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In the field of paper conservation and archival research, identifying the raw materials of paper is important to elucidate its history and culture. As the most basic element of the raw materials for paper, fibers have not been sufficiently investigated. In this study, we propose a nondestructive method for estimating paper fibers from macro photographs ( $4000\times3000$ pixels) captured using a digital camera. The proposed method consists of background patch (500 pixels per side) detection (BPD), wherein background regions with no text are identified; patch fiber classification (PFC), wherein background patches obtained after BPD are analyzed for fiber classification; and paper fiber estimation (PFE), wherein macro images obtained after PFC are analyzed for fiber estimation. BPD and PFC are employed to perform patch-based classification on segmented macro images, which are reconstructed during PFE to obtain the final fiber estimation results. We performed experiments using 1337 macro images (64176 patches) to evaluate the fiber estimation accuracy for kozo, mitsumata, and gampi via three-fold cross-validation. The average fiber classification accuracy for patch images was observed to be 79.1%; accordingly, the average fiber estimation accuracy for macro images was 85.8%. Experimental results indicated that PFE can be realized in a nondestructive manner on macro images of paper captured using a digital camera.

Computer scientists often publish their source code accompanying their publications, prominently using code repositories across various domains. Despite the concurrent existence of scholarly articles and their associated official code repositories, explicit references linking the two are often missing. Traditionally, identifying whether scholarly content and code repositories pertain to the same research project requires manual inspection, a time-consuming task. This paper proposes a deep learning-based algorithm for automatically matching scholarly articles with their corresponding official code repositories. Our findings indicate that the most common linking information includes the paper title and BibTeX entries, typically found in the repository’s readme document. In this study, we employed SPECTER for vector embedding of paper and repository metadata. Utilizing these embedding representations with the Light Gradient Boosting Machine (LGBM), our method achieved an F1 score of 0.94. Moreover, combining our best model with a rule-based approach improved performance by 5.31%. This study successfully delineates a connection between academic papers and associated official code repositories, minimizing reliance on explicit bibliographic information in repositories.

In the era of Industry 4.0, digital transformation has spurred the swift advancement of technologies, including intelligent predictive maintenance scheduling, prognostics and health management. The accurate prediction of remaining useful life plays a crucial role in these technologies as it extends power equipment’s safe operational duration and decreases the maintenance costs associated with unforeseen shutdowns. Also, the increased accessibility of data for monitoring system conditions has paved the way for the more immense adoption of machine learning models in prognostics and health management for power transformers. At the moment, with the ever-increasing demand for electricity, there is a corresponding increase in the degradation processes of power transformers. Transformers insulation system and more importantly, the paper insulation happens to be the principal part where the degradation is prominent. Therefore, an accurate prediction of the insulating paper condition through its degree of polymerization is required to guarantee the reliability of power transformers. In this regard, the predictions, reliability, and health monitoring of this power equipment can be actualized by modeling the degradation of transformer insulation paper through several machine learning frameworks. In this view, this review paper has been drafted not only to serve as a guide for researchers interested in the fields of transformer insulation system fault prognosis but also to offer insights into potential research directions as existing literature in modeling and evaluating transformer paper insulation is presented.

Evaluating the long-term influence of academic papers in the early stage after publication is crucial for research management and decision-making. Although the total number of citations has been considered as a valid indicator to measure the academic influence of papers, there are still some bottleneck problems in predicting future citation counts. Firstly, it remains a challenging task to select the reasonable features due to the diversity of model features. Secondly, some prediction models are overly complex and their defects may cause prediction bias or even errors. Finally, the most important thing is that very few models possess long-term predictive ability. This paper proposes a prediction model that can provide an early evaluation of the long-term citations, or the long-term influence, of academic papers. The model uses features available immediately after publication or after a certain period of time. Taking academic papers in Information Science and Library Science as our experimental subject, we train the model using three machine learning algorithms and find that the artificial neural network performs satisfactorily. Our findings may offer guidance for research management and decision-making.

This special section of the IEEE Open Journal of Circuits and Systems (OJCAS) aims to highlight a selection of papers from 2022 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS). Due to COVID-19 and travel restrictions, APCCAS 2022 was organised as a hybrid conference during 11 - 13 November 2022 in Shenzhen China. As the regional flagship conference of IEEE Circuits and Systems Society, APCCAS 2022 was driven by the theme “Building a Fully-connected AIoT World” to emphasize the CAS Society’s potential for finding multidisciplinary solutions to societal and industrial challenges. The papers in this special issue were selected from a comprehensive list of papers presented in the sessions of APCCAS 2022.

