91 results on '"Wu, C.-Y."'
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2. Effect of Electrode Orientation on the Performance of Two-Stage EHD Gas Pump in a Square Channel
3. A Two-Stage EHD Gas Pump in a Square Channel with Electrodes Mounted on Two Opposite Facing Walls
4. Control system and diagnostic tools for the TPS pulsed power supplies
5. Using a full-sine septum power supply to study the top-up orbit disturbance at Taiwan light source
6. Development of a front and rear aligning control winding system
7. Analog Radio-Over-Fiber Transceivers Based on III–V-on-Silicon Photonics.
8. Cu pattern density impacts on 2.5D TSI warpage using experimental and FEM analysis
9. Cu pillar bump-on-trace (BoT) design for ultra low-k packaging
10. Bill of material and geometry on FCBGA packaging warpage impacts
11. Full low temperature microwave processed Ge CMOS achieving diffusion-less junction and Ultrathin 7.5nm Ni mono-germanide
12. Advanced flip-chip package solution for 28nm Si node and beyond
13. Optimizing airport arrival operations: A systems engineering analysis of Washington Dulles International Airport
14. Arrayed metallic micro/nano particles for localized surface plasmon resonance based on metal contact transfer lithography
15. Impact of slurry in Cu CMP (chemical mechanical polishing) on Cu topography of Through Silicon Vias (TSVs), re-distribution layers, and Cu exposure
16. Thermal stresses and deformations of Cu pillar flip chip BGA package: Analyses and measurements
17. Characteristics measurement of direct-drive brushless DC motors without using dynamometers
18. GaN nanorod-based subwavelength optical media
19. Demonstration of an Optical FIFO Multiplexer
20. 2.4/5.2 GHz Dual-WLAN Unequal-Arms Dipole Antenna with a Chip Inductor for omni-directional radiation patterns
21. Self-Assembled Two-Dimensional Block Copolymers on Pre-patterned Templates with Laser Interference Lithography
22. Experimental Study on Wideband Antenna for Wireless Communication Application
23. Moisture Ingression Effect on Stress Distributions in NCF-Bonded COG Packages
24. New control system for the 50 MeV linear accelerator of TLS
25. RF feed-forward control experiments for the 50 MeV linear accelerator at TLS
26. Sequential Color LED Backlight Driving System for LCD Panels with Area Control
27. Sequential Color LED Back-Light Driving System for LCD Panels
28. Design and Simulation of a Novel Micro-mixer with Baffles and Side-wall Injection into the Main Channel
29. Sequential Color LED Back-Light Driving System for LCD Panels.
30. Fast Transition Current-Type Burst-Mode Dimming Control for the LED Back-Light Driving System of LCD TV.
31. Development of Neutron Detector Arrays for Neutron-Induced Reaction Measurements.
32. Electrochemical deterioration of semi-conducting glaze on insulator surfaces.
33. Free radical formation in electrical trees in polyethylene.
34. A new physical timing model for bipolar NTL circuits.
35. Transient Stress Distributions in NCF-Bonded COG Packages due to Moisture Diffusion.
36. Realizations of IIR/FIR and N-path filters using a novel switched-capacitor technique.
37. The signal delay in interconnection lines considering the effects of small-geometry CMOS inverters.
38. Eigenvalue and frequency-domain analysis of the intermountain power project and the WSCC network.
39. A quasi-two-dimensional analytical model for the turn-on characteristics of polysilicon thin-film transistors.
40. An evaluation of FUROX isolation technology for VLSI/nMOSFET fabrication.
41. Design and application of pipelined dynamic CMOS ternary logic and simple ternary differential logic.
42. Delay models and speed improvement techniques for RC tree interconnections among small-geometry CMOS inverters.
43. The lambda bipolar phototransistor-analysis and applications.
44. A new internal overvoltage protection structure for the bipolar power transistor.
45. A new 2-D analytic threshold-voltage model for fully depleted short-channel SOI MOSFET's.
46. A new I-V model for short gate-length MESFET's.
47. A new grid-generation method for 2-D simulation of devices with nonplanar semiconductor surface.
48. A new methodology for two-dimensional numerical simulation of semiconductor devices.
49. High-Speed, High-Responsivity, and High-Power Performance of Near-Ballistic Uni-Traveling-Carrier Photodiode at 1.55- \mu\ m Wavelength.
50. Quantization effects in inversion layers of PMOSFETs on Si (100) substrates.
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