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AlN, with its ultra-wide bandgap, is highly attractive for modern applications in deep ultraviolet light-emitting diodes and electronic devices. In this study, the surface and cross-sectional properties of AlN films grown on flat and nano-patterned sapphire substrates are characterized by a variety of techniques, including photoluminescence spectroscopy, high-resolution X-ray diffraction, X-ray photoelectron spectroscopy, ultraviolet photoelectron spectroscopy, and Raman spectroscopy. The results indicate that different sapphire substrates have minimal impact on the photoluminescence spectrum of the epitaxial films. As the temperature increased, the radius of curvature of the AlN films increased, while the warpage decreased. The AlN films grown on nano-patterned substrates exhibited superior quality with less surface oxidation. During the growth of AlN thin films on different types of substrates, slight shifts in the energy bands occurred due to differences in the introduction of carbon-related impurities and intrinsic defects. The Raman shift and full width at half maximum (FWHM) of the E2(low), A1(TO), E2(high), E1(TO), and E1(LO) phonon modes for the cross-sectional AlN films varied with the depth and temperature. The stress state within the film was precisely determined with specific depths and temperatures. The FWHM of the E2(high) phonon mode suggests that the films grown on nano-patterned substrates exhibited better crystalline quality.

Chip bonding, an essential process in power semiconductor device packaging, commonly includes welding and nano-silver sintering. Currently, most of the research on chip bonding technology focuses on the thermal stress analysis of tin–lead solder and nano-silver pressure-assisted sintering, whereas research on the thermal stress analysis of the nano-silver pressureless sintering process is more limited. In this study, the pressureless sintering process of nano-silver was studied using finite element software, with nano-silver as an interconnect material. Using the control variable method, we analyzed the influences of sintering temperature, cooling rate, solder paste thickness, and solder paste area on the residual stress and warping deformation of power devices. In addition, orthogonal experiments were designed to optimize the parameters and determine the optimal combination of the process parameters. The results showed that the maximum residual stress of the module appeared on the connection surface between the power chip and the nano-silver solder paste layer. The module warping deformation was convex warping. The residual stress of the solder layer increased with the increase in sintering temperature and cooling rate. It decreased with the increase in coating thickness. With the increase in the coating area, it showed a wave change. Each parameter influenced the stress of the solder layer in this descending order: sintering temperature, cooling rate, solder paste area, and solder paste thickness. The residual stress of the nano-silver layer was 24.83 MPa under the optimal combination of the process parameters and was reduced by 29.38% compared with the original value of 35.162 MPa.

One of the most important steps in the extrusion processing of ceramic inks is the initial drying of the ceramic parts. This study aimed to investigate the drying behaviour of an Al2O3-based ceramic ink optimised to be processed by extrusion processing methods, e.g., direct ink writing. Carboxymethylcellulose (CMC) was singly added to a suspension of deionised water and Al2O3 (50:50 wt.%) to perform as a dispersing and plasticising agent. To assess moisture loss as a function of time, the ceramic inks were extruded into two types of polymeric moulds: one with a completely closed profile producing cylindrical samples (disks) and one with an open profile producing ceramic bars. After the injection of the inks, the moulds were exposed to different controlled temperatures (20 and 40 °C) for up to 180 h; moisture loss and warpage were periodically measured, and exponential mathematical expressions (moisture loss × drying time) were obtained. The Al2O3-bars dried for 24 h in open moulds at 20 and 40 °C presented longitudinal warpages of 4.5% and 9%, respectively, while the Al2O3 disks dried in closed moulds presented warpages of 3.5% and 7% in these same temperatures (20 and 40 °C, respectively). The samples were sintered at 1610 °C for 4 h and characterised by scanning electron microscopy (SEM), relative density (Archimedes principle), and X-ray diffraction (XRD), presenting a relative density of 92.3 ± 0.5%, α-Al2O3 as crystalline phase and grain with equiaxed morphology varying between 1 and 5 μm.

