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Your search keyword '"LINDNER, PAUL"' showing total 18 results
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18 results on '"LINDNER, PAUL"'

2. List of contributors

Author

Aalto, Timo, primary, Airaksinen, Veli-Matti, additional, Albert, Stephan Gerhard, additional, Allegato, Giorgio, additional, Amiotti, Marco, additional, Anttila, Olli, additional, Auersperg, Juergen, additional, Bonucci, Antonio, additional, Bose, Indranil Ronnie, additional, Braun, Tanja, additional, Broas, Mikael, additional, Burggraf, J., additional, Cameron, Christopher, additional, Candler, Rob N., additional, Cao, Zhen, additional, Cardoso, André, additional, Chen, Kuo-Shen, additional, Conte, Andrea, additional, Cozma, Adriana, additional, Davis, Cristina E., additional, Dempwolf, Sophia, additional, Dixit, Pradeep, additional, Dost, Michael, additional, Dragoi, Viorel, additional, Eränen, Simo, additional, Fain, Bruno, additional, Figeys, B., additional, Fischer, Andreas C., additional, Flötgen, Christoph, additional, Franssila, Sami, additional, Friedberger, Alois, additional, Fueldner, Marc, additional, Ganchenkova, Maria, additional, Gonzalez, Pilar, additional, Gosálvez, Miguel A., additional, Grimes, Michael, additional, Haapalinna, Atte, additional, Hagelin, Paul, additional, Hammond, Paul, additional, Henttinen, Kimmo, additional, Henttonen, Vesa, additional, Horsley, David, additional, Hoshi, Takeo, additional, Itoh, Satoshi, additional, Jakobsen, Henrik, additional, Jansen, R., additional, Jonsson, Kerstin, additional, Kähler, Dirk, additional, Kannojia, Harindra Kumar, additional, Kattelus, Hannu, additional, Kissinger, Gudrun, additional, Knechtel, Roy, additional, Knese, Kathrin, additional, Kolari, Kai, additional, Koskenvuori, Mika, additional, Kuisma, Heikki, additional, Kulkarni, Amit, additional, Laermer, Franz, additional, Landesberger, Christof, additional, Leinenbach, Christina, additional, LeVasseur, Michael K., additional, Li, Jue, additional, Lin, Yuyuan, additional, Lindner, Paul F., additional, Lodewijks, K., additional, Lofink, Fabian, additional, Longoni, Giorgio, additional, Luber, Sebastian Markus, additional, Mahmud-ul-hasan, M., additional, Mäkinen, Jari, additional, Mäntysalo, Matti, additional, Martin, Devin, additional, Maspero, Federico, additional, Mattila, Toni T., additional, Mauri, Luca, additional, Merz, Peter, additional, Meyer, Doug, additional, Moraja, Marco, additional, Motooka, Teruaki, additional, Müller, Gerhard, additional, Muralt, Paul, additional, Nieminen, Risto M., additional, Niklaus, Frank, additional, Oggioni, Laura, additional, Olkkonen, Juuso, additional, Österlund, Elmeri, additional, Ou, Kuang-Shun, additional, Paloheimo, Jari, additional, Pasanen, Toni P., additional, Paulasto-Kröckel, Mervi, additional, Plach, Thomas, additional, Polizzi, Jean-Philippe, additional, Pressel, Klaus, additional, Putkonen, Matti, additional, Puurunen, Riikka L., additional, Reinert, Wolfgang, additional, Rizzi, Enea, additional, Rochus, V., additional, Ross, Glenn, additional, Rottenberg, X., additional, Sainiemi, Lauri, additional, Savin, Hele, additional, Schenk, Harald, additional, Schikowski, Marc, additional, Schulze, Matthias, additional, Seema, S., additional, Severi, S., additional, Skogström, Lasse, additional, Suga, Tadatomo, additional, Sullivan, Scott, additional, Suni, Tommi, additional, Theuss, Horst, additional, Tilli, Markku, additional, Tilmans, H.A.C., additional, Tittonen, Ilkka, additional, Tofteberg, Hannah, additional, Törmä, Pekka, additional, Tuomikoski, Santeri, additional, Tyholdt, Frode, additional, Uda, Tsuyoshi, additional, Vallin, Örjan, additional, Valzasina, Carlo, additional, Veijola, Timo, additional, Viinikka, Eeva, additional, Vogel, Dietmar, additional, Vogl, Andreas, additional, Vuorinen, Vesa, additional, Westervelde, W.J., additional, Wicht, Sebastian, additional, Wieland, Robert, additional, Winkler, Bernhard, additional, Yobas, Levent, additional, Zanotti, Luca, additional, and Zubel, I., additional

