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This work presents the design of a low voltage dynamic comparator for low-power ADC applications. The dynamic comparator uses a pre-amplifier powered by a floating reservoir capacitor and a positive feedback bulk structure. The output stage comprises a simple circuit to reduce the total voltage overhead necessary to define the logic levels. The powering scheme of the pre-amplifier, with a floating reservoir capacitor, contributes to reduce the impacts of global process variability. The positive feedback bulk structure lowers the threshold voltages of the pre-amplifier transistors at the sampling phase. Such structure also provides positive feedback signal during the comparison phase to provide extra transconductance. The proposed dynamic comparator is designed and simulated in a 28 nm CMOS technology and reaches an IRN below of the quantization noise of a 10 bits differential ADCs working with 600 mV power supply. The dynamic comparator achieves 237 μV input-referred noise, while consuming only 38.8 fJ per comparison and having a nominal delay of 5.77 ns.

In this paper a self-biased current reference based on Metal-Oxide-Semiconductor Field Effect Transistor (MOSFET) Zero Temperature Coefficient (ZTC) condition is proposed. It can be implemented in any Complementary Metal-Oxide-Semiconductor (CMOS) fabrication process and provides another alternative to design current references. In order to support the circuit design, ZTC condition is analyzed using a MOSFET model that is continuous from weak to strong inversion, showing that this condition always occurs from moderate to strong inversion in any CMOS process. The proposed topology was designed in a 180 nm process, operates with a supply voltage from 1.4V to 1.8 V and occupies around 0.010mm2 of silicon area. From circuit simulations our reference showed a temperature coefficient (TC) of 15 ppm/oC from -40 to +85oC, and a fabrication process sensitivity of σ/μ = 4.5% for the current reference, including average process and local mismatch variability analysis. The simulated power supply sensitivity is estimated around 1%/V.

An ultra-low voltage and ultra-low power Digital-Based Operational Transconductance Amplifier (DB-OTA) is presented and demonstrated on silicon in 180 nm CMOS. The DB-OTA is designed using digital standard cells, hence benefitting from technology scaling as much as digital circuits, while also being technology- and design-portable, and requiring minimal design and integration effort compared to conventional analog-intensive OTAs. The fabricated DB-OTA testchip occupies a compact area of 1,426 $\mu \text{m}^{2}$ , operates at supply voltages down to 300 mV, and consumes only 590 pW while driving a capacitive load of 80pF. Its measured Total Harmonic Distortion (THD) is lower than 5% at a 100-mV input signal swing. Based on these results, the proposed DB-OTA achieves 2,101 V−1 small-signal figure of merit (FOMS) and 1,070 large-signal figure of merit (FOML). To the best of the authors’ knowledge, the power is the lowest reported to date in an OTA, and the achieved figures of merit are the best in sub-500 mV OTAs reported to date. The low cost, the low design effort and the high power efficiency of DB-OTA make it well suited for purely harvested low-frequency analog interfaces in sensor nodes.

In this paper, we propose an ultra-low power compact 3-transistor voltage reference capable of operating at ultra-low supply voltages. The proposed circuit is based on the self-cascode MOSFET (SCM), which provides a reference voltage proportional to the threshold voltage ( $V_{T}$ ) difference of the two NMOS transistors that compose it. Reverse short-channel and narrow-width effects are explored to obtain such $V_{T}$ difference while using the same type of transistor. Ultra-low power operation and low line sensitivity is achieved by biasing the SCM with a zero- $V_{T}$ (native) transistor, also leading to an area efficient design. To show its versatility, three versions of the proposed circuit were fabricated in a standard 0.13- $\mu \text{m}$ CMOS process. Measurement performed over five samples showed an average temperature coefficient of 150–1500 ppm/°C. Minimum supply voltages of 0.12–0.4 V was observed while providing reference voltages around tens of mV. The proposed circuits consume 0.33–50 pW at room temperature and minimum supply voltage. The occupied area for any version is less than 0.0012 mm2.