The Editorial Board of the IEEE Open Access Journal of Power and Energy (OAJPE) would like to recognize the following best papers selected from all papers published between October 1, 2020 and September 30, 2023 in OAJPE.

The article titled "Call for Papers: IEEE ETHICS-2025" discusses the theme of the 2025 IEEE ETHICS conference, which is "Emerging Technologies, Ethics, and Social Justice." The conference aims to explore various topics related to the ethical and social implications of emerging technologies, such as automation, AI ethics, social innovation, and the future of work. It also highlights the connection between emerging technologies and UN Sustainable Development Goals, as well as the importance of teaching AI ethics. The article provides information on the submission deadline for papers and poster abstracts. [Extracted from the article]

Digital Object Identifier 10.1109/ TSM. 2024.3411140Authorized licensed use limited to the terms of the applicable license agreement with IEEE. Restrictions apply. Authorized licensed use limited to the terms of the applicable license agreement with IEEE. Restrictions apply. [Extracted from the article]

Digital Object Identifier 10.1109/ TSM. 2024.3442019Authorized licensed use limited to the terms of the applicable license agreement with IEEE. Restrictions apply. Authorized licensed use limited to the terms of the applicable license agreement with IEEE. Restrictions apply. [Extracted from the article]

Welcome to Volume 4 of IEEE Journal of Microwaves! In this issue, we bring you 11 quality papers: two invited and nine regular submissions. We also celebrate six of our Outstanding Reviewers of 2023 and announce our IEEE Journal of Microwaves 2022 Best Paper prize. Our author and reader pools continue to expand and our usage counts per article published now exceed 1530. All of our 232 published articles from 2021 to 2023 now appear on Clarivate's Web of Science and we are looking forward to possibly receiving an impact factor this July. Remember to take a look at our solicitation for papers that can fit into our Microwaves in Climate Change special issue, which we intend to release before the end of 2024.

The article announces the IEEE International Symposium on Technology and Society, scheduled from September 18-20 in Puebla, Mexico, focusing on the Social Implications of Artificial Intelligence (AI), inviting submissions from academia, industry, and government to explore AI's impacts.

This research proposes an inkjet printed dual-band dual-sense circularly polarized antenna using CPW-feeding on PET substrate. The antenna is designed and optimized using ANSYS HFSS, which operates at 4.01 GHz - 5.05 GHz (22.96%) and 6.23 GHz - 7.58 GHz (19.55%) with a return loss of $0.44\lambda $ x $0.52\lambda $ x $0.002\lambda $ , where $\lambda $ is the free-space wavelength at the lowest circular polarization frequency. Measurement of the fabricated version shows good agreement with the simulated version. To the best of author’s knowledge, this proposed design is the first circularly polarized antenna integrating flexibility with dual-band and dual-sensing characteristics.

IEEE CAS Society is pleased to congratulate the following recipients of the 2024 IEEE Circuits and Systems Society Awards. The Society is especially proud and happy to honor their outstanding accomplishments and we look forward to their continued involvement and close contact with the CAS Society. [ABSTRACT FROM AUTHOR]

IEEE Circuits and Systems (CAS) Society (CASS) celebrates the 75th Anniversary of the Society in 2024. This is a major celebration for CASS after the Golden Jubilee celebration in 1999. This special Issue of the IEEE Circuits and Systems Magazine is one of many celebrations and events planned this year by and for CASS members. The Celebrations not only reflect upon the history of our Society from multiple angles but also look forward to the future. The planning for this Special Issue started in July 2023 when Gabriele Manganaro, VP-Publications of IEEE CASS, tasked the incoming Editor-in-Chief (KP) to plan for the Special Issue. A Call for White Papers was issued to the CASS membership on 20 July 2023. The authors were asked to provide historical progress over the last 25 years and point out future directions for the next 25 years. We received numerous White Papers in September 2023, and were able to invite only few authors to submit Full Papers. Authors of Invited White Papers submitted their Full papers in second half of December 2023. All reviews were completed by March 2024. Before providing an overview of the papers in this Special Issue, we begin by thanking all the authors who took the time to submit the White Papers (whether Invited or not) and the Full papers. We are very grateful to all the reviewers who provided reviews in short notice due to the time constraints to publish the Special Issue. [ABSTRACT FROM AUTHOR]

