11 results on '"Lepper, M."'
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2. Electromigration testing on via line structures with fast wafer level tests in comparison to standard package level tests
3. Testable use cases in the Abstract State Machine Language.
4. Experimental data and statistical models for bimodal EM failures.
5. A correlation between highly accelerated Wafer Level and standard Package Level electromigration tests on deep sub-micron via-line structures.
6. Using use cases in Executable Z.
7. Current and future challenges of DRAM metallization.
8. A correlation between highly accelerated Wafer Level and standard Package Level electromigration tests on deep sub-micron via-line structures
9. Experimental data and statistical models for bimodal EM failures
10. Current and future challenges of DRAM metallization
11. On the bimodal lognormal distribution of electromigration lifetimes.
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