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Start Over Author "Burkett F" Publisher nasa center for aerospace information (casi)
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1. Bonding aluminum beam leads

Author

Burkett, F. S

Subjects
Fabrication Technology
Abstract

Report makes it relatively easy for hybrid-circuit manufacturers to convert integrated circuit chips with aluminum bead leads. Report covers: techniques for handling tiny chips; proper geometries for ultrasonic bonding tips; best combinations of pressure, pulse time, and ultrasonic energy for bonding; and best thickness for metal films to which beam leads are bonded.

Published
1978

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