Microstructure, mechanical properties, and drop reliability of CeO2 reinforced Sn–9Zn composite for low temperature soldering.

Details

Language :

English

ISSN :

20531591

Volume :

6

Issue :

5

Database :

Complementary Index

Journal :

Materials Research Express

Publication Type :

Academic Journal

Accession number :

134953092

Full Text :

https://doi.org/10.1088/2053-1591/ab0225