Preparation and reflow soldering characteristics of solder paste containing submicron Sn powders synthesised via chemical reduction

Sn nanoparticles (NPs) were synthesised via chemical reduction. Trisodium citrate dihydrate and mixtures of trisodium citrate dihydrate and 1,10-phenanthroline monohydrate were used as capping agents for the synthesis. When a specific amount of trisodium citrate dihydrate (3.4 × 10−1 mM) was solely added, very fine particle sizes and excellent suppression of aggregation were achieved in the dried samples. When 5 mM of 1,10-phenanthroline monohydrate was used in combination with trisodium citrate dihydrate (at the optimum concentration of 3.4 × 10−2 mM), the particle refining and the suppression of aggregation were further improved. The nano-solder paste prepared by mixing the synthesised Sn NPs with a commercial flux exhibited stable reflow soldering characteristics. The formation of an intermetallic layer, similar to that observed when commercial solder pastes containing micron-sized powders were used, was seen when soldering was carried out with the solder paste containing the synthesised Sn NPs.