Published
2020
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3. Entwicklung einer Methode zur Erkennung von instabiler Trajektorienplanung beim automatisierten Fahren

Author

Lindner, Paul Daniel and Lindner, Paul Daniel

Abstract

In der Systemarchitektur eines automatisierten Fahrzeugs existieren in der Regel die beiden Module Trajektorienplaner und Trajektorienfolgeregler, die den Fahrweg des Fahrzeugs planen und dessen Ausführung kontrollieren. Die Sicherheit des Fahrzeugs ist maßgeblich von der korrekten Funktionsweise aller Systemkomponenten abhängig. Eine der wichtigen Systemkomponenten des automatisierten Fahrzeugs ist der Trajektorienplaner. Deshalb sollten die vom Trajektorienplaner geplanten Trajektorien auf sichere Durchführbarkeit hin untersucht werden, bevor sie zum Regler und damit auch an die Aktorik des Fahrzeugs weitergegeben werden. Dieses Ziel wird durch die Entwicklung eines Safety-Check-Moduls verfolgt, das verschiedene Aufgaben hat. Eine dieser Aufgaben ist die Methode zur Erkennung von instabilem Verhalten des Trajektorienplaners, die in dieser Arbeit entwickelt wird und die geplanten Trajektorien auf ihre Stabilität hin untersucht. Um dieses Ziel zu erreichen, werden zunächst Anforderungen an eine solche Methodik definiert sowie Gründe für auftretende Instabilitäten gesucht, die bei der Entwicklung der Methodik helfen. Instabiles Trajektorienplanerverhalten drückt sich in großen Abweichungen aufeinanderfolgend geplanter Trajektorien aus. Der Ansatz dieser Methodik basiert dafür auf der Auswertung der geplanten Trajektorien, bzw. der Trajektorienpunkte. Es werden dafür jeweils zeitlich aufeinanderfolgend geplante Trajektorien anhand ihrer Trajektorienpunkte miteinander verglichen. Dabei werden die Abweichungen der Punkte hinsichtlich der Größen longitudinale Abweichung, laterale Abweichung und Änderung des Kurswinkels ermittelt. Diese Abweichungen werden statistisch ausgewertet und mit Schwellenwerten verglichen. Dabei werden zunächst Einzelabweichungen für jeden Punkt des betrachteten Trajektorienvergleichs berechnet, bevor diese dann über die gesamte Trajektorie sowie eine Grundgesamtheit gemittelt betrachtet werden. Es werden zwei Konzepte entwickelt, die auf den gle

