels in the semiconductor bulk, deep level transient spectroscopy (DLTS) measurements were carried out. We have also evaluated the insulator damage density, the so-called disorder-induced gap states (DIGS), by means of conductance transient analysis. Our results show that the plasma exposure in N2 atmospheres is a valuable and simple surface conditioning method. [ABSTRACT FROM AUTHOR]

Presents an electrical characterization of discrete Bipolar Junction Transistor (BJT) devices with nonuniform doped emitter and base zones, with reference to an experiment conducted. Methodology employed to conduct the experiment; Information on bipolar junction transistors; Results of the experiment.

MIS structures have been fabricated on Si (111) by a two-step process: first an exposition of the Si substrates to an ECR oxygen plasma was performed, which yields a layer of SiOx (in the following PO-SiOx); this process was followed by an ECR plasma silicon nitride deposition (SiN1.55:H). The resulting MIS structure is Al/SiN1.55:H/PO-SiOx/Si. Devices have been characterized by the simultaneous measurement of the capacitance at high and low frequencies. This measurement lets us know the PO-SiOx/Si interface quality, calculate the thickness of the PO-SiOx layer and the growth rate of SiN1.55:H. To characterize the oxidation process some series of samples were prepared. In each series a process parameter was varied. These parameters were: the SiN1.55:H deposition time, the ECR plasma oxidation duration, the substrate temperature and the total oxygen flux. The bonding structure of the stacked dielectric has been studied by infrared spectroscopy. The stacked dielectrics spectra showed the superposition of two peaks: a less intense peak associated to the PO-SiOx layer with its maximum in 1056 cm-1, and another one due to the SiN1.55:H film with its maximum in 860 cm-1. These measurements showed that the PO‑SiOx growth law is dSiO = 2.7 tox 0.26 nm where dSiO is the PO-SiOx layer thickness and tox is the oxidation time in min. Concerning electrical characteristics, stacked MIS devices showed interface trap density minimums (Dit) close to 1011 eV-1cm-2. This value is inferior to the one that non-oxydized devices (Al/SiN1.55:H/Si) show. Also, stacked devices presented higher Fermi level sweeps and an electrical hysteresis almost insignificant.Se han fabricado estructuras MIS sobre Si (100) mediante un proceso en dos pasos: una primera exposición del sustrato de Si a un plasma ECR de oxígeno, que da lugar a la obtención de una capa de SiOx (en adelante PO-SiOx), seguido de un depósito de nitruro de silicio (SiN1.55: H) mediante plasma ECR. La estructura MIS resultante es de la forma Al/SiN1.55:H/PO‑SiOx/Si. Los dispositivos han sido caracterizados mediante la medida simultánea de las capacidades a alta y baja frecuencia, lo que permite conocer la calidad de la intercara PO‑SiOx/Si, calcular los espesores de la capa de PO‑SiOx y la velocidad de crecimiento del SiNx:H. Para caracterizar el proceso de oxidación se realizaron varias series de muestras variando en cada una un parámetro del proceso. Estos parámetros fueron: el tiempo de depósito del SiNx:H, el tiempo de oxidación, la temperatura del sustrato y el flujo total de O2. Asimismo, se ha estudiado la estructura de enlaces del dieléctrico apilado mediante espectroscopia infrarroja. El espectro del dieléctrico apilado mostró la superposición de dos picos: uno de menor intensidad asociado al PO‑SiOx con el máximo en 1056 cm-1, y otro debido al SiN1.55:H con máximo en 860 cm-1. Estas medidas mostraron que la ley que rige el crecimiento del PO‑SiOx es dSiO = 2.7 tox 0.26 nm donde dSiO es el espesor de la capa de PO-SiOx y tox es el tiempo de oxidación en min. Por lo que respecta a las características eléctricas, las estructuras presentaron mínimos de la densidad de trampas en la intercara (Dit) cercanos a 1011 eV-1cm-2. Este valor es inferior al que presentaron las estructuras sin oxidar, del tipo SiN1.55:H/Si. Además, los dispositivos apilados mostraron un barrido del nivel de Fermi mayor y una histéresis prácticamente despreciable.