Search

Your search keyword '"Hara, Yoshiko"' showing total 3 results
Start Over Author "Hara, Yoshiko" Publisher up media group, inc.
3 results on '"Hara, Yoshiko"'

1. Packaging -- System-in-Board Package Eliminates Substrate

Author

Hara, Yoshiko

Subjects
Sanyo Electric Company Ltd. -- Management, Instrument industry -- Management, Business, Electronics and electrical industries, Engineering and manufacturing industries
Abstract

Sanyo Electric Co. Ltd. has moved a step ahead in system-in-package (SiP) technology with its integrated system-in-board (ISB) packaging approach. Sanyo's method wires multiple ICs, transistors, and other passives to [...]

Published
2002

2. R&D Consortium Eyes SiP Substrates.

Author

Hara, Yoshiko

Subjects
ASSOCIATIONS, institutions, etc., CHROMOGENIC compounds
Abstract

Reports the formation of R&D association by five Japanese companies to develop materials and technologies for high-density substrates. Usage of the substrates in system-in-package devices; Storage of multiple chips in single package; Subsidy of the association.

Published
2002

3. System-in-Board Package Eliminates Substrate.

Author

Hara, Yoshiko

Subjects
PACKAGING, ELECTRIC circuits
Abstract

Focuses on the use of the integrated system-in-board electronic circuit packaging approach by Sanyo Electric Co. Limited. Functionality of the method; Details on the copper foil pattern used in the process; Benefits of using the system.

Published
2002

Catalog

Books, media, physical & digital resources
See catalog results