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This paper presents a reliability optimization design method for a hydraulic system that considers oil contamination. The proposed method applies the quantitative relationship between oil contamination and system reliability to the reliability design of a hydraulic system, while considering the performance, layout, and other design factors. A global reliability model of the hydraulic system is constructed based on the oil contamination control model. Further studies aiming at an optimization design model of the hydraulic system is established where the cost is the objective function, reliability index, size and structure range, performance requirements are constraints, structure size and oil change period are design variables. For illustration, a case study on the reliability optimization design of the oil supply point branch of the static pressure bracket of a certain type of heavy CNC horizontal lathe is considered.

Polymer metallization is widely used in a variety of micro and nano system technologies, and magnetron sputtering of a metal film is one of the essential processes of polymer metallization. However, some defects are likely generated in sputtered metal films on a polymer substrate. In this work, the defect generation mechanism in the sputtered Au film on a polymethylmethacrylate (PMMA) substrate was investigated for the first time. The characteristics of defects on the PMMA surface and in the Au film were examined by an optical microscope, a scanning electron microscope (SEM) and a confocal microscope. Detailed characterization results indicate that the ejected Au atoms bombard the PMMA substrate and cause snowflake-like defects on the PMMA surface because of the low hardness of PMMA, then Au atoms nucleate and grow at PMMA defect sites and form a partially suspended metal film, subsequently dropping the photoresist makes the suspended metal film conformally adhere to the PMMA defect, and the snowflake-like morphology is replicated to the metal film. The effects of sputtering parameters on the defects were studied, and the amount of defects in the Au film reduced with the decrease of the sputtering power or the sputtering pressure.

Transfer printing is an emerging assembly technique for flexible and stretchable electronics. Although a variety of transfer printing methods have been developed, transferring patterns with nanometer resolution remains challenging. We report a sacrificial layer-assisted nanoscale transfer printing method. A sacrificial layer is deposited on a donor substrate, and ink is prepared on and transferred with the sacrificial layer. Introducing the sacrificial layer into the transfer printing process eliminates the effect of the contact area on the energy release rate (ERR) and ensures that the ERR for the stamp/ink-sacrificial layer interface is greater than that for the sacrificial layer/donor interface even at a slow peel speed (5 mm s−1). Hence, large-area nanoscale patterns can be successfully transferred with a yield of 100%, such as Au nanoline arrays (100 nm thick, 4 mm long and 47 nm wide) fabricated by photolithography techniques and PZT nanowires (10 mm long and 63 nm wide) fabricated by electrohydrodynamic jet printing, using only a blank stamp and without the assistance of any interfacial chemistries. Moreover, the presence of the sacrificial layer also enables the ink to move close to the mechanical neutral plane of the multilayer peel-off sheet, remarkably decreasing the bending stress and obviating cracks or fractures in the ink during transfer printing. Transfer printing is an emerging assembly technique for flexible and stretchable electronics, and a breakthrough method has been developed that allows transfer printing at the nanoscale by means of a weak-adhesion intermediate (sacrificial) layer. Although transfer printing has gained considerable attention for transferring various classes of materials with a wide range of geometries and configurations from one substrate to another, very few methods have allowed such printing at the nanoscale; those methods demand very elaborate processing. However, a team headed by Junshan Liu at Dalian University of Technology, China developed a simple, versatile transfer printing technique utilizing a sacrificial layer that for the first time permitted the successful transfer of large-area nanoscale patterns with a 100% yield. The authors intend to further investigate the possibilities of their innovative system and its application in various nanotechnologies.