The food industry holds immense promise for 3D printing technology. Current research focuses mainly on optimizing food material composition, molding characteristics, and printing parameters. However, there is a notable lack of comprehensive studies on the shape changes of food products, especially in modeling and simulating deformations. This study addresses this gap by conducting a detailed simulation of the starch gel printing and deformation process using COMSOL Multiphysics 6.2 software. Additive manufacturing (AM) technology is widely acclaimed for its user-friendly operation and cost-effectiveness. The 3D printing process may lead to changes in part dimensions and mechanical properties, attributable to the accumulation of residual stresses. Studies require a significant amount of time and effort to discover the optimal composition of the printed material and the most effective deformed 3D structure. There is a risk of failure, which can lead to wasted resources and research delays. To tackle this issue, this study thoroughly analyzes the physical properties of the gel material through COMSOL Multiphysics 6.2 software, It simulates the heat distribution during the 3D printing process, providing important insights into how materials melt and solidify. Three-part models with varying aspect ratios were meticulously designed to explore shape changes during both the printing process and exposure to an 80 °C environment, employing NMR and rheological characterization. Using the generalized Maxwell model for material simulation in COMSOL Multiphysics, the study predicted stress and deformation of the parts by analyzing solid heat transfer and solid mechanics physical fields. Simulation results showed that among three models utilizing a gel-PET plastic membrane bilayer structure, Model No. 1, with the largest aspect ratio, exhibited the most favorable deformation under an 80 °C baking environment. It displayed uniform bending in the transverse direction without significant excess warpage in the edge direction. In contrast, Models No. 2 and No. 3 showed varying degrees of excess warpage at the edges, with Model No. 3 exhibiting a more pronounced warpage. These findings closely aligned with the actual printing outcomes.

Analyses in the present work focus on understanding the influence of the WAAM (wire arc additive manufacturing) deposition pattern and travel speed on residual stress and warpage in aluminum alloy. The thermal profiles are analyzed using thermomechanical FE simulations. Analysis shows that the out–in deposition pattern leads to the highest level of residual stress and warpage. It is also found that an increase in the travel speed decreases the peak temperature and thermal gradient during the AM deposition, which results in a lower level of residual stress generation. A comparison of results for the line-type patterns (raster and alternate) suggests that the deposition interval between each deposition has little influence on thermal profiles, residual stress generation, and warpage. However, the contour-type patterns significantly affect the heat transfer, thermal gradient, and cooling rate during the AM deposition.

We investigate the microstructural evolution of electrochemically deposited poly-crystalline Cu films during subsequent thermal process cycles at mild maximum temperatures, compatible with the integration in advanced metallization schemes for electronic device manufacturing. The modifications induced by the thermal budget have been characterized at different scales (from the film-substrate interface to the wafer scale) with different complementary techniques: X-ray Diffraction (XRD), scanning electron microscopy (SEM), atomic force microscopy (AFM), and dynamical warpage measurements. Moreover, the film internal grains’ evolution has been modelled by a tri-dimensional on-cell model, derived by the Pott-like multi-states configurational energy dependence, able to consider multiple orientation of the grains and densification kinetics in the canonical ensemble. Finally, a macroscopic model of the warpage dependence on the process conditions is discussed. The presented joint theoretical and experimental analysis provides a complete and consistent scenario of the grain densification phenomenon and its impact for the Cu film microstructure and the composite system morphology, indicating several strategies for the integration of the process in real device structures.

The successful handling of large semiconductor wafers is crucial for scaling up their production. Early-stage warpage control allows the prevention of undesirable asymmetric warpage, known as wafer bifurcation or buckling. Indeed, even in a gravity-free environment, thinning an 8″ or 12″ semiconductor wafer can result in warpage and bifurcation. To mitigate this issue, the taiko method, which involves creating a thicker ring region around the rim of the wafer, has been widely used. Previous research has focused on the theoretical factors affecting the warpage of a backside metalized taiko wafer. This work extends the case to a front-side metalized taiko wafer and introduces the concept of the equivalent thickness of a taiko wafer. The equivalent thickness of a taiko wafer, influenced by the ring region, lies in between the thickness of the central region and that of the annular region. Because of the limited number of taiko wafers that can be produced on a production line, modelling can be beneficial. In this work we compared the results of a developed analytical model with those obtained from a finite element analysis (FEA) approach with ANSYSY® Mechanical Enterprise 2022/R2 software to model the equivalent thickness of a taiko wafer. We investigated the curvature as a function of the stress of the metal layer, considering key design factors such as the substrate region thickness, the thickness of the thin metal film, the step height, and the width of the ring region. By systematically varying the thickness of the central region of the taiko wafer, we explored the curvature as a function of stress induced by thermal load in the linear regime and determined the slopes in the linear region of the curvature vs. stress curves. The aim of this study is to identify regularities and similarities with the Stoney equation and investigate the validity of the analytical approach for the case of a taiko substrate. The results show that there is a good agreement between the analytical model of a taiko wafer and the numerical analysis gained by the FEA methods.