He is author of the books "Artificial Neural Networks for Modelling and Control of Non-linear Systems" (Springer) and "Least Squares Support Vector Machines" (World Scientific), co-author of the book "Cellular Neural Networks, Multi-Scroll Chaos and Synchronization" (World Scientific) and editor of the books "Nonlinear Modeling: Advanced Black-Box Techniques" (Springer), "Advances in Learning Theory: Methods, Models and Applications" (IOS Press) and "Regularization, Optimization, Kernels, and Support Vector Machines" (Chapman & Hall/CRC). [ABSTRACT FROM AUTHOR]

This issue of IEEE Vehicular Technology Magazine includes our first invited paper. In the next issues, we plan to publish a series of invited papers on selected topics of high interest that should drive and become a reference for the community. The invited papers will provide a vision on the evolution, open challenges, and trends for technologies of high-expected impact. [ABSTRACT FROM AUTHOR]

As this Special Section goes to publication, semiconductor manufacturing in the United Status, and globally, continues to expand at a seemingly torrid pace. Assisted by government funding and driven in part by artificial intelligence workloads that gobble up increasing amounts of data center computing capacity, Intel and TSMC fabs are going up in Arizona, TI and Samsung fabs are coming to Texas, and Micron has big plans in New York. Unfortunately, just like those flying cars we were once promised, AI has not yet eliminated the need for the skilled trades and engineers required to build and successfully operate a fab. As a result, workforce development has become an important part of the increasingly complex semiconductor manufacturing process: Where are the thousands of engineers the semiconductor industry needs to staff these new fabs going to come from? How can we make more students excited about science and engineering? While the Guest Editors don’t have all the answers, we are happy that ASMC contributes to the solution by actively supporting student presentations and posters and annually recognizing the best student paper of the conference. And, maybe some day, the artificial intelligence systems that semiconductor manufacturing has enabled will give us those Star Wars or Star Trek robots that can build fabs and make chips too. [ABSTRACT FROM AUTHOR]

The semiconductor industry is the core industry of the information age. As a key link in the semiconductor industry, wafer fabrication plays a key role in its development. In the testing stage of the wafer, each die of the wafer is detected and marked, and a wafer map with a certain spatial pattern can be formed. The analysis and classification of these spatial patterns can identify the cause of wafer defects, thereby improving production yield. However, as wafer size increases, line widths become smaller, etc., the probability of a mixed defect mode wafer pattern increases. Moreover, the mixed defect mode wafer map is more difficult to identify and classify than the single defect mode wafer map. Therefore, this paper proposes an improved deep convolutional neural network (DCNN) structure model for the recognition and classification of mixed defect pattern wafer maps. From the perspective of increasing the width of the DCNN, the improved network structure can avoid problems such as over-fitting and limited extraction of features due to the continuous deepening of the DCNN. The network is called Multi-Path DCNN (MP-DCNN) structure. The experimental results show that the proposed Multi-Path DCNN structure has better performance and higher classification accuracy than existing methods. [ABSTRACT FROM AUTHOR]

This document is a call for papers from the IEEE Computer Society. It mentions several articles related to software and computing, including topics such as math libraries for platform portability, performance portability in exascale computing, and productivity and innovation in the path to exascale. The document also provides brief biographies of three individuals involved in the field of computational mathematics and high-performance computing. [Extracted from the article]

The document is the table of contents for the February 2024 issue of IEEE Transactions on Semiconductor Manufacturing. It includes editorials, regular issue papers, and announcements. The regular issue papers focus on topics such as energy-aware scheduling, adaptive photolithography scheduling, integrated scheduling, gas-delivery fluid-mechanical timescales, machine learning on optical metrology, yield modeling, and more. The document also includes announcements for joint call for papers and a call for papers for other IEEE transactions. [Extracted from the article]