Compared to red and green organic light-emitting diodes (OLEDs), blue OLEDs are still the bottleneck due to the lack of efficient emitters with simultaneous high exciton utilization efficiency (EUE) and short excited-state lifetime. Different from the fluorescence, phosphorescence, thermally activated delayed fluorescence (TADF), and organic radical materials traditionally used in OLEDs, we demonstrate herein a new type of emitter, cerium(III) complex Ce-1 with spin-allowed and parity-allowed d–f transition of the centre Ce3+ ion. The compound exhibits a high EUE up to 100% in OLEDs and a short excited-state lifetime of 42 ns, which is considerably faster than that achieved in efficient phosphorescence and TADF emitters. The optimized OLEDs show an average maximum external quantum efficiency (EQE) of 12.4% and Commission Internationale de L’Eclairage (CIE) coordinates of (0.146, 0.078)., OLEDs: deep blue emission from cerium(III) complex A luminescent cerium(III) complex could be promising for realizing efficient and stable deep-blue organic-LEDs required for display and lighting applications, arising from its theoretical high exciton utilization efficiency and short excited-state lifetime. Liding Wang, Zifeng Zhao, and coworkers from China have shown that a new cerium (III) complex called Ce-1, which supports a d-f energy level transition, can efficiently emit blue light with a high photoluminescence quantum yield up to 93% and a short excited-state lifetime of 42 ns. OLEDs fabricated from the complex offered a maximum external quantum efficiency of 12.4% and a luminance of about 1000 cd m−2, and their emission is characterized as being deep blue with CIE colour coordinates of (0.146, 0.078).

Electrohydrodynamic jet (E-Jet) is an approach to the fabrication of micro/nano-structures by the use of electrical forces. In this process, the liquid is subjected to electrical and mechanical forces to form a liquid jet, which is further disintegrated into droplets. The major advantage of the E-Jet technique is that the sizes of the jet formed can be at the nanoscale far smaller than the nozzle size, which can realize high printing resolution with less risk of nozzle blockage. The E-Jet technique, which mainly includes E-Jet deposition and E-Jet printing, has a wide range of applications in the fabrication of micro/nano-structures for micro/nano-electromechanical system devices. This technique is also considered a micro/nano-fabrication method with a great potential for commercial use. This study mainly reviews the E-Jet deposition/printing fundamentals, fabrication process, and applications.

Node localization technology is one of the most important technologies in wireless sensor networks. Due to the advantages of saving and convenience, received signal strength indication (RSSI) technology is widely taken to measure the distance between the sensor nodes, and then trilateral localization algorithm which is one of the classic algorithms can calculate the position result quickly. However, the result always comes with an irregularly wide error. Environment, temperature and electromagnetism are generally considered the interference factors, which have been widely researched. From another angle, this study focuses on the error of the algorithm itself, and discusses the stability of equations. A trilateral localization algorithm for outliers suppression is proposed. Through a large number of simulation, it is demonstrated that the proposed algorithm has a good performance than classic trilateral algorithm based-on the nearest three anchor nodes. A significant meaning of this research is that the deepest source of gross errors has been found when we use classic trilateral algorithm.

The activity of glutamic pyruvic transaminase (GPT) is an important clinical evidence for some acute diseases such as acute hepatopathy and myocardial infarction. Thus, there is a demand for rapid determination of GPT in small formats at point-of-need. Herein, we describe a novel method of electrochemical determination of GPT with microfluidic technique. GPT activity was indirectly determined via the electrochemical (EC) detection of nicotinamide adenine dinucleotide (NADH) produced from the GPT transdeamination reaction. A type of microfluidic chip was developed, in which a passive mixer comprising 100 sub-ribs and a three-electrode strip for EC were integrated. To verify the response to NADH, a series of NADH concentrations varying from 19 µM to 5 mM were calibrated with cyclic voltammetry within the microfluidic chip. And a linear relationship with R 2 0.9982 between the peak current and the concentration of NADH was obtained. Then, the GPT activity was determined using the chips containing and not containing a ribs-type mixer. And a linear relationship which contained two sections between the GPT activity and the peak current was obtained. The chip with a ribs-type mixer exhibited the sensitivity of 0.0341 μA U−1 L in the range of 10–50 U L−1 and 0.0236 μA U−1 L in the range of 50–250 U L−1. And the detection limit of the chip with a ribs-type mixer was 9.25 U L−1. The complete detection process of GPT activity within the microfluidic chip was realized, and the time-consuming problem was remarkably improved too.

