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A damage integral approach to thermal fatigue of solder joints.
- Source :
- Proceedings, 39th Electronic Components Conference; 1989, p240-252, 13p
- Publication Year :
- 1989
Details
- Language :
- English
- Database :
- Complementary Index
- Journal :
- Proceedings, 39th Electronic Components Conference
- Publication Type :
- Conference
- Accession number :
- 92343324
- Full Text :
- https://doi.org/10.1109/ECC.1989.77757