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Your search keyword '"Ryu, Hyuk Ju"' showing total 1 results
Start Over Author "Ryu, Hyuk Ju" Publisher american institute of physics, inc.
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1. Effect of thin V insertion layer into Ta film on the performance of Ta diffusion barrier in Cu metallization

Author

Kwak, Joon Seop, Baik, Hong Koo, Kim, Jong-Hoon, Lee, Sung-Man, Ryu, Hyuk Ju, and Je, Jung Ho

Subjects
Tantalum -- Research, Copper -- Research, Electrodiffusion -- Research, Physics
Abstract

The impact of a thin V insertion layer into Ta film with/without ion bombardment on Ta diffusion barrier performance in Cu metallization was studied to increase the failure temperature of Ta diffusion barrier for Cu. Results showed that the insertion of the thin V layer into the Ta film enhanced barrier characteristics substantially when the Ta/V/Ta diffusion barrier was deposited with ion bombardment.

Published
1999

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