Published
2022

5. List of Contributors

Author

Aalto, Timo, primary, Airaksinen, Veli-Matti, additional, Amiotti, Marco, additional, Anttila, Olli, additional, Bonucci, Antonio, additional, Brudziński, K., additional, Candler, Rob N., additional, Cao, Zhen, additional, Chen, Kuo-Shen, additional, Conte, Andrea, additional, Davis, Cristina E., additional, Dixit, Pradeep, additional, Dragoi, Viorel, additional, Eränen, Simo, additional, Fischer, Andreas C., additional, Franssila, Sami, additional, Friedberger, Alois, additional, Ganchenkova, Maria, additional, Gonzalez, Pilar, additional, Gosálvez, Miguel A., additional, Gronicz, J., additional, Haapalinna, Atte, additional, Hagelin, Paul M., additional, Hammond, Paul, additional, Henttinen, Kimmo, additional, Horsley, David, additional, Inoue, Akihisa, additional, Jakobsen, Henrik, additional, Jonsson, Kerstin, additional, Kähler, Dirk, additional, Kattelus, Hannu, additional, Knechtel, Roy, additional, Knese, Kathrin, additional, Kolari, Kai, additional, Koskenvuori, Mika, additional, Kuisma, Heikki, additional, Kulkarni, Amit, additional, Laermer, Franz, additional, Lapadatu, Adriana Cozma, additional, Leinenbach, Christina, additional, LeVasseur, Michael K., additional, Li, Jue, additional, Lindner, Paul, additional, Lindroos, Veikki, additional, Lofink, Fabian, additional, Longoni, Giorgio, additional, Mäkinen, Jari, additional, Mäntysalo, Matti, additional, Martin, Devin, additional, Mattila, Toni, additional, Mauri, Luca, additional, Merz, Peter, additional, Meyer, Doug, additional, Moraja, Marco, additional, Motooka, Teruaki, additional, Müller, Gerhard, additional, Muralt, Paul, additional, Nagao, S., additional, Nieminen, Risto M., additional, Niklaus, Frank, additional, Nowak, R., additional, Olkkonen, Juuso, additional, Ou, Kuang-Shun, additional, Paloheimo, Jari, additional, Paulasto-Kröckel, Mervi, additional, Pohjonen, Helena, additional, Pressel, Klaus, additional, Putkonen, Matti, additional, Puurunen, Riikka L., additional, Reinert, Wolfgang, additional, Rizzi, Enea, additional, Rottenberg, Xavier, additional, Ryhänen, Tapani, additional, Sainiemi, Lauri, additional, Savin, Hele, additional, Sharma, Parmanand, additional, Sullivan, Scott, additional, Suni, Tommi, additional, Theuss, Horst, additional, Tilli, Markku, additional, Tittonen, Ilkka, additional, Tofteberg, Hannah, additional, Törmä, Pekka, additional, Tuomikoski, Santeri, additional, Tyholdt, Frode, additional, Uda, Tsuyoshi, additional, Vallin, Örjan, additional, Veijola, Timo, additional, Viinikka, Eeva, additional, Vogl, Andreas, additional, Vuorinen, Vesa, additional, Yobas, Levent, additional, Zachariasz, P., additional, and Zubel, I., additional

Published
2015
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10. Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology

Author

Kroehnert, Steffen, primary, Campos, Jose, additional, Cardoso, André, additional, Pires, Mariana, additional, O'Toole, Eoin, additional, Pinto, Raquel, additional, Jolivet, Emilie, additional, Uhrmann, Thomas, additional, Brandl, Elizabeth, additional, Burggraf, Jürgen, additional, Wiesbauer, Harald, additional, Bravin, Julian, additional, Wimplinger, Markus, additional, and Lindner, Paul, additional

Published
2016
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14. (Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration

Author

Plach, Thomas, Rebhan, Bernhard, Dragoi, Viorel, Wagenleitner, Thomas, Wimplinger, Markus, and Lindner, Paul

Abstract

This paper aims to present an overview of the existing wafer-to-wafer alignment technology. The development of optical alignment methods will be reviewed with respect to applications requirements evolution over time. An overview of the different factors contributing to the overall misalignment budget and how they are controlled now, or will be in the future, in order to meet the stringent requirements will be presented with examples.