Recently, evolutionary computation (EC) has experienced significant advancements due to the integration of machine learning, distributed computing, and big data technologies. These developments have led to new research avenues in EC, such as distributed EC and surrogate-assisted EC. While these advancements have greatly enhanced the performance and applicability of EC, they have also raised concerns regarding privacy leakages, specifically the disclosure of optimal results and surrogate models. Consequently, the combination of evolutionary computation and privacy protection becomes an increasing necessity. However, a comprehensive exploration of privacy concerns in evolutionary computation is currently lacking, particularly in terms of identifying the object, motivation, position, and method of privacy protection. To address this gap, this paper aims to discuss three typical optimization paradigms, namely, centralized optimization, distributed optimization, and data-driven optimization, to characterize optimization modes of evolutionary computation and proposes BOOM (i.e., oBject, mOtivation, pOsition, and Method) to sort out privacy concerns related to evolutionary computation. In particular, the centralized optimization paradigm allows clients to outsource optimization problems to a centralized server and obtain optimization solutions from the server. The distributed optimization paradigm exploits the storage and computational power of distributed devices to solve optimization problems. On the other hand, the data-driven optimization paradigm utilizes historical data to address optimization problems without explicit objective functions. Within each of these paradigms, BOOM is used to characterize the object and motivation of privacy protection. Furthermore, this paper discuss the potential privacy-preserving technologies that strike a balance between optimization performance and privacy guarantees. Finally, this paper outlines several new research directions for privacy-preserving evolutionary computation. [ABSTRACT FROM AUTHOR]

Transistor random threshold voltage variations due to process fluctuations seriously affects the stability of Static Random Access Memory (SRAM). In this paper, a SRAM bit transistors threshold voltage $({Vth})$ deviation monitoring scheme and system is proposed. This scheme ingeniously achieves on-chip measurement of all transistors threshold voltages without altering compact SRAM bit array layout. Control signal strategies and Transistor ${Vth}$ Determination Circuit (TVDC) for different types of Devices Under Test (DUTs) have been proposed. The system is implemented using a 65 nm CMOS process with a core area of 0.01875mm2. Through Monte Carlo analysis, the Weighted Average (WA) difference of the proposed scheme and the direct measurement method is not more than 10mV, and the Root Mean Square Error (RMSE) difference is not more than 3mV. This system can also effectively detect the cell position of the transistor threshold voltage mismatch simulated by modifying the substrate voltage. For SRAM arrays of different scales, the method proposed in this paper has area efficiency and flexible reconfigurability. [ABSTRACT FROM AUTHOR]

Large Language Models (LLMs) such as OpenAI's ChatGPT have achieved surprisingly huge progresses in the field of Natural Language Processing (NLP). This paper aims to present an immersive introduction to LLMs from the perspective of generative models. The main components of the training process of LLMs are explained, and an example of LLMs for AI-generated contents is given. This short paper is a summary of the interactive full paper online available at IEEE Xplore, in which detailed examples interactively demonstrate the training and working mechanisms of LLMs. [ABSTRACT FROM AUTHOR]

Chemical mechanical planarization (CMP) is vital for ensuring chip fabrication uniformity at nanometer scales. The emergence of a series of phenomenological CMP process models (Stine et al., 1997; Gbondo-Tugbawa, 2002; Xie, 2007; Vasilev, 2011) suggests that the existing model upgrade approach is largely based on a change in phenomenological model assumptions, demanding deep insights into complex process mechanisms and protracted period for accuracy improvements. To tackle this issue, this paper proposes a decoupling regression strategy for model upgrades. This strategy employs a data-driven approach to enhance the coupling relationships within the model, facilitating continuous improvement of simulation accuracy based on the existing model. It is capable of achieving improvements in model accuracy even in scenarios where modelers lack insight into complex process mechanisms. We validate our method by upgrading the Density Step Height (DSH) model to the Extend-DSH model to address poor erosion predictions at the 28nm node. Comparing model predictions with silicon data reveals that the Extend-DSH model aligns better with the measured data, reducing the root mean square error from 159.31Å to 6.89Å and increasing the coefficient of determination from -0.83561 to 0.6058, showcasing the effectiveness of the proposed chip-level CMP model upgrade method grounded in the decoupling regression strategy. [ABSTRACT FROM AUTHOR]

