Back to Search
Start Over
Detecting PCB Assembly defects using infrared thermal signatures
- Source :
- 2019 MIXDES-26th International Conference "Mixed Design of Integrated Circuits and Systems", 27th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES2019), 27th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES2019), Jun 2019, Wroclaw, Poland. ⟨10.23919/MIXDES.2019.8787089⟩, MIXDES
- Publication Year :
- 2019
- Publisher :
- HAL CCSD, 2019.
-
Abstract
- International audience; A Printed Circuit Board assembly (PCBA) testing approach using infrared thermal signatures is presented. The concept of thermal signature for PCBAs is introduced. Based on this concept, the testing method is able to:-detect assembly defects such as presence, polarity, value and solder (shorts and opens) and in some cases component health state-classify the components mounted on the PCB into a number of classes (e.g.-fault free(reliable), functional (less reliable), faulty). According to the thermal signature of each component on the PCBA, PCBAs can be also classified in the same number of classes. In this article a special focus is put on capacitor defects especially capacitor value defects. Therefore, they will be the main components tested. The fault detection indicator used in this proof of concept is a statistical mean squared error measure (MSE).
- Subjects :
- Mean squared error
Computer science
defect detection
thermal signatures
02 engineering and technology
Integrated circuit
Hardware_PERFORMANCEANDRELIABILITY
Fault detection and isolation
020202 computer hardware & architecture
law.invention
[SPI.TRON]Engineering Sciences [physics]/Electronics
Capacitor
Printed circuit board
law
Proof of concept
Component (UML)
PCBA testing
0202 electrical engineering, electronic engineering, information engineering
Electronic engineering
020201 artificial intelligence & image processing
mean squared error
Polarity (mutual inductance)
Subjects
Details
- Language :
- English
- Database :
- OpenAIRE
- Journal :
- 2019 MIXDES-26th International Conference "Mixed Design of Integrated Circuits and Systems", 27th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES2019), 27th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES2019), Jun 2019, Wroclaw, Poland. ⟨10.23919/MIXDES.2019.8787089⟩, MIXDES
- Accession number :
- edsair.doi.dedup.....61c3cbf7dde7a07c7ee1b132d44f5392