Search

Your search keyword '"Solder paste"' showing total 117 results

Search Constraints

Start Over You searched for: Descriptor "Solder paste" Remove constraint Descriptor: "Solder paste" Publisher springer science and business media llc Remove constraint Publisher: springer science and business media llc
117 results on '"Solder paste"'

Search Results

1. Research on the Mechanical and Performance Effects of Flux on Solder Layer Interface Voids

2. RETRACTED ARTICLE: Effect of grain size on the interface structure and shear behavior of lead-free solder joints

3. Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints

4. Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure

5. Three-dimensional CFD simulation of the stencil printing performance of solder paste

6. Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste

7. Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

8. Monolithic integration of MEMS thermal flow sensor and its driving circuit onto flexible Cu on polyimide film

9. Retardation Effect of Tin Multilayer on Sn-3.0Ag-0.5Cu (SAC305)-Based Solder Joint Interface

10. Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints

11. Solder paste metamorphism

12. Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure

13. Effect of Oxide Fluxes in Activated TIG Welding of Stainless Steel 316LN to Low Activation Ferritic/Martensitic Steel (LAFM) Dissimilar Combination

14. Crystal structure and grain formation mechanism of bismuth–indium particles generated by ultrasonic irradiation

15. Effects of flux formulation temperature on printing and wetting properties of Sn–3.0Ag–0.5Cu solder

16. Stencil printing process performance on various aperture size and optimization for lead-free solder paste

17. Experimental Study of the Solder Paste Jet Printing Process Using High Speed Photography and Rheological Methods

18. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging

19. Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

20. Thermal and mechanical properties of micro Cu doped Sn58Bi solder paste for attaching LED lamps

21. Microstructural evolution and mechanical reliability of transient liquid phase sintered joint during thermal aging

22. Three-dimensional integrated stretchable electronics

23. Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability

24. Effect of powders on microstructures and mechanical properties for Sn–Ag transient liquid phase bonding in air

25. Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

26. Effects of α-Al2O3 nanoparticles-doped on microstructure and properties of Sn–0.3Ag–0.7Cu low-Ag solder

27. The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly

28. Rheological characterization and jet printing performance of Sn–58Bi solder pastes

29. Subgrain Rotation Behavior in Sn3.0Ag0.5Cu-Sn37Pb Solder Joints During Thermal Shock

30. Metallurgical behaviors of lead-free solder alloys with respect to Ag content in a ball grid array package around melting temperatures

31. Optimization of Solder Volume in Printed Circuit Board Assembly Through an Operating Window Experiment—A Case Study

32. Predicting contact-without-connection defects on printed circuit boards employing ball grid array package types: a data analytics case study in the smart manufacturing environment

33. The Melting Characteristics and Interfacial Reactions of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu Joints During Reflow Soldering

34. Effect of electron flow on the microstructure and mechanical property of Cu/Sn–30Bi/Cu solder joint

35. Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

36. Investigation on the Microstructure, Interfacial IMC Layer, and Mechanical Properties of Cu/Sn-0.7Cu-xNi/Cu Solder Joints

37. Effect of nano-Al addition on properties and microstructure of low-Ag content Sn–1Ag–0.5Cu solders

38. Backward Compatibility Solder Joint Formation at High Peak Reflow Temperature for Aerospace Applications

39. Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints

40. Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

41. Influence of latent heat released from solder joints on the reflow temperature profile

42. Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

43. Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints

44. Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

45. Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

46. Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing

47. Preparation and reflow soldering characteristics of solder paste containing submicron Sn powders synthesised via chemical reduction

48. Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating

49. Stencil printing behavior of lead-free Sn-3Ag-0.5Cu solder paste for wafer level bumping for Sub-100 μm size solder bumps

50. Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications

Catalog

Books, media, physical & digital resources