This paper proposes a novel method for Virtual Metrology (VM) in plasma etch processes based on analysis of all time and wavelength samples of Optical Emission Spectroscopy (OES) signals. The new method flattens each OES signal into a single vector, after which Singular Value Decomposition (SVD) is performed on the matrix formed by vectors of flattened OES signals in the training dataset. Low rank SVD projections of flattened and standardized OES recordings served as inputs for Ridge Regression, Artificial Neural Network, and Random Forest based VM models. A VM study is then conducted on a dataset gathered from a major 300 mm wafer fabrication facility, showing that the use of newly proposed SVD-based OES features consistently outperformed benchmark VM model features. Additional analysis of feature importance performed based on the analytically tractable Ridge Regression VM model form demonstrated distinct time-frequency patterns of OES signal portions that were highly informative for prediction of relevant Critical Dimensions, clearly justifying the need to use the entire OES signals for VM. [ABSTRACT FROM AUTHOR]

Personality determines various human daily and working behaviours. Recently, a large number of automatic personality computing approaches have been developed to predict either the apparent or self-reported personality of the subject based on non-verbal audio-visual behaviours. However, most of them suffer from complex and dataset-specific pre-processing steps and model training tricks. In the absence of a standardized benchmark with consistent experimental settings, it is not only impossible to fairly compare the real performances of these personality computing models but also makes them difficult to be reproduced. This paper presents the first reproducible audio-visual benchmark to provide a fair and consistent evaluation of eight existing personality computing models (e.g., audio, visual and audio-visual) and seven standard deep learning models on both self-reported and apparent personality recognition tasks. Building upon a set of benchmarked models, we also investigate the impact of two previously-used long-term modelling strategies for summarising short-term/frame-level predictions on personality computing results. We comprehensively investigate all benchmarked models on two publicly available datasets, ChaLearn First Impression and UDIVA self-reported personality datasets, and conclude: (i) apparent personality traits, inferred from facial behaviours by most benchmarked deep learning models, show more reliability than self-reported ones; (ii) visual models frequently achieved superior performances than audio models on personality recognition; (iii) non-verbal behaviours contribute differently in predicting different personality traits; and (iv) our reproduced personality computing models generally achieved worse performances than their original reported results. [ABSTRACT FROM AUTHOR]

Electroencephalogram (EEG) signals have been widely studied in human emotion recognition. The majority of existing EEG emotion recognition algorithms utilize dozens or hundreds of electrodes covering the whole scalp region (denoted as full-channel EEG devices in this paper). Nowadays, more and more portable and miniature EEG devices with only a few electrodes (denoted as few-channel EEG devices in this paper) are emerging. However, emotion recognition from few-channel EEG data is challenging because the device can only capture EEG signals from a portion of the brain area. Moreover, existing full-channel algorithms cannot be directly adapted to few-channel EEG signals due to the significant inter-variation between full-channel and few-channel EEG devices. To address these challenges, we propose a novel few-channel EEG emotion recognition framework from the perspective of knowledge transfer. We leverage full-channel EEG signals to provide supplementary information, available online, for few-channel signals via a transfer learning-based model CD-EmotionNet, which consists of a base emotion model for efficient emotional feature extraction and a cross-device transfer learning strategy. This strategy helps to enhance emotion recognition performance on few-channel EEG data by utilizing knowledge learned from full-channel EEG data. To evaluate our cross-device EEG emotion transfer learning framework, we construct an emotion dataset containing paired 18-channel and 5-channel EEG signals from 25 subjects, as well as 5-channel EEG signals from 13 other subjects. Extensive experiments show that our framework outperforms state-of-the-art EEG emotion recognition methods by a large margin. [ABSTRACT FROM AUTHOR]

Research on social psychology has revealed the existence of an affective mechanism in a human group, which is the group members spread their emotions to one another, the emotions of the group members form the group emotion, and the group emotion as a powerful force shapes the group members’ emotions. Current group emotion recognition methods focus on how the emotions of the group members form the group-level emotion but rarely take into account how the group emotion feeds back to the group members instantaneously. This paper proposes a new graph convolutional network architecture to characterize this unique affective mechanism for group emotion recognition. We regard the group members as the nodes of the graph and introduce a pseudo node into the graph to represent the role of the group. This paper uses graph convolutional networks to model the emotional interactions within the group from a static image and constructs an effective emotional representation at the group level for recognition. Experiment results on three widely used datasets for group emotion recognition show that our proposed method achieved superior performance in terms of recognition accuracy compared to the state-of-the-art methods. [ABSTRACT FROM AUTHOR]

