189 results on '"Adan, Ofer"'
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2. Phenomenology of electron-beam-induced photoresist shrinkage trends.
3. Recess metrology challenges for 3D device architectures in advanced technology nodes.
4. Characterization of CD-SEM metrology for iArF photoresist materials.
5. Accurate in-resolution level overlay metrology for multipatterning lithography techniques.
6. Metrology challenges for advanced lithography techniques.
7. SEM metrology for advanced lithographies.
8. MacroCD contact ellipticity measurement for lithography tool qualification.
9. Small feature accuracy challenge for CD-SEM metrology physical model solution.
10. Advanced CDSEM matching methodology for OPC litho cell-based matching verification.
11. Embedded charge investigation: industry concerns and metrology solutions.
12. Advanced 2D structures metrology with CD-SEM for OPC challenges.
13. Verification of height and sidewall angle SEM metrology accuracy using Monte Carlo simulation.
14. CD SEM metrology macro CD technology: beyond the average.
15. Height and sidewall angle SEM metrology accuracy.
16. CD-SEM application for generic analysis of two-dimensional features on wafers and reticles.
17. Characterizing and understanding stray tilt: the next major contributor to CD SEM tool matching.
18. Addressing FinFET metrology challenges in 1× node using tilt-beam critical dimension scanning electron microscope.
19. Robustness improvement in imaging-based overlay metrology for high topography layers by Talbot targets.
20. A study on diffraction-based overlay measurement based on FDTD method.
21. Plasma assisted particle contamination control: plasma charging dependence on particle morphology.
22. Investigation and optimization of STI dry-etch induced overlay through patterned wafer geometry tool.
23. In-line applications of atomic force microscope based topography inspection for emerging roll-to-roll nanomanufacturing processes.
24. Automated extraction of critical dimension from SEM images with WeaveTM.
25. Accuracy aware pixel selection in multi-wavelength μDBO metrology enables higher robustness and accuracy for DRAM.
26. Lithography PR profile improvement and defects reduction by film pre-treatment.
27. Excursion detection and root-cause analysis using virtual overlay metrology.
28. Method to improve the overlay image contrast and optimize the sub-segmentation mark.
29. A novel method of overlay variation study for 3D NAND channel hole.
30. Ellipsometric critical dimension metrology employing mid-infrared wavelengths for high-aspect-ratio channel hole module etch processes.
31. Introducing machine learning-based application for writer main pole CD metrology by dual beam FIB/SEM.
32. AFM line space trench and depth measurement of fan-out fine-pitch high aspect ratio redistribution layer structure.
33. An accurate and robust after-develop overlay measurement solution using YieldStar multi-wavelength optical metrology accompanied by a precise application strategy.
34. Absolute coordinate system adjustment and calibration by using standalone alignment metrology system.
35. Non-destructive depth measurement using SEM signal intensity.
36. Process variation impacts on optical overlay accuracy signature.
37. Accuracy enhancement in imaging-based overlay metrology by optimizing measurement conditions per layer.
38. Effects of lithography process conditions on unbiased line roughness by PSD analysis.
39. Imaging-based overlay metrology optimized by HV-SEM in 3D-NAND process.
40. Study of high throughput EUV mask pattern defect inspection technologies using multibeam electron optics.
41. Mark design challenge of cut layer in FinFet.
42. Data fusion by artificial neural network for hybrid metrology development.
43. Defect characterization of EUV Self-Aligned Litho-Etch Litho-Etch (SALELE) patterning scheme for advanced nodes.
44. Defect simulation in SEM images using generative adversarial networks.
45. Detection and correlation of yield loss induced by color resist deposition deviation with a deep learning approach applied to optical acquisitions.
46. Statistical process optimization method for metrology equipment.
47. Latent image characterization by spectroscopic reflectometry in the extreme ultraviolet.
48. Broadband scatterometry at extreme ultraviolet wavelengths for nanograting characterization.
49. Virtual metrology: how to build the bridge between the different data sources.
50. Recent advancements in atomic force microscopy.
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