1. Detecting PCB Assembly defects using infrared thermal signatures
- Author
-
A. Boyer, Amaud Viard, Nabil El Belghiti Alaoui, P. Tounsi, Équipe Énergie et Systèmes Embarqués (LAAS-ESE), Laboratoire d'analyse et d'architecture des systèmes (LAAS), Université Toulouse - Jean Jaurès (UT2J)-Université Toulouse 1 Capitole (UT1), Université Fédérale Toulouse Midi-Pyrénées-Université Fédérale Toulouse Midi-Pyrénées-Centre National de la Recherche Scientifique (CNRS)-Université Toulouse III - Paul Sabatier (UT3), Université Fédérale Toulouse Midi-Pyrénées-Institut National des Sciences Appliquées - Toulouse (INSA Toulouse), Institut National des Sciences Appliquées (INSA)-Institut National des Sciences Appliquées (INSA)-Institut National Polytechnique (Toulouse) (Toulouse INP), Université Fédérale Toulouse Midi-Pyrénées-Université Toulouse - Jean Jaurès (UT2J)-Université Toulouse 1 Capitole (UT1), Université Fédérale Toulouse Midi-Pyrénées, Équipe Intégration de Systèmes de Gestion de l'Énergie (LAAS-ISGE), ACTIA Automotive, Université Toulouse Capitole (UT Capitole), Université de Toulouse (UT)-Université de Toulouse (UT)-Institut National des Sciences Appliquées - Toulouse (INSA Toulouse), Institut National des Sciences Appliquées (INSA)-Université de Toulouse (UT)-Institut National des Sciences Appliquées (INSA)-Université Toulouse - Jean Jaurès (UT2J), Université de Toulouse (UT)-Université Toulouse III - Paul Sabatier (UT3), Université de Toulouse (UT)-Centre National de la Recherche Scientifique (CNRS)-Institut National Polytechnique (Toulouse) (Toulouse INP), Université de Toulouse (UT)-Université Toulouse Capitole (UT Capitole), and Université de Toulouse (UT)
- Subjects
Mean squared error ,Computer science ,defect detection ,thermal signatures ,02 engineering and technology ,Integrated circuit ,Hardware_PERFORMANCEANDRELIABILITY ,Fault detection and isolation ,020202 computer hardware & architecture ,law.invention ,[SPI.TRON]Engineering Sciences [physics]/Electronics ,Capacitor ,Printed circuit board ,law ,Proof of concept ,Component (UML) ,PCBA testing ,0202 electrical engineering, electronic engineering, information engineering ,Electronic engineering ,020201 artificial intelligence & image processing ,mean squared error ,Polarity (mutual inductance) - Abstract
International audience; A Printed Circuit Board assembly (PCBA) testing approach using infrared thermal signatures is presented. The concept of thermal signature for PCBAs is introduced. Based on this concept, the testing method is able to:-detect assembly defects such as presence, polarity, value and solder (shorts and opens) and in some cases component health state-classify the components mounted on the PCB into a number of classes (e.g.-fault free(reliable), functional (less reliable), faulty). According to the thermal signature of each component on the PCBA, PCBAs can be also classified in the same number of classes. In this article a special focus is put on capacitor defects especially capacitor value defects. Therefore, they will be the main components tested. The fault detection indicator used in this proof of concept is a statistical mean squared error measure (MSE).
- Published
- 2019