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Sn–Ag alloys are gaining importance among microelectronics manufacturers because of their potential benefits, e.g., low melting point, excellent wetting to common metallic substrates, and superior mechanical properties required for microelectronic packaging devices. In this work, Sn–Ag alloy was co-deposited from acidic citric acid bath on copper substrates. The plating solution was composed of SnSO4, Ag2SO4, thiourea, and citric acid as a supporting electrolyte. Further, the influence of current density on the Ag content of the coatings was studied. The results indicate that the citric acid bath produces bright Sn–Ag deposits over a wide range of current densities. The grains of the deposits obtained were bigger at lower current densities (10–30 mA cm−2) and become finer at higher current densities (40–50 mA cm−2). Initially, the coatings were very hard and become soft as the current density increases gradually due to the decreased amount of Ag in the deposit which modified the coating solderability.

Severe plastic deformation (SPD) is an attractive processing method for refining microstructures of metallic materials to give ultrafine grain sizes within the submicrometer to even the nanometer levels. Experiments were conducted to discuss the evolution of hardness, microstructure and strain rate sensitivity, m, in a Zn-22% Al eutectoid alloy processed by high- pressure torsion (HPT). The data from microhardness and nanoindentation hardness measurements revealed that there is a significant weakening in the Zn-Al alloy during HPT despite extensive grain refinement. Excellent room-temperature (RT) plasticity was observed in the alloy after HPT from nanoindentation creep in terms of an increased value of m. The microstructural changes with increasing numbers of HPT turns show a strong correlation with the change in the m value. Moerover, the excellent RT plasticity in the alloy is discussed in terms of the enhanced level of grain boundary sliding and the evolution of microsturucture.