A new technique was developed for embossing microstructures on thermoplastic substrates, which can achieve high accuracy replication with little loss of the production efficiency. The technique is no need of the preheating process and cooling device. In the new technique, just the surface layer of the polymer substrate was heated through heat transmission and ultrasonic viscoelastic heating was the major heat source. For our new technology, the temperature of the mould just provided the initial temperature of the mould-substrate interface and a higher boundary temperature for embossing. The replication accuracies of three embossing technologies were contrasted, including ultrasonic embossing at room temperature (HER), thermal assisted ultrasonic embossing (TUE) and local thermal assisted ultrasonic embossing (L-TUE). The results indicated that, the replication accuracy of L-TUE was approximate with TUE. Moreover, the effects of the processing parameters on the replication quality, including average replication depth and uniformity over the entire chip, were investigated. Different with our prediction, the replication accuracy did not monotonously improved with the ultrasonic force and the temperature of the mold. Finally, the temperature test was carried out to study the temperature characteristic of our new technology.

A novel method for fabricating a three-layer SU-8 mould with inverted T-shaped cavities is presented. The first two SU-8 layers were spin coated and exposed separately, and simultaneously developed to fabricate the bottom and the horizontal part of the inverted T-shaped cavity. Then, a positive photoresist was filled into the cavity, and a wet lapping process was performed to remove the excess photoresist and make a temporary substrate. The third SU-8 layer was spin coated on the temporary substrate to make the vertical part of the inverted T-shaped cavity. The sacrificial photoresist layer can prevent the first two SU-8 layers from being secondly exposed, and make a temporary substrate for the third SU-8 layer at the same time. Moreover, the photoresist can be easily removed with the development of the third SU-8 layer. A polydimethylsiloxane (PDMS) microchip with arrays of T-shaped cantilevers for studying the mechanics of cells was fabricated by using the SU-8 mould.

Energy efficiency and quality of service (QoS) are both essential issues in the applications of wireless sensor networks (WSNs) all along, which are mainly reflected in the development of routing and MAC protocols. However, there is little design for achieving the dual performances simultaneously. In this paper, we develop a practical passive cluster-based node-disjoint many to one multipath routing protocol to satisfy the requirements of energy efficiency and QoS in practical WSNs. Passive clustering approach is put to use in the first round, while active clustering technique is taken in the other rounds. Implementation of smart delay strategy makes the cluster distribute uniformly, as well as lessen the number of nodes that have taken part in routing. Among cluster heads, a node-disjoint many to one multipath routing discovery algorithm, which is composed of the optimal path searching process and multipath expansion process, is implemented to find multiple paths at the minimum cost. The simulation results show the proposed protocol achieved very good performance both in energy efficiency and QoS.

We present a new method to fabricate one-dimensional (1D) nanochannels on a thermoplastic substrate. This method has two main steps. First, a mold with microscale features is used to replicate microchannels on a thermoplastic substrate. Second, the fabricated microchannel is compressed to a 1D nanochannel at a temperature above the glass transition temperature (Tg) of the themoplastics. The effects of compression temperature, compression pressure, retaining time and loading rate on microchannel compression have been studied. Results have shown that a 1D nanochannel of 1---30 μm wide and 200---300 nm deep can be readily fabricated by using this method.

A novel equivalent circuit model of capacitively coupled contactless conductivity detection (C4D) on microfluidic chips is presented. The impedance of the solution in microchannels facing the two electrodes for C4D was first introduced in the model of C4D on microfluidic chips. The electrodes and the solution facing electrodes were divided into individual segments in the model, and the effect of the length of divided segments on the model was studied. A back-calculating method was put forward to calculate the stray capacitance between the electrodes, and the variation between the calculated value and the simulated value was only 6 %. To evaluate the accuracy of the model, a hybrid poly (methyl methacrylate) (PMMA)/polydimethylsiloxane (PDMS) microchip was fabricated and a simple model was built. Compared with the outputs of the simple model, the data predicted by the novel model show a much closer fit to experimental results, and the variations were within 8 % over a wide concentration range of 1–500 μm for potassium chloride.

