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This paper reports the interconnection design and analysis of the embedded IC package. Instead of real chips, we used a dummy chip made of silicon. Dummy chip is GCPW structure and chip's lower ground is not in the chip back but below 20 μm polymer. The thickness of dummy IC is 100 μm and the depth of the cavity is 110 μm. An organic lamination process fills the gap between the inserted chip and the cavity and forms a flat insulating layer. The interconnection for the two inserted dummy ICs was realized using the patterning process, with a very short length of 400 μm. By forming sufficient via holes, the parasitic resonance caused by the cavity is minimized. As a result, the loss of the interconnection is less than 0.25 dB and return loss is more than 30 dB at all measured frequency.

In this paper, a new design method of a tunable oscillator using a suspended-stripline resonator is presented. The negative resistance of an FET mounted on microstrip line (MSL) is combined with a high Q suspended-stripline (SSL) resonator to produce a tunable oscillator with good phase noise. The new MSL-to-SSL transition facilitates easy connection between the MSL-based circuits and the SSL module. The proposed oscillator is also frequency-tunable using a tuner located on the top of the SSL housing. The measured phase noise of the implemented oscillator at 5.148 GHz is −104.34 dBc@100 kHz and −133.21 dBc@1 MHz with 125.7 MHz of frequency tuning.

Face detection is required prior to various face-related applications. The objective of face detection is to determine whether or not there are any faces in an image and, if any, the location of each face is shown. Face detection in a natural scene image is challenging due to large variability of face appearances. This paper proposes a face detection algorithm using the 3×3 block rank patterns of gradient magnitude images and a geometrical face model. The 3×3 block rank patterns are used to roughly classify whether the detected face candidate region contains a face or not. Finally, the face, if any, is detected by using a geometrical face model. Experimental results show that the proposed face detection algorithm is insensitive to illumination in natural scene images.

This paper presents a method for estimating the parameters of dynamic models for induction motor dominating loads. Using particle swarm optimization, the method finds the adequate set of parameters that best fit the sampling data from the measurement for a period of time, minimizing the error of the outputs, active and reactive power demands and satisfying the steady-state error criterion.

This paper presents a practical method for long-term voltage stability simulation based on a governor-response power flow. Governor-response power flow (GRPF) can be used to model the long-term system responses at instants several seconds after disturbances. In this paper, it is postulated that the GRPF model can capture the state before load restoration begins in contingent conditions for the system with sufficiently slow load restoration characteristic. This paper describes the simulation results applying the proposed simulation to the modified New England 39-bus system.

This document is, analytical characteristics of H 2 S gas detection technique were investigated against major reduced Volatile Sulfur Compounds. To analyze such properties, an analytical system using near infrared tunable laser, the analysis of gas shells utilizing the system, and other technologies for its applications. The system using absorption spectroscopy and the results were examined. The results of our analysis the results of comparison between the HITRAN peak wavelengths and experimental ones, which shows that they almost agree with up to 20pm deviation. The measurement limit of the absorption spectroscopy detection of H 2 S gas in this study can be derived to be 20pm. From this study, we can conclude that the absorption spectroscopy detection systems using wavelength tunable lasers could be utilized not just for H 2 S but other odor gases like NH 3 and HCHO, and they could be applied for the simultaneous detection of Volatile Sulfur compounds, and for quantitative as well as qualitative analysis of amounts and types. Prospects for the development and application of tunable diode laser spectroscopy to trace gas analysis in medicine are also dicussed.

Various types of ultra-wideband components with 10's of GHz bandwidth have been developed utilizing a uniplanar ultra-wideband balun, which is a simple microstrip-to-coplanar stripline (CPS) transition structure with the operating frequency range from near DC to over 40 GHz. Developed ultra-wideband components include antennas, mixers, doublers and detectors in a carrier type or in a surface mountable type. These high-performance, low-cost ultra-wideband components may replace expensive conventional components, and also can be used to develop new multi-GHz UWB application areas.

Mobile WiMAX, one of the high-speed mobile telecommunications networks, has been seeing that Micro-cell and Pico-cell are gradually increasing now. As a result, there were frequent occurrences of Handovers, and alot of failures in network connection. Within a standard frame of IEEE 802.16, a vulnerability in a Network was pointed out because even though it was an optical Handover, which maintains QoS (Quality of Service) and supports a fast mobility of MS (Mobile Station), it skips authentication procedures with a seamless connection. So this article suggests a high-security a partially-coded Handover method, with a real-time service given, such as VoIP (Voice Over IP) and Video Streaming. A number of evaluations show that this one is superior to other existing ones.

Ultra-wideband antennas can be systematically and simply designed utilizing a new ultra-wideband planar balun, which is a microstrip-to-CPS (coplanar stripline) transition. The new balun has the operating bandwidth of over 40 GHz. With the proposed balun as an antenna feed, design examples of three types of antennas are presented. Comparisons of simulated and measured results demonstrate validity of the design procedure.

