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Folded stacked package development.

Authors :
Young Gon Kim
Source :
52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345); 2002, p1341-1346, 6p
Publication Year :
2002

Details

Language :
English
ISBNs :
9780780374300
Database :
Complementary Index
Journal :
52nd Electronic Components & Technology Conference 2002. (Cat. No.02CH37345)
Publication Type :
Conference
Accession number :
81103434
Full Text :
https://doi.org/10.1109/ECTC.2002.1008280