In this paper, a self-biased temperature-compensated CMOS voltage reference operating at picowatt-level power consumption is presented. The core of the proposed circuit is the self-cascode MOSFET (SCM) and two variants are explored: a self-biased SCM (SBSCM) and a self-biased NMOS (SBNMOS) voltage reference. Power consumption and silicon area are remarkably reduced by combining subthreshold operation with a self-biased scheme. Trimming techniques for both circuits are discussed aiming at the reduction of the process variations impact. The proposed circuits were fabricated in a standard 0.18- $\mu \text{m}$ CMOS process. Measurement results from 24 samples of the same batch show that both circuits herein proposed can operate at 0.45/0.6 V minimum supply voltage, consuming merely 55/184 pW at room temperature. Temperature coefficient (TC) around 104/495 ppm/°C across a temperature range from 0 to 120 °C was measured. Employment of a trimming scheme allows a reduction of the average TC to 72.4/11.6 ppm/°C for the same temperature range. Both variants of the proposed circuit achieve a line sensitivity of 0.15/0.11 %/V and a power supply rejection better than −44/−45 dB from 10 to 10 kHz. In addition, SBSCM and SBNMOS prototypes occupy a silicon area of 0.002 and 0.0017 mm2, respectively.

Electromagnetic interference (EMI) disturbances coupled in the power supply of voltage and current references can severely degrade their performance, due to its finite power supply rejection (PSR). The design of a 90-dB PSR 4-dBm EMI-resistant NMOS-only voltage reference is herein presented. The voltage reference is designed based on the zero-temperature-coefficient transistor operating point. The high PSR is obtained using zero- $V_{T}$ transistors as active loads in the open and feedback loop of the circuit. Two versions, using standard $V_{T}$ and low-power $V_{T}$ transistors, were designed in a 130-nm CMOS process. Both are designed using the same thermal compensation principle. The circuits occupy 0.014 and 0.006 mm $^{2}$ of silicon area while consuming around 1.15 and 0.156 $\mu$ W at 27 $^\circ$ C, respectively. Postlayout simulations present a reference voltage of 206 and 450 mV with an average temperature coefficient of 321 and 86 ppm/ $^\circ$ C (1000 samples), under a temperature range from $-$ 55 to 125 $^\circ$ C. An EMI source of 4 dBm (1 $\text{V}_{\text{pp}}$ ) injected in the power supply, according to the direct power injection standard, yields $-$ 0.17% and $-$ 0.1 ${\%}$ of the maximum dc shift and 822 and 950 $\mu \text{V}_{\text{pp}}$ of the maximum peak-to-peak ripple for the standard $V_{T}$ and low-power $V_{T}$ implementations, respectively.

The calibration of the effects of process variations and device mismatch in Ultra Low Voltage (ULV) Digital-Based Operational Transconductance Amplifiers (DB-OTAs) is addressed in this paper. For this purpose, two dynamic calibration techniques, intended to dynamically vary the effective strength of critical gates by different modulation strategies, i.e., Digital Pulse Width Modulation (DPWM) and Dyadic Digital Pulse Modulation (DDPM), are explored and compared to classic static calibration. The effectiveness of the calibration approaches as a mean to recover acceptable performance in non-functional samples is verified by Monte-Carlo (MC) post-layout simulations performed on a 300 mV power supply, nW-power DB-OTA in 180 nm CMOS. Based on the same MC post-layout simulations, the impact of each calibration strategy on silicon area, power consumption, and OTA performance is discussed.

This work presents a resistorless self-biased and small area sub-bandgap voltage reference that works in the nano-ampere consumption range with 0.75 V of power supply. The circuit applies a curvature compensation technique that allows an extended temperature range without compromising the temperature stability. The behavior of the circuit is analytically described, and a design methodology is proposed which allows the separate adjustment of the bipolar junction transistor bias current and its curvature compensation. Simulation results are presented for a 180 nm CMOS process, where a reference voltage of 469 mV is designed, with a temperature coefficient of 5 ppm/°C for the ź40 to 125 °C extended temperature range. The power consumption of the whole circuit is 16.3 nW under a 0.75 V power supply at 27 °C. The estimated silicon area is 0.0053 mm2.

This paper presents a power-efficient Ultra Low Voltage (ULV) Digital-Based Operational Transconductance Amplifier (DB-OTA), which uses static logic gates and processes digitally the analog input signal. Post-layout simulations in 180nm CMOS technology show that at 300mV supply voltage the circuit consumes just 2nW while driving a capacitive load of 80pF with Total Harmonic Distortion lower than 5% at 100mV input signal swing. The total silicon area is $1,426\ \mu \mathrm{m}^{2}$ . The maximum energy efficiency supply for the DB-OTA and its scalability to 40nm CMOS technology node are also demonstrated.