Vertical graphene (VG) combines the excellent properties of conventional graphene with a unique vertical nanosheet structure, and has shown tremendous promise in the field of electronics and composites. However, its complex surface morphology brings great difficulties to micro-nano fabrication, especially regarding photolithography induced nanosheet collapse and remaining chemical residues. Here, we demonstrate an innovative method for directly growing patterned VG on a SiO2/Si substrate. A patterned Cr film was deposited on the substrate as a barrier layer. The VG was synthesized by PECVD on both the patterned Cr film and the exposed SiO2/Si substrate. During the cooling process, the patterned Cr film covered by VG naturally peeled off from the substrate due to the thermal stress mismatch, while the VG directly grown on the SiO2/Si substrate was remained. The temperature-dependent thermal stress distribution in each layer was analyzed using finite element simulations, and the separation mechanism of the Cr film from the substrate was explained. This method avoids the contamination and damage caused by the VG photolithography process. Our work is expected to provide a convenient and reliable solution for the manufacture of VG-based electronic devices.

The deformation mechanism is complex in the hot rolling process of clad plates, and head bending is a common defect. In this paper, an analytical computational mechanical model of a metal plate was established by the classical elastic mechanics method, and the relationship between uneven thickness extension and warpage was obtained. The hot rolling bonding process of dissimilar bimetallic plates of Ti/Steel was investigated. On this basis, the mechanical origins of the plate bending defects and the influence of various factors on the evolution of the plate bending defects of the metal plates were revealed. The results indicated that the rolling forces increased with the increase in reduction ratio and thickness ratio. As the total reduction ratios of the clad plates increased, the reduction ratio of each layer increased. Furthermore, it was found that the thickness reduction ratios of steel were larger than those of Ti at a certain total reduction ratio, which could reach up to 59.6%. When the reduction ratios were 0.4 and 0.45, the bending degree increased with the thickness ratio of the upper and lower plates increasing gradually. The maximum warpage could reach 0.349 m. The clad plate shape was better when the roll speed ratio was 1.02 and the reduction rate was 0.4. The present numerical results provide a valuable insight into the deformation behaviors and mechanisms involved in the hot rolling of clad plates.

In this work, the authors aimed to identify a potential correlation between the printability and crucial rheological characteristics of materials involved in fused deposition modeling (FDM) technology. In this regard, three different poly(lactide) acid (PLA)-based filaments (two commercially available (here called V-PLA and R-PLA) and one processed in a lab-scale extruder (here called L-PLA)) have been considered. Dynamic rheological testing, in terms of frequency sweep at five different temperatures (130, 150, 170, 190, and 210 °C), was performed. Rheological properties expressed in terms of viscoelastic moduli and complex viscosity curves vs. frequency, characteristic relaxation times, activation energy (Ea), zero shear viscosity (η0) and shear thinning index (n) were derived for each material. A characteristic relaxation time of around 0.243 s was found for V-PLA, a similar value (0.295 s) was calculated for R-PLA filaments, and a lower value of about an order of magnitude was calculated for L-PLA filament (~0.0303 s). The activation energy and shear thinning index resulted to be very comparable for all the filaments. On the contrary, V-PLA and R-PLA possessed a zero-shear viscosity (~104 Pa*s at 170 °C) much higher than L-PLA (~103 Pa*s). All the filaments were processed in a 3D printer, by attesting the effect of nozzle temperature (180, 190, and 210 °C, respectively) on printing process, and macroscopic shaping defects in printed objects. Final considerations allowed us to conclude that polymer relaxation time, zero-shear viscosity, and melt viscosity (affected by printing temperature) were critical parameters affecting the printing quality.

