1. The Aftercare Survey: Assessment and intervention practices after brain tumor surgery in Europe
- Author
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Sierpowska, J., Rofes, A., Dahlslatt, K., Mandonnet, E., ter Laan, M., Polczynska, M., Hamer, P.D., Halaj, M., Spena, G., Meling, T.R., Motomura, K., Reyes, A.F., Campos, A.R., Robe, P.A., Zigiotto, L., Sarubbo, S., Freyschlag, C.F., Broen, M.P.G., Stranjalis, G., Papadopoulos, K., Liouta, E., Rutten, G.J., Viegas, C.P., Silvestre, A., Perrote, F., Brochero, N., Caceres, C., Zdun-Ryzewska, G., Kloc, W., Satoer, D., Dragoy, O., Hendriks, M.P.H., Alvarez-Carriles, J.C., Piai, V., Zdun-Ryzewska, A., Neurolinguistics and Language Development (NLD), RS: GROW - R3 - Innovative Cancer Diagnostics & Therapy, Klinische Neurowetenschappen, and MUMC+: MA Med Staf Spec Neurologie (9)
- Subjects
REHABILITATION ,caregivers ,RETURN ,Neurodevelopmental disorders Donders Center for Medical Neuroscience [Radboudumc 7] ,Neuro- en revalidatiepsychologie ,DISORDERS ,Neuropsychology and rehabilitation psychology ,COST ,Medicine (miscellaneous) ,glioma aftercare ,TIME ,Reconstructive and regenerative medicine Radboud Institute for Health Sciences [Radboudumc 10] ,Language in Interaction ,All institutes and research themes of the Radboud University Medical Center ,quality of life ,HIGH-GRADE GLIOMA ,survey ,postsurgical outcomes - Abstract
Netherlands Organization for Scientific Research [024.001.006]; National Institute on Deafness and Other Communication Disorders, USA [K01DC016904]; Center for Language and Brain NRU Higher School of Economics, RF Government [14.641.31.0004], Sierpowska, J., Rofes, A., Dahlslätt, K., Mandonnet, E., Ter Laan, M., Połczyńska, M., Hamer, P.D.W., Halaj, M., Spena, G., Meling, T.R., Motomura, K., Reyes, A.F., Campos, A.R., Robe, P.A., Zigiotto, L., Sarubbo, S., Freyschlag, C.F., Broen, M.P.G., Stranjalis, G., Papadopoulos, K., Liouta, E., Rutten, G.-J., Viegas, C.P., Silvestre, A., Perrote, F., Brochero, N., Cáceres, C., Zdun-Ryżewska, A., Kloc, W., Satoer, D., Dragoy, O., Hendriks, M.P.H., Alvarez-Carriles, J.C., Piai, V.
- Published
- 2022
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