18 results on '"Hong Miao Ji"'
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2. Cu CMP Dishing Control for Fine Pitch Wafer-to-Wafer (W2W) Hybrid Bonding
3. Wafer-to-Wafer Hybrid Bonding Challenges for 3D IC Applications
4. Wafer Level Back to Back Hybrid Bonding for Multiple Wafer Stacking
5. Wafer Level High Density Hybrid Bonding for High Performance Computing
6. Bonding integrity enhancement in wafer to wafer fine pitch hybrid bonding by advanced numerical modelling
7. Modelling and characterization on wafer to wafer hybrid bonding technology for 3D IC packaging
8. Silicon-based microfilters for whole blood cell separation
9. DNA purification silicon chip
10. Cell loss in integrated microfluidic device
11. Microelectrothermofluidic packaging for single chip integrated viral RNA extraction and RT-PCR microdevices
12. Design of a fully-enclosed disposable bio-micro fluidic cartridge with self-contained reagents for infectious diseases diagnostic applications
13. Enhanced microfiltration devices configured with hydrodynamic trapping and a rain drop bypass filtering architecture for microbial cells detection
14. Disposable Polydimethylsioxane Package for 'Bio~Microfluidic System'
15. Microelectrothermofluidic packaging for single chip integrated viral RNA extraction and RT-PCR microdevices.
16. Design of a fully-enclosed disposable bio-micro fluidic cartridge with self-contained reagents for infectious diseases diagnostic applications.
17. Disposable Polydimethylsioxane Package for 'Bio~Microfluidic System'.
18. Enhanced microfiltration devices configured with hydrodynamic trapping and a rain drop bypass filtering architecture for microbial cells detection.
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