Workers with demanding jobs are at risk of experiencing mental stress, leading to decreased performance, mental illness, and disrupted sleep. To detect elevated stress levels in the workplace, studies have explored stress measurement from physiological, psychological, and behavioral perspectives. This paper reviews the assessment methods and strategies for mitigating mental stress in the workplace and provides recommendations for early detection and mitigation of mental stress. Among the modalities, Electroencephalography (EEG), Electrocardiography (ECG) and Galvanic Skin Response (GSR) were found to be the most used in assessing mental stress in the workplace. Nevertheless, these modalities are sensitive to motion artifacts and are difficult to be integrated into real work environments. To further improve stress level assessment in the workplace, multimodality integration with a reduced number of sensors such as EEG, GSR and Functional near infrared spectroscopy (fNIRS) can be utilized. This would lead to developing strategies for stress management in real-time. Furthermore, combining EEG with fNIRS would improve source localization of mental stress. To mitigate stress, we recommend developing a closed loop system that incorporates brain data acquisition systems and machine learning with physical stimulations such as audio Binaural Beats Stimulation and/or Transcranial Electric Stimulation. [ABSTRACT FROM AUTHOR]

This paper proposes an algorithm called Forward Composition Propagation (FCP) to explain the predictions of feed-forward neural networks operating on structured classification problems. In the proposed FCP algorithm, each neuron is described by a composition vector indicating the role of each problem feature in that neuron. Composition vectors are initialized using a given input instance and subsequently propagated through the whole network until reaching the output layer. The sign of each composition value indicates whether the corresponding feature excites or inhibits the neuron, while the absolute value quantifies its impact. The FCP algorithm is executed on a post-hoc basis, i.e., once the learning process is completed. Aiming to illustrate the FCP algorithm, this paper develops a case study concerning bias detection in a fairness problem in which the ground truth is known. The simulation results show that the composition values closely align with the expected behavior of protected features. The source code and supplementary material for this paper are available at https://github.com/igraugar/fcp. [ABSTRACT FROM AUTHOR]

The article is an editorial from the IEEE Transactions on Semiconductor Manufacturing journal. It congratulates Sewon Park, Kyeongwon Lee, Da-Eun Jeong, Heung-Kook Ko, and Jaeyong Lee for their paper on Bayesian nonparametric classification for incomplete data in semiconductor manufacturing. The paper proposes using the Dirichlet Process - Naive Bayes model to impute missing values and address classification problems. The article also mentions two other papers that received honorable mentions. The editorial board encourages authors to submit their papers for review and emphasizes the importance of design, modeling, and process control in semiconductor manufacturing. [Extracted from the article]

The document is the table of contents for the August 2024 issue of the IEEE Transactions on Semiconductor Manufacturing. It includes a special section on the 2023 Advanced Semiconductor Manufacturing Conference, as well as regular issue papers on topics such as wafer-scale 3D integration, chemical uniformity impacts on electrodeposition, and thermal study of polymers for microelectronics. The document also includes letters and announcements, such as calls for papers and nominations for awards. [Extracted from the article]

The 9TH AAAC Conference on Affective Computing and Intelligent Interaction 2021 was held in a virtual format in the fall of 2021. It was technically co-sponsored by the IEEE Computer Society and featured the recent work on Affective Computing. The six best papers from this conference were selected by the technical program chairs. They were invited to submit their extended version to be considered for this special section at the IEEE Transactions on Affective Computing. Each submission was reviewed by at least three expert reviewers and was evaluated in terms of overall contribution and the adequacy of the additional content to warrant a new article. This special section features five accepted submissions whose major contributions are summarized below. [ABSTRACT FROM AUTHOR]