This study focuses on the flexural properties of the layered wall structures of plastic tanks produced by rotational molding technology. The aim was to assess the possibility of replacing the homogeneous walls of rotationally cast large-volume underground tanks with structural walls for stability and warpage prevention. The possibilities of material saving by combining lightweight and non-lightweight tank wall layers were investigated. By applying the engineering theory of bending inhomogeneous layered walls, the flexural rigidity values of the walls of the tanks of different structures were determined. The values of the flexural rigidity of the tank wall samples produced by rotomolding technology were determined experimentally. Moreover, a comparison of the calculated and experimentally determined flexural rigidity values of the layered walls and optimization of these structures was carried out. In the case under study, it was theoretically and experimentally confirmed that the optimum ratio of compact layer thickness versus total wall thickness is given by the resulting value: t1OPT = 0.189 h.

As a vital component of electronic products, the quality of the printed circuit board (PCB) assembly directly affects the applications and service life. During the reflow soldering process, the PCB assembly may suffer excessive warpage. Therefore, in order to avoid such a failure, this paper conducts the finite element simulation of the PCB assembly temperature change and the deformation process according to a theoretical model for heat transfer and then explores the causes of warpage and predicts the percentage of warpage that occurs during the reflow soldering. A reliability sensitivity analysis is creatively applied in the PCB assembly warpage study in order to uncover the quantitative influence of multiple factors with random errors on warpage. Moreover, the reliability calculation provides a theoretical basis for the allowable error range of geometric dimensions, material properties and process parameters of the PCB assembly. This research has a remarkable significance and is valuable to engineering in promoting quality and reliability, and increasing the yield of PCB assembly in mass production.

The growing demand for wood and the continued increase of the raw material price have resulted in companies using more efficient wood resources in wood-based products such as blockboard. These boards are used in the field of interior design, especially. The aim of this research was to evaluate the effect of variable environmental conditions on the physical and mechanical properties of blockboard (BK). Two types of commercial BK were exposed in variable environmental conditions (kitchen, bathroom and climatic chamber) for three months. The BK structures were composed of veneer (V) and high-density fibreboards (HDF) for the face sheets and glued, solid wood, resinous strips for the core. The temperature and relative humidity of the air (RH) ranged from 18 °C to 25 °C and from 25% to 90%, respectively. In the climatic chamber (CC), the dynamics of the parameter variations were different than in the other two exposure climates, being determined by the programmed cyclic changes in RH. The changes observed on physical and mechanical properties were more extreme for the blockboards tested in the CC than in the kitchen (K) and bathroom (Ba). After 3 months of exposure in the CC, the thickness and weight of the boards increased by 1.8 and 1.1 times, respectively, for veneered BK, and by 4.4 and 0.4 times, for BK with HDF faces, compared to values recorded in the kitchen. The panels exposed in the CC exhibited the highest increase in moisture content (MC): 41% for veneered BK and 82% for BK with HDF faces after three months of exposure, followed by those exposed in the bathroom and kitchen. Increases in MC determined decreases of flexural properties and soundness surfaces, more evident for HDF face structures compared to V ones.

Electrochemical deposited (ECD) thick film copper on silicon substrate is one of the most challenging technological brick for semiconductor industry representing a relevant improvement from the state of art because of its excellent electrical and thermal conductivity compared with traditional materials, such as aluminum. The main technological factor that makes challenging the industrial implementation of thick copper layer is the severe wafer warpage induced by Cu annealing process, which negatively impacts the wafer manufacturability. The aim of presented work is the understanding of warpage variation during annealing process of ECD thick (20 μm) copper layer. Warpage is experimentally characterized at different temperature by means of Phase-Shift Moiré principle, according to different annealing profiles. Physical analysis is employed to correlated the macroscopic warpage behavior with microstructure modification. A linear Finite Element Model (FEM) is developed to predict the geometrically stress-curvature relation, comparing results with analytical models.

Thin-walled structures are of great interest because of their use as lightweight components in aeronautical and aerospace engineering. The fabrication of these components by additive manufacturing (AM) often produces undesired warpage because of the thermal stresses induced by the manufacturing process and the components’ reduced structural stiffness. The objective of this study is to analyze the distortion of several thin-walled components fabricated by Laser Powder Bed Fusion (LPBF). Experiments are performed to investigate the sensitivity of the warpage of thin-walled structures fabricated by LPBF to different design parameters such as the wall thickness and the component height in several open and closed shapes. A 3D-scanner is used to measure the residual distortions in terms of the out-of-plane displacement. Moreover, an in-house finite element software is firstly calibrated and then used to enhance the original design in order to minimize the warpage induced by the LPBF printing process. The outcome of this shows that open geometries are more prone to warping than closed ones, as well as how vertical stiffeners can mitigate component warpage by increasing stiffness.