This paper presents ultrasonic embossing using silicon molds to replicate microstructures on Polymethyl Methacrylate (PMMA) substrates. The pattern of the silicon mold consists of micro grooves with different sizes. The molds were fabricated by wet etching, and both concave and convex types were fabricated. The effects of the processing parameters on replication quality, including average microstructure depth, uniformity and the location-related replication depth were investigated via orthogonal experiments. The results show that the ultrasonic amplitude is the most important parameter for replication depth. The ultrasonic time benefits the accumulation of the heat, so it also influences replication depth. As for ultrasonic force, it has less influence on replication depth but significant influence on replication uniformity. The width of the grooves of the high density patterning molds ranged from 10 to 30 μm, and the center distance between the two microstructures from 20 to 50 μm in our experiments. The concave molds were intended to reach higher replication depth than that of convex molds with the same micro grooves. The average replication depth reached 98 %, and the uniformity on one chip reached 99 % with an area of 11 × 11 mm. All experiments were finished in 60 s, which is more efficient than the hot embossing technique, thus this paper provides a potential method for medium-sized bulk production and rapid fabrication for polymer microcomponents.

A novel hot embossing method is developed to fabricate polymer nanochannels. The pattern on the silicon nanomould is transferred to polymethylmethacrylate (PMMA) plates, and then polyethylene terephthalate (PET) nanochannels are embossed by using the PMMA mould. The use of the PMMA intermediate mould can extremely increase the device yield of the expensive silicon nanomould. To avoid the use of nanolithography, a method based on UV-lithography techniques for fabricating silicon nanomoulds with sub-micrometer width was put forward. 1 PMMA mould can be used to repeatedly emboss at least 30 PET substrates without damage and obvious deformation. Good pattern fidelity of PET nanochannels was obtained at the optimized embossing temperature of 90 °C. For an 808 nm-wide and 195 nm-deep nanochannel, the variations in width and depth between PET nanochannels and PMMA moulds were 1.8 and 2.5 %, respectively. The reproducibility was also evaluated, and the relative standard deviations in width and depth of 5 PET nanochannels were 5.1 and 7.3 %, respectively.

In this paper, we demonstrate the effects of electrophoresis (EP) and electroosmotic flow (EOP) on ion enrichment in micro-nanofluidic preconcentrator via numerical simulation. The difference of sample fluxes resulted from EP and EOP at the micro-nano interface is defined to distinguish the contributions of EOF and EP to ion enrichment. The influences of several parameters related to the enrichment ratio are investigated in detail. The results show that the enrichment ratio can be improved via enhancing the difference. To increase the difference, several proposals are presented, including raising imposed electric potential, increasing surface charge density and enhancing fluid viscosity.

Because of extremely small dimensions of nanochannels and low rigidity of polymer, most bonding techniques which are suitable for sealing polymer microscale channels (width and depth in tens to hundreds microns) are not competent for bonding of polymer nanochannels. In this study, a new thermal assisted ultrasonic bonding method for sealing poly (methyl methacrylate) (PMMA) nanochannels was presented. Substrates were preheated to 30–40°C lower than glass transition temperature (T g ) of the material by hot plate. Then low amplitude ultrasonic vibration was employed to generate facial heat at the interface of the substrates. Influences of preheating temperature on bonding strength and dimension loss were studied. The nanochannels were successfully bonded with depth loss less than 5.3% (10.6 nm) and bonding strength of 0.21 J/cm2 at the preheating temperature of 70°C. Thermal assisted ultrasonic bonding is proven to be competent for bonding of polymer nanochannels with high bonding strength, low dimension loss and short bonding time.

