4 results on '"Choong-Un Kim"'
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2. Advanced Methods of Detecting Physical Damages in Packaging and BEOL Interconnects.
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3. Observation of Fatigue and Creep Ratcheting Failure in Solder Joints under Pulsed Direct Current Electromigration Testing
4. Study of Failure and Microstructural Evolution in SAC Solder Interconnects Induced by AC Electromigration Condition
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