A geometrical modification on silicon wafers before the bonding process, aimed to decrease (1) the residual stress caused by glass frit bonding, is proposed. Finite element modeling showed that (2) by introducing this modification, the wafer out-of-plane deflection was decreased by 34%. Moreover, (3) fabricated wafers with the proposed geometrical feature demonstrated an improvement for the (4) warpage with respect to the plain wafers. A benefit for curvature variation and overall shape of the (5) bonded wafers was also observed.

Glass/carbon fiber reinforced plastic (GFRP/CFRP) and hybrid components have attracted increasing attention in lightweight applications. However, residual stresses induced in the manufacturing process of these components can result in warpage and, eventually, negatively affect the mechanical performance of the composite structures. In the present work, GFRP, CFRP, GFRP/steel and CFRP/steel hybrid components were manufactured through the prepreg-press-technology always employing the same process parameters. The residual stresses of these components were measured through the hole drilling method (HDM), based on an adequate formalism to evaluate the residual stresses for orthotropic materials including the calculation of the calibration coefficients via finite element analysis (FEA). In FEA, the real material lay-up and mechanical properties of the samples were considered. The warpage induced by residual stresses was measured after the samples were removed from the tool. The measured residual stresses and warpage of four different types of samples were compared and results were analyzed in depth. The results obtained can be extended to other hybrid materials and even could be used for designing multi-stable laminates for application in adaptive structures. Moreover, the effects of the drilling process parameters of HDM, e.g., the drilling speed, the drilling increment and the zero-depth setting, on the resulting residual stresses of GFRP were investigated. The reliability of residual stress measurements in GFRP using HDM was validated through mechanical bending tests. The conclusions concerning the choice of optimal drilling parameters for GFRP could be directly applied for other types of samples considered in the present work.

In this work, a method that minimizes printed wiring board (PWB) warpage by dummy pattern design is proposed. This work suggests that dummy patterns are placed on a preset discretized location in the PWB to reduce the warpage. On each discretized candidate area, the dummy pattern can be set or unset. The warpage is numerically simulated based on direct modeling of the as-is PWB patterns to evaluate the warpage alongside the dummy pattern design set. The optimal pattern that minimizes warpage is determined using the human-based genetic algorithm where the objective function is evaluated by the structural simulation. The optimization method is realized in a spreadsheet that allows scripting language with which the input and output files of the simulation tool can be modified and read. Two different cases have been tested and the results show that the method can determine the optimal dummy patterns. The measured and simulated deflections agree well with each other. Moreover, it has been shown that certain dummy pattern designs that should reduce the warpage can be sought by the optimization.

Wire and arc additive manufacturing of stiffened ribs for fabricating large integral panel components holds promise for lightweight construction, but stress and warpage remain intractable problems. This work take stress in central lines as a research focus, theoretically analyzes stress evolution along central lines without a stress distribution hypothesis, then further develops prediction models of warpage, based on general beam theory. The stress and warpage models are then verified by experimental results. The results showed that below 40 layers, the stress in the top layer increased rapidly to the yield strength. Following the continuous deposition of up to 100 layers, stress increased slowly, then gradually trended to a constant level. After 100 layers of deposition, the top-layer-plane stress in the 10th layer decreased from 68 MPa to 5 MPa, and the plane stress in the 90th layer decreased from 296 MPa to 245 MPa. Post-heating treatment effect was important for temperature uniformity. The largest warpage (3.48 mm) happened when stiffener was designed as 30 layers.

Plastic lenses are light and can be mass-produced. Large-diameter aspheric plastic lenses play a substantial role in the optical industry. Injection molding is a popular technology for plastic optical manufacturing because it can achieve a high production rate. Highly efficient cooling channels are required for obtaining a uniform temperature distribution in mold cavities. With the recent advent of laser additive manufacturing, highly efficient three-dimensional spiral channels can be realized for conformal cooling technique. However, the design of conformal cooling channels is very complex and requires optimization analyses. In this study, finite element analysis is combined with a gradient-based algorithm and robust genetic algorithm to determine the optimum layout of cooling channels. According to the simulation results, the use of conformal cooling channels can reduce the surface temperature difference of the melt, ejection time, and warpage. Moreover, the optimal process parameters (such as melt temperature, mold temperature, filling time, and packing time) obtained from the design of experiments improved the fringe pattern and eliminated the local variation of birefringence. Thus, this study indicates how the optical properties of plastic lenses can be improved. The major contribution of present proposed methods can be applied to a mold core containing the conformal cooling channels by metal additive manufacturing.

