Search

Your search keyword '"Ni, C. Y."' showing total 2 results
Start Over Author "Ni, C. Y." Publisher springer nature
2 results on '"Ni, C. Y."'

1. INFLUENCES OF MATERIAL SOURCE, WAFER PROCESS AND LOCATION ON SILICON DIE FRACTURE STRENGTH.

Author

Liu, D. S., Shih, Y. S., Ni, C. Y., Chiou, D. Y., Chung, C. L., and Huang, M. L.

Subjects
FRACTURE mechanics, BENDING (Metalwork), TESTING, STRENGTH of materials, SEMICONDUCTOR wafers, ELECTRIC circuits
Abstract

Investigates the external factors that influenced die fracture strength using three-point bending test and statistical analysis. Causes of fracture modes for the die samples; Factors that contributed to the variations in die fracture strength; Comparison between the effects of wafers fabricated with electrical circuits and raw wafers on die fracture strength and strength variations.

Published
2002
Full Text
View/download PDF

Catalog

Books, media, physical & digital resources
See catalog results