A voltage reference based on MOSFETs operated under Zero Temperature Coefficient (ZTC) bias is proposed. The circuit operates in a power supply voltage range from 0.3 V up to 1.2 V and outputs three different reference voltages using Standard- $V_{T}$ (SVT), Low- $V_{T}$ (LVT), and Zero- $V_{T}$ (ZVT) MOS transistors biased near their ZTC point by a single PTAT current reference. Measurements on 15 circuit samples fabricated in a standard 0.13- $\mu \text{m}$ CMOS process show a worst-case normalized standard deviation $(\sigma /\mu)$ of 3% (SVT), 5.1% (LVT) and 10.8% (ZVT) respectively with a 75% of confidence level. At the nominal supply voltage of 0.45 V, the measured effective temperature coefficients (TCeff) range from 140 to 200 ppm/°C over the full commercial temperature range. At room temperature (25 °C), line sensitivity in the ZVT VR is just 1.3%/100 mV, over the whole supply range. The proposed reference draws around 5 $\mu \text{W}$ and occupies 0.014 mm2 of silicon area.

In this work a resistorless sub-bandgap voltage reference topology is presented. It is a self-biased and small area circuit that works in the nano-ampere consumption range, and under 1 V of power supply. The behavior of the circuit is analytically described, a design methodology is proposed and simulation results are presented for two CMOS processes, XFAB 0.18 μm and IBM 0.13 μm. Experimental results from one fabrication run demonstrate a reference voltage of 570 mV, with a temperature coefficient as low as 11 ppm/°C for the 0---125 °C range, while the power consumption of the whole circuit is 5 nW under a 0.9 V supply at 27 °C. The occupied silicon area is 0.0022 mm$$^2$$2.

A 50 MHz---1 GHz low-noise amplifier circuit with high linearity for IEEE 802.22 wireless regional area network is presented. It was implemented without any inductor and offers a differential output for balun use. Noise canceling and linearity boosting techniques were combined to improve the amplifier performance in such a way that they can be separately optimized. Linearity was improved using diode-connected transistors. The amplifier was implemented in a 130 nm CMOS process in a compact 136 μm × 71 μm area. Simulations are presented for post-layout schematics for two classes of design: one for best linearity, another for best noise figure (NF). When optimized for best linearity, simulation results achieve a voltage gain >23.7 dB (power gain >19.1 dB), a NF 3.3 dBm (7.6 dBm max.) and an input power reflection coefficient S11 24.7 dB (power gain >19.8 dB), a NF ?0.3 dBm and an S11 11 dB. Monte Carlo simulation results confirm low sensitivity to process variations. Also a low sensitivity to temperature within the range ?55 to 125 °C was observed for Gain, NF and S11. Power consumption is 18 mW under a 1.2 V supply.

Internet of Things (IoT) is a topic of growing interest and intensive research in industry, technological centers and academy, where data communication is one of its most relevant aspects. Since IoT is an open field for new applications, it does not have yet a standard communication protocol. This paper presents the system level design of a Wi-Fi receiver supporting the novel low power standard IEEE 802.11ah with focus on IoT applications. Theoretical performance analysis as well as system level design strategies are presented. Individual blocks of the receiver chain are specified as a condition for future circuit-level design. Simulation results validate the proposed system specifications attending the 802.11ah standard. The presented receiver provides 80.5dB maximum gain, 9 dB minimum noise figure and 69.4 dB of dynamic range. Those performance parameters lead to -99.4 dBm sensitivity, 21 dB and 51 dB for adjacent and non-adjacent maximum channel rejection.

A nano-ampere current reference with temperature compensation operating is presented. The reference current is generated biasing a zero-VT transistor near its Zero-temperature coefficient (ZTC) point. Two versions were implemented in a 180 nm CMOS process. Both are designed using the same thermal compensation principle, but the second version uses an auxiliary circuit to compensate process variation. The circuits occupy 0.01 and 0.018 mm2 of silicon area while consuming around 30.5 and 122 nW at 27° C, respectively. Post-layout simulations present a reference current of 10.86 and 10.95 nA with a average temperature coefficient of 108 and 127 ppm/°C (100 Samples), under a temperature range from −20 to 120 °C, and a line sensitivity of 0.54 and 0.86 %/V at 0.9 V to 1.8 V of supply voltage, respectively.

