1. Flip-chip interconnection EA-DFB laser module for 100-Gbit/s/λ application
- Author
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Hiroshi Yamazaki, Yasuhiko Nakanishi, Yoshifumi Muramoto, Hiroaki Sanjoh, Wataru Kobayashi, Shigeru Kanazawa, Hiromasa Tanobe, Satoshi Tsunashima, Yuta Ueda, and Hiroyuki Ishii
- Subjects
Interconnection ,Distributed feedback laser ,Materials science ,business.industry ,Amplifier ,Bandwidth (signal processing) ,Electrical engineering ,02 engineering and technology ,020210 optoelectronics & photonics ,Pulse-amplitude modulation ,Parasitic element ,0202 electrical engineering, electronic engineering, information engineering ,Wideband ,business ,Flip chip - Abstract
We have developed a flip-chip interconnection technique to solve the problem of the degradation of the modulation bandwidth of an optical transmitter due to the parasitic inductance of bonding wire. And we have fabricated an LE-EA-DFB laser module that has a 3-dB bandwidth of 59 GHz thanks to our flip-chip interconnection technique. The fabricated optical receiver, which includes a wideband electrical amplifier, has a 3-dB bandwidth of 51 GHz. Using these optical modules with a 3-dB bandwidth of more than 50 GHz, we have obtained a bit-error rate of less than 2 × 10−4, which is an error-free condition using KP4 forward error correction, under 53.2-Gbaud 4-level pulse amplitude modulation (4-PAM) operation without an equalizer even after a 2-km transmission through single-mode fiber.
- Published
- 2016