A recently developed ultra-wideband (UWB) balun opens new possibilities for the low-cost, mass-producible, and surface mountable UWB components with 10psilas of GHz bandwidth. The balun is a simple microstrip-to-coplanar stripline transition structure, but a single balun can be designed to have operating frequency range from DC to over 40 GHz. The balun design is based on optimal impedance matching and smooth field transformations between adjacent transmission lines. Utilizing this uniplanar balun, new low-cost and mass-producible components-e.g., mixers, doublers, antennas, detectors, differential amplifiers, etc.-with 10psilas of GHz bandwidth are being developed. The new UWB components can also be designed in the form of low-cost surface-mountable chips, which may open new commercial UWB application areas. In this presentation, the design of the ultra-wideband balun will be described, and recent developments of new UWB components utilizing the balun will also be introduced.

A new low-cost design for a planar balanced doubler with ultra-wide bandwidth is presented. This doubler utilizes two types of ultra-wideband transitions: microstrip-to-CPW (coplanar waveguide) and microstrip-to-CPS (coplanar stripline) transitions. The transitions are designed to provide field and impedance matching between adjacent transmission lines. The fabricated doubler provides less than 10 dB conversion loss for output frequencies from 9 GHz to 26 GHz and less than 12 dB conversion loss from 7 GHz to 38 GHz.

In IETFpsilas fast mobile IPv6, the mobile node may switches into the reactive mode of handover operation when the prediction of the movement is wrong. In this case, the mobile node may experience severe service disruption due to large handover latency and packet loss. In order to solve this problem, we propose a fast mobile IP handover with multiple pre-registration. In the proposed approach, the new IP addresses are prepared in advance at multiple locations where the mobile node may probably moves into. If the predictive mode of handover operation by FMIPv6 fails, the mobile node tries to move into the previously prepared locations. Therefore, delay time of generating new care-of-address is saved. We have built a prototype system, and measure the performance of the proposed system. The experimental results show that the proposed approach can reduce greatly the handover latency.

A novel ultra-wideband microstrip-to-CPS (coplanar stripline) transition has been developed. The transition is designed to provide the field and impedance matching between adjacent transmission lines. The proposed design is applicable to substrates with any dielectric constant. The transition provides the balun role as well as the impedance transformation. The fabricated transition in back-to-back configuration provides the insertion loss less than 1 dB per transition and the return loss better than 10 dB for frequencies from 5.39 GHz to over 40 GHz. In addition, a simulation study indicates that this transition can possess a 3 dB bandwidth of ~ 100 GHz.

A new UWB antenna in bow-tie-type has been designed and implemented by utilizing the new ultra-wideband balun. In order to reduce antenna size, the balun is bended without sacrificing the balun performance. The fabricated antenna provides the operating frequency ranges from 3.2 to 11.2 GHz covering for the whole UWB frequency. The antenna maintains gains from 2.5 - 4.9 dBi for the operating frequencies with quasi- omni directional radiation patterns.

A new, systematic, simplified design procedure for quasi-Yagi antennas is presented. The design is based on the simple impedance matching among antenna components: i.e., transition, feed, and antenna. This new antenna design is possible due to the newly developed ultra-wideband transition. As design examples, wideband quasi- Yagi antennas are successfully designed and implemented in Ku- and Ka-bands with frequency bandwidths of 53.2% and 29.1%, and antenna gains of 4-5 dBi and 5.2-5.8 dBi, respectively. The design method can be applied to other balanced antennas and their arrays.

Two types of ultra-wideband tapered slot antennas (TSAs) are designed at millimeter-wave frequencies using the new microstrip-to-CPS transition (balun). Since the antenna feed structure including the balun provides wider bandwidth than TSA antennas, the overall bandwidth of the antenna is not noticeably changed with the feed structure. The designed antennas (LTSA and ETSA) show ultra-wideband performance from 23 to over 80 GHz. The antenna gain of LTSA ranges from 7 to 12 dB, and the front-to-back ratio from 12 to 20 dB. The antenna gain of ETSA ranges from 8 to 10 dB, and the front-to-back ratio from 14 to 30 dB.

Ambient light sensor (ALS) products are gaining popularity as one of the most effective solution for power management and display quality enhancement in electronic products and systems. The battery life for mobile phones, notebook computers, PDAs, and digital cameras can be extended significantly by automatic brightness control through ambient light sensor (ALS) feedback. A recent study shows that the display backlight represents one-third of the total battery drain in a notebook computer. It is also possible to achieve a more comfortable display quality with human eye-like sensing features. Automotive applications, room lighting, and advanced color sensing are other application areas for ALS that have been changing our daily life. Intersil has successfully developed ALS products with 5-, 6-, and 8-pin package configurations. A figure in the paper shows an example of an ALS product, EL7900, with a compact 5-pin QFN package format. EL7900 and ISL29000 are light-to-current optical sensors, integrating a photodiode and current amplifier for a simple current output sensor. Intersil has also developed light to digital output sensors in 8-pin packages, namely, ISL29001 and ISL29002, combining a photodiode, current amplifier, filter, ADC and an I/sup 2/C output.