Complementary Metal Oxide Semiconductor (CMOS) Transconductors, or Gm cells, are key building blocks to implement a large variety of analog circuits such as adjustable filters, multipliers, controlled oscillators and amplifiers. Usually temperature stability is a must in such applications, and herein we define all required conditions to design low thermal sensitivity Gm cells by biasing MOSFETs at Transconductance Zero Temperature Condition (GZTC). This special bias condition is analyzed using a MOSFET model which is continuous from weak to strong inversion, and it is proved that this condition always occurs from moderate to strong inversion operation in any CMOS fabrication process. Additionally, a few example circuits are designed using this technique: a single-ended resistor emulator, an impedance inverter, a first order and a second order filter. These circuits have been simulated in a 130 nm CMOS commercial process, resulting in improved thermal stability in the main performance parameters, in the range from 27 to 53 ppm/oC.

Electromagnetic Interference (EMI) disturbances coupled in the power supply of voltage and current references can severely degrade their performance, due to its finite Power Supply Rejection Ratio (PSRR). The design of a 90 dB PSRR, 4 dBm EMI resistant NMOS-Only Voltage Reference is herein presented. The Voltage Reference is designed based on the Zero Temperature Coefficient (ZTC) transistor point. The high-PSRR is obtained using zero-VT transistors as active loads in the open and feedback loop of the circuit. The final circuit was designed in a 130 nm CMOS process and occupies around 0.014 mm2 of silicon area while consuming just 1.15 μW. Post-layout simulations present a 206 mV of Voltage Reference with a Temperature Coefficient of 321 ppm/°C, for the temperature range from −55 to 125 °C. An EMI source of 4 dBm (1 V pp ) injected in the power supply, according to the Direct Power Injection (DPI) standard, yield in a maximum dc shift and Peak-to-peak ripple of −0.17 % and 822 μV pp , respectively.

Electromagnetic Interference (EMI) degrades the performance of voltage and current references, due to its finite Power Supply Rejection Ratio (PSRR). The design of a 90 dB PSRR, 4 dBm EMI resistant MOSFET-Only Voltage Reference is herein presented. The Voltage Reference is designed based on the Zero Temperature Coefficient (ZTC) transistor point. The high-PSRR is obtained using zero-VT transistors as active loads in the open and feedback loop of the circuit. The final circuit was designed in a 130 nm CMOS process and occupies around 0.014 mm2 of silicon area while consuming just 1.15 μW. Postlayout simulations present a 206 mV of Voltage Reference with a Temperature Coefficient of 321 ppm/° C, for the temperature range from −55 to 125 ° C. An EMI source of 4 dBm (1 Vpp) injected in the power supply, according to the Direct Power Injection (DPI) standard, yield in a maximum DC Shift and Peak-to-Peak ripple of −0.17 % and 822 μVpp, respectively.

Digital and analog ICs generally rely on the concept of matched behavior between identically designed devices. Time-independent variations between identically designed transistors, called mismatch, affect the performance of most analog and even digital MOS circuits. This article focuses on the analysis of mismatch in MOS transistors resulting from random fluctuations of the dopant concentration, first studied by Keyes. Today, we recognize these fluctuations as the main cause of mismatch in bulk CMOS transistors.

The MOSFET Zero Temperature Coefficient (ZTC) condition is a strategy that can be used to implement low temperature sensitivity circuits, such as current and voltage references. This condition is usually analyzed using the strong inversion quadratic MOSFET model. In this work we use a different approach, based on a continuous MOSFET model that can predict its behavior from weak to strong inversion. Based on this analysis, we verify that the ZTC point occurs from moderate to strong inversion for any CMOS process, since this point must occur for gate-source voltages larger than one threshold voltage. Also, a resistorless switched capacitor current reference based on the ZTC condition (ZSCCR), presenting low temperature coefficient (TC), is presented. The ZSCCR is designed in a 180 nm process, resulting a reference current of 5.88 µA under a supply voltage of 1.8 V, and occuping a silicon area around 0.010mm2. Results from circuit simulation show an effective temperature coefficient (TC eff ) of 60 ppm/°C from −45 to +85 °C and a power consumption of 63 µW.

