60 results on '"Li, C. -Y."'
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2. Effects of Crosslink Coagent on the Conductivity and Breakdown strength of XLPE
3. Crystallization Characteristics and Electrical Properties of UV Crosslinked LLDPE/EPDM Blends
4. Dielectric Strength and Space Charge of Ethylene Propylene Rubber under Different Pre-stress
5. Improving DC surface flashover property in SF6 by short time fluorination of model spacers
6. Surface charge tailoring strategy using SiC doped bowl shaped spacer
7. A bidirectional fiber-IVLLC and fiber-wireless convergence system
8. Electromagnetic near-field imaging of missing fibers in periodic fiber-reinforced laminates
9. Full-wave model and numerical study of electromagnetic plane-wave scattering by multilayered, fiber-based periodic composites
10. Optically controllable all-fiber based radio-frequency phase-shifter
11. Scattering of obliquely incident electromagnetic plane waves by composite panels involving periodic arrays of circular fibers
12. A new intracranial pressure sensor on polyimide lab-on-a-tube using exchanged polysilicon piezoresistors
13. Performance comparison of resource reservation schemes in optical packet-switched networks
14. Improved efficiency of organic photovoltaic MEH-PPV/PCBM device with CuPc-doping
15. An efficient method for analysis of ultra-wide band microstrip antennas
16. Electrical properties and thermal stability of Ta/TaN/SiCN tri-layer barrier
17. A numerically efficient transmission characteristics analysis of finite planar Frequency-Selective Surfaces embedded in stratified medium
18. Lightpath Affiliation Graph approach for wavelength assignment of lambda leasing service
19. A limiting amplifier with LOS indication for gigabit ethernet
20. A hybrid optical buffer
21. A Dependable Clustering Protocol for Survivable Underwater Sensor Networks
22. Performance Model of Deflection-Routed Multi-Slot Batch-Transfer Networks
23. Improving the Performance of Optical Burst Switching with Large Control Overhead
24. Multi-Slot Batch-Transfer Optical Packet Switch
25. Hygro-thermal Finite Element Analysis of Green Stacked Die Package
26. FEM Analysis of Moisture Distribution in Stacked Die Package
27. Optical burst switching with burst access mode passive optical networks
28. Improving the Download Time of BitTorrent-Like Systems
29. CuO Nanowire Arrays: Preparation, Characterization and Field Emission Properties
30. Intermetallic phase formation and growth kinetics at the interface between molten solder and Ni-containing under bump metallization.
31. Under bump metallizations for lead free solders.
32. Hexagonal Mesh Architecture for Large-Area Multipoint Fiber Sensor System.
33. Performance Model of Multichannel Deflection-Routed All-Optical Networks With Packet Injection Control.
34. On Wavelength-Routed Networks With Reversible Wavelength Channels.
35. Performance Analysis and Experimental Demonstration of a Novel Network Architecture Using Optical Burst Rings for Interpod Communications in Data Centers.
36. Simulation of electromigration damage in chip level interconnect lines: a grain structure based statistical approach.
37. Structural and Magnetic Study of Hot-Pressed and Hot-Deformed \Nd13.5-x\Ce_x\Fe80.4\Ga0.5\B5.6 (x=0, 0.5, 1) Prepared by Spark Plasma Sintering.
38. A damage integral approach to thermal fatigue of solder joints.
39. New experimental approaches for the characterization of compliant press-fit pins in plated-through holes.
40. A grain structure based statistical simulation of temperature and current density dependence of electromigration.
41. Parallel Transfer Optical Packet Switches.
42. The Decomposition of a Blocking Model for Connection-Oriented Networks.
43. Shape of a nonaxisymmetric liquid solder drop constrained by parallel plates.
44. Mechanical design considerations for area array solder joints.
45. A report on the first Joint Conference on Electronic Packaging Education.
46. Effect of In-Line Electron Beam Treatment on the Electrical Performance of Cu/Organic Low-k Damascene Interconnects.
47. Statistics of solder joint alignment for optoelectronic components.
48. New experimental approaches for the characterization of compliant press-fit pins in plated-through holes
49. Intermetallic phase formation and growth kinetics at the interface between molten solder and Ni-containing under bump metallization
50. A grain structure based statistical simulation of temperature and current density dependence of electromigration
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