To meet the electronic industry's growing demand for higher memory densities, the packaging industry has come up with solutions that allow multiple devices to be packaged within the same package footprint. These solutions are based on either die stacking or package stacking. This work discusses one such package stacking solution, called /spl mu/Z/spl trade/-Ball Stack package. While the focus of this paper is on the thermal performance characterization of the package, certain valuable insights on the design and electrical performance are also presented.

The trend towards miniaturization and increased functionality has pushed for packaging more than one die together, while maintaining chip scale. Multi-chip packages consist of either vertical stacking of the die to reduce package footprint and/or placing dies adjacent to each other to improve functionality. The challenge lies in continuing to reduce the size while satisfying the stringent thermal, mechanical and electrical requirements of the wireless industry. One such solution in this area is the folded stacked technology developed by Tessera Technologies. In this design, the dies are placed side-by-side onto a substrate, which is then folded appropriately to obtain a low profile multi-chip CSP package. Their design allows the flexibility of different die sizes and die pad configurations to cater to different applications. Any multi-chip solution carries along with it the concern over its capability to dissipate heat quickly and effectively to prevent overheating of the die. Thus this work focuses on studying the thermal performance characteristics of a multi-die folded stack package.

The trend towards miniaturization of electronic devices has pushed the microelectronics packaging industry towards multi-die packaging where both the package footprint and the height are required to be as small as possible. This paper presents a folded stacked package that has many advantages including an extremely thin profile (four memory dies were successfully stacked with an overall height of only 1.2 mm), the ability to stack identical die, and a manufacturing process based on that of the familiar lead bonded /spl mu/BGA/spl reg/ package. These stacked packages can also be made with wire bonded structure, but with some increased package height and overall dimensions. An additional required step, the substrate folding process, must be thoroughly understood in order to ensure high reliability. As the /spl mu/BGA package has high reliability, the key to ensuring high reliability of the folded stacked package is to minimize any interaction due to folding between individual dies. A folding design rule has been developed for this purpose. Fast-cure adhesive materials were also evaluated to minimize the folding process time. To minimize overall package height, a 140 /spl mu/m ball height was used and a compatible test socket contact mechanism was identified. Also, electrical and thermal performance of the package were determined to assess the suitability of this package for various applications.

An ultra-thin, crack-free, and bottom leaded package (BLP) has been developed. Its manufacturability and reliability have been tested for mass production purposes. The design advantage of size comes from the removal of the outer leads from the conventional lead frame configuration. Therefore, the encapsulated chip conducts electrical signals through the bottom side of the package. With the help of the this new design concept, the thickness of the package has been reduced to as little as 0.82 mm. Since the outer leads do not occupy any mounting board, the projected area of the package on the board is only 65% of conventional thin packages, such as thin-small-outline packages (TSOP). The high reliability of the package comes from the lead frame geometry and the package bottom pad locations. The reliability has been tested by the resistance to infrared (IR) reflow test conditions. No cracks were observed by visual and ultrasonic inspection as well as cross-sectional examinations.

A two metal flex-based WAVE package has been developed to replace four metal rigid based PBGA package. High board-level reliability was the primary motivation for this project and an equivalent electrical performance was a challenging target. All the package dimensions were maintained the same as the reference package to allow direct replacement. As a result of the one-year-long development program, the required reliability and performance goals were met successfully. This paper mainly describes the WAVE package design for reliability and performance. Optimal lead design is the most important step for reliable package development. The WAVE geometry model (WAVEGM) was developed to analyze the lead type, lead orientation, bump height, and injection lift height. The 2-metal flex tape was chosen to replace the original 4-metal rigid substrate due to its thinner dielectric layer, lower dielectric constant and improved trace/space design capability. The electrical performance was verified by both simulation and actual measurements of a test device.

This paper presents 16-bit DSP processor and system for baseband and voiceband processing of IS-136 digital cellular telephony that is North America TDMA standard. The DSP, named MIGHTI, that is designed for mobile communication applications, has some special instructions that allow instruction pipelining for the compound operations. MIGHTI includes a low-power 16 K-word flexible port fullcustom memory. With MIGHTI, IS-136 baseband and voiceband processing that normally requires 45 MIPS in a conventional DSP, is performed in just 36 MIPS. The system developed for baseband and voiceband processing does meet the requirements of the IS-136 standard.