The continuous scaling of CMOS devices has required the consequent reduction of the supply voltages. There is a need for analog and RF circuits able to operate under at supplies lower than 0.5 V. This paper presents a voltage reference based on the MOSFET zero-temperature condition (ZTC) that operates with a low 0.5 V supply. The circuit is composed by a diode-connected MOS transistor operating near the ZTC condition that is biased by a proportional-to-absolute-temperature (PTAT) current reference implemented with Schottky-diodes. The ZTC condition is analysed using a continuous MOSFET model that is valid from weak to strong inversion and the circuit behaviour is described by theoretical expressions. Our reference circuit is designed for 3 versions: each with MOSFETs of different threshold voltage (standard-VT, low-VT, and zero-VT), all available in the 130 nm CMOS process used. These designs result in three different and very low reference voltages: 312, 237, and 51 mV. All 3 designed reference operate in the range of 0.45 to 1.2 V of supply voltages, consuming 1 uA of typical supply current. Post-layout simulations present a Temperature Coefficients (TCs) of 214, 372, and 953 ppm/°C in a temperature range from -55 to 125°C, respectively. Monte-Carlo simulations show the fabrication variability impact on the circuit performance. The voltage reference was designed in a 130 nm process and it uses 0.014 mm2 of silicon area.

The necessary conditions to design MOSFET transconductors with low temperature dependence are analysed and defined in this paper. Transconductors, or Gm circuits, are fundamental blocks used to implement adjustable filters, multipliers, controlled oscillators, amplifiers and a large variety of analog circuits. Temperature stability is a must in such applications, and herein we show a strategy that can be used to improve the temperature stability of these transconductors by biasing MOSFETs at transconductance zero-temperature condition (GZTC). This special bias condition is analysed using a MOSFET model which is continuous from weak to strong inversion, and it is proved that this condition always occurs from moderate to strong inversion operation in any CMOS fabrication process. Additionally, a few example circuits are proposed using this technique: a single-ended resistor emulator, an impedance inverter, a first order and a second order filter. These circuits were simulated in a 130 nm CMOS commercial process, resulting improved thermal stability in the main performance parameters, in the range from 27 to 53 ppm/°C.

A self-biased current reference based on the MOSFET Zero Temperature Coefficient (ZTC) condition is presented. It can be implemented in any CMOS process and it provides a simple alternative to design a reference current suitable for low TC biasing. This topology was designed in a 0.18 μm process to generate 5 μA under a supply voltage from 1.4V to 1.8 V, spending a silicon area around 0.010mm2. From circuit simulations, the current reference is estimated to have a temperature coefficient (TCeff) of 15 ppm/°C from -40 to +85 °C and a fabrication sensitivity of σ/μ = 4.5%, including average process and local mismatch variability. The power supply sensitivity resulted around 1%V for this new reference.

A novel resistorless bipolar junction transistor (BJT) bias and curvature compensation circuit for ultra-low-power CMOS bandgap voltage references (BGRs) is introduced. It works in the nanoampere current consumption range and under 1 V of power supply. The analytical behaviour of the circuit is described and simulation results for a 0.18 μm CMOS standard process are analysed. A junction voltage of 550 mV at room temperature is obtained (at an emitter current of 3.5 nA), presenting an almost linear temperature dependence, whereas the power consumption of the whole circuit is 3.4 nW under a 0.8 V power supply at 27°C. The estimated silicon area is 0.00135 mm 2 .

This paper presents a compact model for MOS transistor mismatch. The mismatch model uses the carrier number fluctuation theory to account for the effects of local doping fluctuations along with an accurate and compact dc MOSFET model. The resulting matching model is valid for any operation condition, from weak to strong inversion, from the linear to the saturation region, and allows the assessment of mismatch from process and geometric parameters. Experimental results from a set of transistors integrated on a 0.35 /spl mu/m technology confirm the accuracy of our mismatch model under various bias conditions.

Electron device matching has been a key factor on the performance of today's analog or even digital electronic circuits. This paper presents a study of drain current matching in MOS transistors. CMOS test structures were designed and fabricated as a way to develop an extensive experimental work, where current mismatch was measured under a wide range of bias conditions. A model for MOS transistor mismatch was also developed, using the carrier number fluctuation theory to account for the effects of local doping fluctuations. This model shows a good fitting with measurements over a wide range of operation conditions, from weak to strong inversion, from the linear to the saturation region, and allows the assessment of mismatch from process and geometric parameters.

Postprint This work presents an approach for accurate MOS transistor matching calculation. Our model, which is based on an accurate physics-based MOSFET model, allows the assessment of mismatch from process parameters and valid for any operating region. Experimental results taken on a test set of transistors implemented in a 1.2 /spl mu/m CMOS technology corroborate the theoretical development of this work.