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2. TSV process solution for 3D-IC

3. TSV process solution for 3D-IC.

29. A 3.3 V-only 16 Mb DINOR flash memory

37. Row-redundancy scheme for high-density flash memory

39. A 3.3 V-only 16 Mb DINOR flash memory.

41. A novel CBi-CMOS technology by DIIP process.

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