Text-based emotion prediction is an important task in the field of affective computing. Most prior work has been restricted to predicting emotions corresponding to a few high-level emotion classes. This paper explores and experiments with various techniques for fine-grained (27 classes) emotion prediction $^\dagger$ † . In particular, 1) we present a method to incorporate multiple annotations from different raters, 2) we analyze the model's performance on fused emotion classes and with sub-sampled training data, 3) we present a method to leverage the correlations among the emotion categories, and 4) we propose a new framework for text-based fine-grained emotion prediction through emotion definition modeling. The emotion definition-based model outperforms the existing state-of-the-art for fine-grained emotion dataset GoEmotions. The approach involves a multi-task learning framework that models definitions of emotions as an auxiliary task while being trained on the primary task of emotion prediction. We model definitions using masked language modeling and class definition prediction tasks. We show that this trained model can be used for transfer learning on other benchmark datasets in emotion prediction with varying emotion label sets, domains, and sizes. The proposed models outperform the baselines on transfer learning experiments demonstrating the model's generalization capability. [ABSTRACT FROM AUTHOR]

The "IEEE Transactions on Semiconductor Manufacturing" is a journal that publishes the latest advancements in the manufacturing of microelectronic and photonic components. It aims to enhance knowledge and improve manufacturing practices in the semiconductor industry. The journal covers various topics such as process integration, manufacturing equipment performance, yield analysis, metrology, and supply chain management. Papers submitted to the journal should focus on practical engineering techniques for solving manufacturing-related problems. The journal follows a peer review process and encourages authors from low-income countries to submit their work. The standard length for regular papers is eight pages, with longer manuscripts incurring additional charges. The journal also accepts short communications in the form of letters. Authors are required to follow specific style guidelines for manuscripts and illustrations. The review process takes an average of four to six weeks, and the reviewers' comments are confidential. The journal also accepts graphical abstracts and electronic supplements. Authors are responsible for preparing a publication-quality manuscript and may seek English language editing services. Plagiarism is strictly prohibited, and manuscripts found to have plagiarized content may be penalized. All authors are required to have an Open Researcher and Contributor ID (ORCID). The journal offers both traditional and open access publication options, with associated fees. Native language author names are supported, and page charges may apply. The IEEE owns the copyright to the published material. [Extracted from the article]

The 2024 IEEE Conference on Artificial Intelligence was held from 25-27 June at the Marina Bay Sands Conference Centre in Singapore (Figure 1). IEEE CAI 2024, the second edition of this conference and exhibition, emphasised AI applications and key AI verticals impacting industrial technology and innovation. Similar to the inaugural event in June 2023 at Santa Clara, California, the 2024 edition was co-sponsored by the IEEE Computational Intelligence Society (as the lead organisation for the first two editions), IEEE Computer Society, IEEE Signal Processing Society, and IEEE Systems, Man, and Cybernetics Society. [ABSTRACT FROM AUTHOR]

Meta-heuristic algorithms, especially evolutionary algorithms, have been frequently used to find near optimal solutions to combinatorial optimization problems. The evaluation of such algorithms is often conducted through comparisons with other algorithms on a set of benchmark problems. However, even if one algorithm is the best among all those compared, it still has difficulties in determining the true quality of the solutions found because the true optima are unknown, especially in dynamic environments. It would be desirable to evaluate algorithms not only relatively through comparisons with others, but also in absolute terms by estimating their quality compared to the true global optima. Unfortunately, true global optima are normally unknown or hard to find since the problems being addressed are NP-hard. In this paper, instead of using true global optima, lower bounds are derived to carry out an objective evaluation of the solution quality. In particular, the first approach capable of deriving a lower bound for dynamic capacitated arc routing problem (DCARP) instances is proposed, and two optimization algorithms for DCARP are evaluated based on such a lower bound approach. An effective graph pruning strategy is introduced to reduce the time complexity of our proposed approach. Our experiments demonstrate that our approach provides tight lower bounds for small DCARP instances. Two optimization algorithms are evaluated on a set of DCARP instances through the derived lower bounds in our experimental studies, and the results reveal that the algorithms still have room for improvement for large complex instances. [ABSTRACT FROM AUTHOR]

This paper studies simultaneous scheduling of production and material transfer that arises in the semiconductor photolithography area. In particular, the right reticle and right job both need to be present to process the job. Jobs are transferred by a material handling system that employees a fleet of vehicles. Reticles serving as an auxiliary resource are also transferred from one place to another by a different set of vehicles. This intricate scheduling challenge, encompassing jobs, reticles, machines, and two distinct sets of vehicles, is explored here for the first time. The paper introduces a multi-stage methodology that involves relaxation, a constructive heuristic, constraint programming, and a warm-start approach to address this complex problem. [ABSTRACT FROM AUTHOR]