Control of pressure rise in a vacuum chamber by boron nitride and copper composite coating

In order to control pressure rise in a vacuum chamber, a radio-frequency magnetron cosputter deposition system has been developed and boron nitride and copper composite (BN/Cu) film was coated onto the inner surface of a vacuum chamber in the shape of a cylinder. Outgassing rate of the BN/Cu coated chamber was estimated with a pressure rise method to be about 5×10−12 Pa m s−1, which was two orders lower than that of the noncoated vacuum chamber in the same shape as the BN/Cu coated chamber. Mass spectra of the residual gas in the chamber indicated that the outgassing of various gas species, such as hydrogen gas, nitrogen gas, and oxygen gas, were reduced by the BN/Cu coating. These results concluded that the BN/Cu coating could control pressure rise in a vacuum chamber.