The silicon wafers for solar cells on which the paste is deposited experience a bowing phenomenon. The thickness of commonly used c-Si wafers is 180 μm or more. When fabricating c-Si solar cells with this wafer thickness, the bowing value is 3 mm or less and the problem does not occur. However, for the thin c-Si solar cells which are being studied recently, the output reduction due to failure during manufacture and cracking are attributed to bowing. In generally, it is known that the bowing phenomenon arises mainly from the paste applied to the back side electrode of c-Si solar cells and the effects of SiNx (silicon nitride) and the paste on the front side are not considered significant. The bowing phenomenon is caused by a difference in the coefficient of expansion between heterogeneous materials, there is the effect of bowing on the front electrode and ARC. In this paper, a partially processed c-Si solar cell was fabricated and a bowing phenomenon variation according to the wafer thicknesses was confirmed. As a result of the experiment, the measured bow value after the firing process suggests that the paste on the front-side indicates a direction different from that of the back-side paste. The bow value increases when Al paste is deposited on SiNx. The fabricated c-Si solar cell was analyzed on basis of the correlation between the bowing phenomenon of the materials and the c-Si wafer using Stoney’s equation, which is capable of analyzing the relationship between bowing and stress. As a result, the bowing phenomenon of the c-Si solar cell estimated through the experiment that the back side electrode is the important element, but also the front electrode and ARC influence the bowing phenomenon when fabricating c-Si solar cells using thin c-Si wafers.

Measurements of the curvatures and warpages of a printed circuit board (PCB) during a thermal solder reflow process using strain gauges are proposed in this study. In the experiments, a shadow moiré is used for measuring the out-of-plane deformations (or warpage) of a bi-material plate and a PCB with dual in-line memory module (DIMM) sockets during solder reflow heating, while the finite element method (FEM) is used to analyze the thermally-induced deformation of the PCB specimen for ensuring the validity of the measurement. Conventional strain gauges are employed to measure the strains (albeit as in-plane strain data) in both specimens during the solder reflow process. The results indicate that the strain gauge-measured strain data from the top and bottom surfaces of both specimens during the solder reflow can be converted into curvature data with specific equations, and even into global out-of-plane deformations or warpages with a proposed simple beam model. Such results are also consistent with those from the shadow moiré and FEM. Therefore, it has been proved that the strain gauge measurement associated with the simple beam model can provide a method for the real-time monitoring of PCB deformations or warpages with different temperatures during the solder reflow process.

Anode-supported cells are prepared by a sequence of hot pressing and co-sintering processes for solid oxide fuel cell (SOFC) applications. Commercially available porous anode tape (NiO/YSZ = 50 wt %/50 wt %), anode tape (NiO/YSZ = 30 wt %/70 wt %), and YSZ are used as the anode substrate, anode functional layer, and electrolyte layer, respectively. After hot pressing, the stacked layers are then sintered at different temperatures (1250 °C, 1350 °C, 1400 °C and 1450 °C) for 5 h in air. Different compressive loads are applied during the sintering process. An (La,Sr)MnO3 (LSM) paste is coated on the post-sintered anode-supported electrolyte surface as the cathode, and sintered at different temperatures (1100 °C, 1150 °C, 1200 °C and 1250 °C) for 2 h in air to generate anode-supported cells with dimensions of 60 × 60 mm2 (active reaction area of 50 × 50 mm2). SEM is used to investigate the anode structure of the anode-supported cells. In addition, confocal laser scanning microscopy is used to investigate the roughness of the cathode surfaces. At sintering temperatures of 1400 °C and 1450 °C, there is significant grain growth in the anode. Furthermore, the surface of the cathode is smoother at a firing temperature of 1200 °C. It is also found that the optimal compressive load of 1742 Pa led to a flatness of 168 µm/6 cm and a deformation of 0.72%. The open circuit voltage and power density of the anode-supported cell at 750 °C were 1.0 V and 178 mW·cm−2, respectively.