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System-in-Board Package Eliminates Substrate.

Authors :
Hara, Yoshiko
Source :
PC FAB; Feb2002, Vol. 25 Issue 2, p9, 1/2p
Publication Year :
2002

Abstract

Focuses on the use of the integrated system-in-board electronic circuit packaging approach by Sanyo Electric Co. Limited. Functionality of the method; Details on the copper foil pattern used in the process; Benefits of using the system.

Subjects

Subjects :
PACKAGING
ELECTRIC circuits

Details

Language :
English
ISSN :
02748096
Volume :
25
Issue :
2
Database :
Complementary Index
Journal :
PC FAB
Publication Type :
Periodical
Accession number :
7175051

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