Author: "Benjamin Leyrer" / Publisher: japan institute of electronics packaging - Searchworks@Jio Institute Digital Library Search Results

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Your search keyword '"Benjamin Leyrer"' showing total 2 results

Start Over Author "Benjamin Leyrer" Publisher japan institute of electronics packaging

2 results on '"Benjamin Leyrer"'

1. Bonding Abilities of Pressure-assisted Sintered Copper for Die-Bonding of Large Chips

Author: Marc Weber, Bao Ngoc An, Hideo Nakako, Matthias Mail, Helge Wurst, Benjamin Leyrer, Dai Ishikawa, and Thomas Blank
Subjects: Molecular dynamics, Die bonding, Materials science, chemistry, chemistry.chemical_element, Composite material, Copper
Published: 2020
Full Text: View/download PDF

2. Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process

Author: Suguru Ueda, Matthias Mail, Marc Weber, Bao Ngoc An, Helge Wurst, Kawana Yuki, Dai Ishikawa, Thomas Blank, Benjamin Leyrer, and Hideo Nakako
Subjects: Bonding process, Die bonding, Molecular dynamics, Materials science, Bonding strength, Shear strength, Pressureless sintering, Composite material
Published: 2020
Full Text: View/download PDF

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