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Bonding aluminum beam leads
- Source :
- NASA Tech Briefs. 2(4)
- Publication Year :
- 1978
- Publisher :
- United States: NASA Center for Aerospace Information (CASI), 1978.
-
Abstract
- Report makes it relatively easy for hybrid-circuit manufacturers to convert integrated circuit chips with aluminum bead leads. Report covers: techniques for handling tiny chips; proper geometries for ultrasonic bonding tips; best combinations of pressure, pulse time, and ultrasonic energy for bonding; and best thickness for metal films to which beam leads are bonded.
- Subjects :
- Fabrication Technology
Subjects
Details
- Language :
- English
- ISSN :
- 0145319X
- Volume :
- 2
- Issue :
- 4
- Database :
- NASA Technical Reports
- Journal :
- NASA Tech Briefs
- Publication Type :
- Report
- Accession number :
- edsnas.19770000443
- Document Type :
- Report