Published
2018

15. List of Contributors

Author

Aalto, Timo, Airaksinen, Veli-Matti, Amiotti, Marco, Anttila, Olli, Bonucci, Antonio, Brudziński, K., Candler, Rob N., Cao, Zhen, Chen, Kuo-Shen, Conte, Andrea, Davis, Cristina E., Dixit, Pradeep, Dragoi, Viorel, Eränen, Simo, Fischer, Andreas C., Franssila, Sami, Friedberger, Alois, Ganchenkova, Maria, Gonzalez, Pilar, Gosálvez, Miguel A., Gronicz, J., Haapalinna, Atte, Hagelin, Paul M., Hammond, Paul, Henttinen, Kimmo, Horsley, David, Inoue, Akihisa, Jakobsen, Henrik, Jonsson, Kerstin, Kähler, Dirk, Kattelus, Hannu, Knechtel, Roy, Knese, Kathrin, Kolari, Kai, Koskenvuori, Mika, Kuisma, Heikki, Kulkarni, Amit, Laermer, Franz, Lapadatu, Adriana Cozma, Leinenbach, Christina, LeVasseur, Michael K., Li, Jue, Lindner, Paul, Lindroos, Veikki, Lofink, Fabian, Longoni, Giorgio, Mäkinen, Jari, Mäntysalo, Matti, Martin, Devin, Mattila, Toni, Mauri, Luca, Merz, Peter, Meyer, Doug, Moraja, Marco, Motooka, Teruaki, Müller, Gerhard, Muralt, Paul, Nagao, S., Nieminen, Risto M., Niklaus, Frank, Nowak, R., Olkkonen, Juuso, Ou, Kuang-Shun, Paloheimo, Jari, Paulasto-Kröckel, Mervi, Pohjonen, Helena, Pressel, Klaus, Putkonen, Matti, Puurunen, Riikka L., Reinert, Wolfgang, Rizzi, Enea, Rottenberg, Xavier, Ryhänen, Tapani, Sainiemi, Lauri, Savin, Hele, Sharma, Parmanand, Sullivan, Scott, Suni, Tommi, Theuss, Horst, Tilli, Markku, Tittonen, Ilkka, Tofteberg, Hannah, Törmä, Pekka, Tuomikoski, Santeri, Tyholdt, Frode, Uda, Tsuyoshi, Vallin, Örjan, Veijola, Timo, Viinikka, Eeva, Vogl, Andreas, Vuorinen, Vesa, Yobas, Levent, Zachariasz, P., and Zubel, I.

Published
2016
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16. Fusion bonding an enabling technology for "More Moore" scaling.

Author

Lindner, Paul

Subjects
*BONDING of semiconductors, *LOGIC devices, *SEMICONDUCTOR wafer bonding, *SYSTEMS on a chip testing, *COST effectiveness
Abstract

The article offers the author's insights on the role of fusion bonding in boosting scaling for logic device performance. He says that based from the International Roadmap for Devices and Systems (IRDS), parasitic scaling is expected to be driving the logic device performance which requires new transistor architectures like gate all around (GAA) transistors. He explains how fusion and hybrid wafer bonding can cater three-dimensional System-on-Chip (3D SoC) applications, saving cost and power.

Published
2019

17. Wafer bonding for high performance MEMS, power devices, and RF components.

Author

PABO, ERIC F., FLÖTGEN, CHRISTOPH, REBHAN, BERNHARD, LINDNER, PAUL, and UHRMANN, THOMAS

Subjects
*SEMICONDUCTOR wafer bonding, *MICROELECTROMECHANICAL systems, *COMPLEMENTARY metal oxide semiconductors, *TAPE-automated bonding, *SODIUM, *BONDING of semiconductors
Abstract

The article offers information on the wafer bonding use for microelectromechanical systems (MEMS) devices and technology. Topics discussed include the importance of sodium (Na) in anodic bonding use to combine complementary metal-oxide semiconductor (CMOS) and MEMS devices, the advantage of aluminium (Al)- aluminium (Al) thermo-compression wafer bonding process, and the significant effects of process temperature on the bonding process.

Published
2015

18. 2015 outlook: Tech trends and drivers.

Author

GHANAYEM, STEVEN, TRAFAS, BRIAN, GOTTSCHO, RICHARD, LINDNER, PAUL, FUJIMURA, AKI, PLISINSKI, MIKE, HAGER, JACK, and WILSON, KATE

Subjects
*SEMICONDUCTOR industry, *INVESTMENTS, *MERGERS & acquisitions
Abstract

The article offers insights of several individuals on the trend of semiconductor industry. Individuals mentioned include Steve Ghanayem, vice president of equipment maker Applied Materials, Brian Trafas, chief marketing officer of KLA-Tencor Corp., and Richard Gottscho, executive vice president of research firm Lam Research. Topics include the importance of investments, the benefits of consolidation among semiconductor companies, and the relevance of variability for semiconductor processes.

Published
2015

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