This work reports laser ionization combined with Time-Of-Flight (TOF) mass spectrometry investigation on intermediate species in the hydrocarbon plasma of atmospheric-pressure fast-flow pulsed dc-discharge. All neutral intermediate species including transient radicals from benzene/Ar discharge have been characterized by a molecular beam sampling combined with TOF mass spectrometry. This shows that with a hydrocarbon gas mixture of 0.3% C6H6 in Ar discharge the intermediate species consist of simple radicals (such as C2, C5H5, C7H7) and polycyclic organic molecules (C10H8, C13H10, C14H10). Theoretical studies on total energies and ionization potentials of the intermediate species have been carried out using the hybrid density functional theory. Effect of the ionization potential on mass spectral intensity has been discussed. Based on the observed data, the possible major neutral reaction channels of the plasma chemistry have been discussed. The developed experimental method has implications in volatile organic compounds removing and impurities diagnosis in Tokamak edge-plasma.

Bonding is a bottleneck for mass-production of polymer microfluidic devices. A novel ultrasonic bonding method for rapid and deformation-free bonding of polymethyl methacrylate (PMMA) microfluidic chips is presented in this paper. Convex structures, usually named energy director in ultrasonic welding, were designed and fabricated around micro-channels and reservoirs on the substrates. Under low amplitude ultrasonic vibration, localized heating was generated only on the interface between energy director and cover plate, with peak temperature lower than T g (glass transition temperature) of PMMA. With the increasing of temperature, solution of PMMA in isopropanol (IPA) increases and bonding was realized between the contacting surfaces of energy director and cover plate while no solution occurs on the surfaces of other part as their lower temperature. PMMA microfluidic chips with micro-channels of 80 μm × 80 μm were successfully bonded with high strength and low dimension loss using this method.

The forming process of U-form glass micro-nanofluidic chip with long nanochannels is presented in this paper, in which the fabrication of channels and the assembly of plates are included. The micro-nanofluidic chip is composed of two glass plates in which there are microchannels and nanochannels, respectively. This chip can be used for trace sample enrichment, molecule filtration, and sample separation, etc. In fabrication process, the two-step photolithograph on one wafer is often required in early papers, as nano and micro structure designed in one plate have different depths. In this paper, the channels in micro-nanofluidic chip are designed in two glass plates instead of in one wafer. The nanochannels and microchannels are, respectively, formed on plates using wet etching and two-step photolithograph on one wafer is not required. Since the channels are formed, the upper plate and the bottom plate are assembled together by alignment, preconnection and thermal bonding orderly. Firstly these plates are aligned with the cross-marks on an inverted microscope. The aqueous film between plates is controlled to decrease the static friction force for accurate adjustment. Then the adhesion strength of connection is enhanced with semi-dry status for limiting movement from slight inclining and shaking. At last, the bottom plate and the upper one are irreversibly linked together with thermal bonding. The heating period and max temperature of thermal bonding are optimized to eliminate thermal stress gradient and the size shrinking. With the micro-nanofluidic chip, the 1 μM fluorescein isothiocyanate in 10 mM PBS buffer is concentrated successfully. The sample concentrating factor of light intensity varies from 2.2 to 8.4 with applied voltages between 300 and 2,000 V. The switch effect and the instability effect in concentrating process are described and analyzed too.

The paper presents the modeling of two types of piezoelectric microcantilevers, the two-layer and two-segment piezoelectric cantilevers, in which the two piezoelectric parts perform sensor and actuator functions, respectively. An analytic model is proposed to evaluate the sensing and actuating effects of multiporph microcantilevers formed of several layers or segments of piezoelectric materials. The analytical model is used to analyze the tip deflection of the cantilever and the piezoelectric charge generated on the sensor element as a function of the microcantilever geometry. The cantilevers of sensing and actuation are compared for the different working situations of the two-layer and two-segment cantilevers. The theoretical results can be used to optimize the design of the piezoelectric cantilever structures.