A correlation between highly accelerated Wafer Level and standard Package Level electromigration tests on deep sub-micron via-line structures.

Details

Language :

English

ISBNs :

9780780363922

Database :

Complementary Index

Journal :

2000 IEEE International Integrated Reliability Workshop Final Report (Cat. No.00TH8515)

Publication Type :

Conference

Accession number :

80765228

Full Text :

https://doi.org/10.1109/IRWS.2000.911903