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Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process
- Source :
- Transactions of The Japan Institute of Electronics Packaging. 13:E19-017
- Publication Year :
- 2020
- Publisher :
- Japan Institute of Electronics Packaging, 2020.
Details
- ISSN :
- 18848028 and 18833365
- Volume :
- 13
- Database :
- OpenAIRE
- Journal :
- Transactions of The Japan Institute of Electronics Packaging
- Accession number :
- edsair.doi...........ebf6820b38ab13ff4bd6adbc333a4323
- Full Text :
- https://doi.org/10.5104/jiepeng.13.e19-017-1