1. Control of pressure rise in a vacuum chamber by boron nitride and copper composite coating
- Author
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Youko Konishi, Kazuhiro Yoshihara, Akira Kasahara, Tetsuo Oishi, Masahiro Tosa, and Masahiro Goto
- Subjects
Materials science ,Hydrogen ,Analytical chemistry ,chemistry.chemical_element ,Surfaces and Interfaces ,engineering.material ,Condensed Matter Physics ,Copper ,Surfaces, Coatings and Films ,Outgassing ,chemistry.chemical_compound ,Coating ,chemistry ,Boron nitride ,Cavity magnetron ,engineering ,Vacuum chamber ,Deposition (law) - Abstract
In order to control pressure rise in a vacuum chamber, a radio-frequency magnetron cosputter deposition system has been developed and boron nitride and copper composite (BN/Cu) film was coated onto the inner surface of a vacuum chamber in the shape of a cylinder. Outgassing rate of the BN/Cu coated chamber was estimated with a pressure rise method to be about 5×10−12 Pa m s−1, which was two orders lower than that of the noncoated vacuum chamber in the same shape as the BN/Cu coated chamber. Mass spectra of the residual gas in the chamber indicated that the outgassing of various gas species, such as hydrogen gas, nitrogen gas, and oxygen gas, were reduced by the BN/Cu coating. These results concluded that the BN/Cu coating could control pressure rise in a vacuum chamber.
- Published
- 2003
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